公开(公告)号：US3202755A

公开(公告)日：1965-08-24

申请号：US13505561

申请日：1961-08-30

Applicant: GEN PRECISION INC

Inventor： ANTON OSWALD

IPC: H05K3/32

CPC classification number: H01R12/58 ,  H05K3/328 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/10962

公开(公告)号：US3185952A

公开(公告)日：1965-05-25

申请号：US52054455

申请日：1955-07-07

Applicant: AMP INC

Inventor： POTTER ROSSITER R ,  ROBERT ULLMAN ,  FULLER GLENWOOD A

IPC: B23K1/19 ,  B23P19/04 ,  H01R4/02 ,  H01R12/55 ,  H01R13/115 ,  H01R43/02 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K3/3468 ,  H05K2201/10401 ,  H05K2201/1081 ,  H05K2201/10916

公开(公告)号：US2937358A

公开(公告)日：1960-05-17

申请号：US50202155

申请日：1955-04-18

Applicant: GEN ELECTRIC

Inventor： BULGER DONALD W

IPC: H05K1/03 ,  H05K3/28

CPC classification number: H01R12/58 ,  H05K1/0306 ,  H05K3/281 ,  H05K2201/0108 ,  H05K2201/09436 ,  H05K2201/10401 ,  H05K2201/10575 ,  H05K2201/10598

公开(公告)号：US12013584B2

公开(公告)日：2024-06-18

申请号：US17540692

申请日：2021-12-02

Applicant: TE Connectivity Solutions GmbH

Inventor： Benjamin Michael Grab ,  Henry Burton Piper, III ,  Soren Grinderslev

IPC: H04B10/00 ,  G02B6/42 ,  H05K1/18

CPC classification number: G02B6/428 ,  G02B6/4292 ,  H05K1/18 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2201/10356 ,  H05K2201/10401

Abstract: A contact comprising: (a) a contact housing, said contact housing being narrower than a cavity of a connector such that said contact housing is laterally movable within said cavity; (b) an optical interface for receiving a ferrule of a mating connector contact; (c) optoelectrical circuitry optically connected to said optical interface, wherein said optical interface and said optoelectrical circuitry are held rigidly in relation to each other within said contact housing; and (d) an electrical interface electrically connected to said optoelectrical circuitry and configured for electrical connection to a circuit board, wherein said electrical interface comprising at least a flexible cable to provide compliance between said optoelectrical circuitry and said circuit board.

公开(公告)号：US11806141B2

公开(公告)日：2023-11-07

申请号：US17942684

申请日：2022-09-12

Applicant: ABBOTT DIABETES CARE INC.

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel Mason Curry

IPC: H05K5/00 ,  A61B5/1486 ,  A61B5/00 ,  A61B5/145 ,  A61B5/1468 ,  A61B5/1473 ,  H05K3/32 ,  H01L23/00 ,  H05K3/36

CPC classification number: A61B5/1486 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/4839 ,  A61B5/6848 ,  H05K3/325 ,  A61B2562/164 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

公开(公告)号：US20180160547A1

公开(公告)日：2018-06-07

申请号：US15806385

申请日：2017-11-08

Applicant: FUJITSU LIMITED

Inventor： Norikazu Ozaki ,  Hiroshi MIYAO ,  Satoru HASEGAWA

IPC: H05K3/40 ,  H05K3/00 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/4046 ,  H05K3/4084 ,  H05K3/42 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2203/0278

Abstract: A first through hole is formed in a base, a conductive layer covering an inner wall side surface of the first through hole is formed, a columnar electric conductor having a Vickers hardness of a value in a range of 30 Hv or more and 400 Hv or less is inserted into the first through hole formed with the conductive layer, pressure is applied in a vertical direction to the columnar electric conductor, and a second through hole is formed in the columnar electric conductor.

公开(公告)号：US20170241624A1

公开(公告)日：2017-08-24

申请号：US15437921

申请日：2017-02-21

Applicant: VALEO VISION

Inventor： Olivier BADIA

IPC: F21V19/00 ,  H05K1/14 ,  H05K1/18 ,  F21S8/10 ,  F21V23/02

CPC classification number: F21V19/003 ,  F21S45/47 ,  F21S45/49 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10401

Abstract: The invention proposes a luminous module comprising a flexible printed circuit board. The connection to ground of the electronic circuit accommodated by the printed circuit board is produced without adding fastening parts dedicated to this role. Compared to known prior-art techniques, the invention allows a luminous module to be produced comprising fewer constituent parts and occupying a smaller volume.

公开(公告)号：US20170019988A1

公开(公告)日：2017-01-19

申请号：US15208444

申请日：2016-07-12

Applicant: MC10, Inc.

Inventor： Bryan McGrane ,  Milan Raj ,  PingHung Wei ,  Briana Morey ,  Roozbeh Ghaffari ,  Monica Lin ,  Jeffrey Model ,  Xianyan Wang ,  Bryan Keen ,  Stephen Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K1/09 ,  H05K1/03 ,  A61B5/0496 ,  A61B5/00 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/0488 ,  H05K1/18 ,  H05K3/18

CPC classification number: A61B5/0496 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/0408 ,  A61B5/0476 ,  A61B5/0478 ,  A61B5/0488 ,  A61B5/0492 ,  A61B5/053 ,  A61B5/6801 ,  A61B2562/164 ,  A61B2562/166 ,  H05K1/0209 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: A wearable device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically or thermally connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical and/or thermal energy to the contact pads of the flexible printed circuit board.

Abstract translation: 可佩戴装置包括柔性印刷电路板和一个或多个导电加强件。 导电加强件包括导电表面，其可以电连接或热连接到柔性印刷电路板上的接触焊盘。 可穿戴装置还可包括粘合剂层或包封层。 粘合剂层和包封层可以包括被非导电部分包围的导电部分。 导电部分可以与导电加强件对准，并且一起将电和/或热能传递到柔性印刷电路板的接触垫。

公开(公告)号：US20160273564A1

公开(公告)日：2016-09-22

申请号：US14664391

申请日：2015-03-20

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： James Michael BONICATTO ,  Andrew William HILL ,  Nathan Michael THOME ,  John GODFREY ,  Robyn MCLAUGHLIN ,  Santosh SHETTY

IPC: F16B5/00 ,  H05K7/14 ,  H05K13/00

CPC classification number: F16B5/00 ,  H01R12/7047 ,  H05K3/30 ,  H05K7/1407 ,  H05K7/1417 ,  H05K2201/10303 ,  H05K2201/1031 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/2036 ,  Y02P70/611

Abstract: Examples of the disclosure enable a printed circuit board to be coupled to a chassis. In some examples, a coupling mechanism includes a first body including a head portion and a shaft portion that has an inner surface defining a channel. The coupling mechanism includes a second body including a head portion and a shaft portion. At least a part of the second body shaft portion is positionable within the channel. An outer surface of the second body shaft portion is sized to enable the second body shaft portion to expand radially or move laterally within the channel when the part of the second shaft portion is positioned within the channel. Examples of the disclosure enable the printed circuit board to be coupled to a chassis in low-profile, reduced-stress manner.

Abstract translation: 本公开的示例使得印刷电路板能够耦合到底架。 在一些示例中，联接机构包括包括头部和具有限定通道的内表面的轴部的第一主体。 联接机构包括包括头部和轴部的第二主体。 第二主体轴部分的至少一部分可定位在通道内。 第二主体轴部分的外表面的尺寸设定成使得当第二轴部分的部分位于通道内时，第二主体轴部能够在通道内径向扩张或横向移动。 本公开的实例使得印刷电路板能够以低调，低应力的方式耦合到底盘。

公开(公告)号：US20160262668A1

公开(公告)日：2016-09-15

申请号：US15047476

申请日：2016-02-18

Applicant: Abbott Diabetes Care Inc.

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

IPC: A61B5/1486 ,  A61B5/145

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.