公开(公告)号：US08007871B2

公开(公告)日：2011-08-30

申请号：US12161301

申请日：2007-01-26

Applicant: Piu Francis Man ,  Salvatore J. Pace

Inventor： Piu Francis Man ,  Salvatore J. Pace

IPC: B05D1/04 ,  B05D3/06 ,  C23C16/00

CPC classification number: H01J49/165 ,  B05D1/60 ,  B05D3/06 ,  B05D3/145 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B2202/02 ,  C01B2202/06 ,  C23C4/123 ,  H01J37/08 ,  H01J37/3178 ,  H01J2237/057 ,  H01J2237/0815 ,  H01J2237/31701 ,  H01J2237/31737

Abstract: Disclosed herein are apparatus and methods for selectively depositing molecular ions on nanoscale substrates such as carbon nanotube arrays using electrospray ionization.

Abstract translation: 本文公开了用于使用电喷雾电离在纳米尺度基底例如碳纳米管阵列上选择性沉积分子离子的装置和方法。

公开(公告)号：US20110207300A1

公开(公告)日：2011-08-25

申请号：US13072593

申请日：2011-03-25

Applicant: Thomas Meredith BROWN ,  Henning SIRRINGHAUS ,  John Devin MACKENZIE

Inventor： Thomas Meredith BROWN ,  Henning SIRRINGHAUS ,  John Devin MACKENZIE

IPC: H01L21/20 ,  H01L21/28

CPC classification number: B05D5/12 ,  B05D1/322 ,  B05D3/145 ,  B82Y10/00 ,  B82Y30/00 ,  H01L51/0016 ,  H01L51/0017 ,  H01L51/0021 ,  H01L51/0022 ,  H01L51/0023 ,  H01L51/0036 ,  H01L51/0037 ,  H01L51/0039 ,  H01L51/0043 ,  H01L51/052 ,  H01L51/0525 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/057 ,  H01L51/105 ,  H01L2251/105 ,  Y10S977/887

Abstract: A method for forming an electronic device having a multilayer structure, comprising: embossing a surface of a substrate so as to depress first and second regions of the substrate relative to at least a third region of the substrate; depositing conductive or semiconductive material from solution onto the first and second regions of the substrate so as to form a first electrode on the first region and a second electrode on the second region, wherein the electrodes are electrically insulated from each other by the third region.

Abstract translation: 一种形成具有多层结构的电子器件的方法，包括：对衬底的表面进行压花，以相对于衬底的至少第三区域压下衬底的第一和第二区域; 将溶液中的导电或半导体材料沉积到衬底的第一和第二区域上，以在第一区域上形成第一电极，在第二区域上形成第二电极，其中电极通过第三区域彼此电绝缘。

公开(公告)号：US20100285319A1

公开(公告)日：2010-11-11

申请号：US12811762

申请日：2009-01-07

Applicant: Soonjong Kwak ,  Jae Ho Jun

Inventor： Soonjong Kwak ,  Jae Ho Jun

IPC: B32B27/00 ,  H05H1/00 ,  B05D3/06

CPC classification number: C08J7/123 ,  B05D3/145 ,  B05D7/04 ,  B05D2252/10 ,  Y10T428/31504

Abstract: The present invention relates to a method of fabricating a transparent gas barrier film by using plasma surface treatment and a transparent gas barrier film fabricated according to such method which has an organic/inorganic gradient interface structure at the interface between an organic/inorganic hybrid layer and an inorganic layer. Since the method of the present invention is capable of fabricating a gas barrier film by plasma surface treatment instead of deposition under high vacuum, it can mass-produce a transparent gas barrier film with excellent gas barrier properties in an economical and simple manner. Further, since the transparent gas barrier film fabricated according to the method of the present invention shows excellent gas barrier properties and is free of crack formation and layer-peeling phenomenon, it can be effectively used in the manufacture of a variety of display panels.

Abstract translation: 本发明涉及通过使用等离子体表面处理制造透明阻气膜的方法和根据这种方法制造的透明阻气膜，该有机/无机梯度界面结构在有机/无机杂化层与 无机层。 由于本发明的方法能够通过等离子体表面处理来制造阻气膜而不是在高真空下沉积，所以可以以经济和简单的方式批量生产具有优异阻气性的透明阻气膜。 此外，由于根据本发明的方法制造的透明阻气膜显示出优异的阻气性，并且没有裂纹形成和层剥离现象，因此可以有效地用于制造各种显示面板。

公开(公告)号：US20100261017A1

公开(公告)日：2010-10-14

申请号：US12759054

申请日：2010-04-13

Applicant: Tomoyuki KIKUCHI

Inventor： Tomoyuki KIKUCHI

IPC: C23C16/44 ,  C23C16/513 ,  B32B9/04

CPC classification number: C23C16/345 ,  B05D1/60 ,  B05D3/145 ,  B05D7/04 ,  B05D7/52 ,  B05D2252/02 ,  B05D2350/63 ,  C08J7/045 ,  C08J2367/02 ,  C23C16/545 ,  C23C16/56 ,  C23C28/00 ,  C23C28/04 ,  Y10T428/31504

Abstract: A method of producing a gas barrier laminate comprises: the steps of forming an inorganic compound layer on a substrate by vapor-phase film deposition, applying surface roughening treatment to a surface of the inorganic compound layer, and subsequently forming an organic compound layer on the roughened surface of the inorganic compound layer by flash evaporation.

Abstract translation: 制造阻气性层叠体的方法包括以下步骤：通过气相膜沉积在基板上形成无机化合物层，对无机化合物层的表面进行表面粗糙化处理，随后在其上形成有机化合物层 通过闪蒸蒸发无机化合物层的粗糙表面。

公开(公告)号：US07794786B2

公开(公告)日：2010-09-14

申请号：US10556076

申请日：2004-05-10

Applicant: Shahab Jahromi

Inventor： Shahab Jahromi

IPC: C23C16/02 ,  B32B15/08 ,  B32B27/32 ,  B32B27/36

CPC classification number: C08J7/065 ,  B05D1/60 ,  B05D3/044 ,  B05D3/0446 ,  B05D3/046 ,  B05D3/062 ,  B05D3/063 ,  B05D3/067 ,  B05D3/068 ,  B05D3/142 ,  B05D3/144 ,  B05D3/145 ,  B05D2201/02 ,  C23C14/022 ,  C23C14/12 ,  Y10T428/31504 ,  Y10T428/31605 ,  Y10T428/31667 ,  Y10T428/31678 ,  Y10T428/31938

Abstract: The invention relates to a process for the preparation of a composite material, said composite material comprising a substrate and a layer on the substrate, comprising a vapor-depositing step in which a compound comprising a triazine compound is deposited on the substrate at a pressure below 1000 Pa, whereby the layer is formed, wherein during the vapor-depositing step the temperature of the substrate lies between −15 ° C. and +125 ° C. The invention further relates to a composite material, obtainable by the process as disclosed.

Abstract translation: 本发明涉及一种制备复合材料的方法，所述复合材料包括基底和基底上的层，包括气相沉积步骤，其中包含三嗪化合物的化合物以低于下述压力沉积在基底上 1000Pa，由此形成层，其中在气相沉积步骤期间，基底的温度在-15℃和+ 125℃之间。本发明还涉及通过所公开的方法获得的复合材料。

公开(公告)号：US07674504B2

公开(公告)日：2010-03-09

申请号：US12018729

申请日：2008-01-23

Applicant: Vinay G. Sakhrani ,  Joel L. Williams ,  Charles Tomasino ,  Paul M. Vernon, Jr.

Inventor： Vinay G. Sakhrani ,  Joel L. Williams ,  Charles Tomasino ,  Paul M. Vernon, Jr.

IPC: H05H1/00

CPC classification number: C08J7/047 ,  A61M2005/3131 ,  A61M2205/0222 ,  A61M2205/0238 ,  B05D3/144 ,  B05D3/145 ,  B05D5/08 ,  B05D5/083 ,  B05D7/02 ,  B05D7/22 ,  B29C59/14 ,  B29C59/142 ,  B29C59/16 ,  B29C59/165 ,  B29C2035/085 ,  B29C2035/0877 ,  B29C2059/145 ,  B29L2009/005 ,  B29L2031/7544 ,  C08J7/18 ,  C10M107/38 ,  C10M107/50 ,  C10M2213/043 ,  C10M2213/0606 ,  C10M2229/0415 ,  C10N2250/00 ,  C10N2270/00 ,  F16N15/00 ,  Y10T428/1393 ,  Y10T428/31504 ,  Y10T428/31544 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31938

Abstract: A method for preparing one or more lubricated surfaces of an article to reduce the break-out force and sliding frictional force. A lubricant is applied to one or more surfaces, and the lubricant-coated surface is treated by exposing the surface to an energy source, wherein the energy source is an ionizing gas plasma at about atmospheric pressure, gamma radiation, or electron beam radiation. One or more of the surfaces may be exposed to the ionizing gas plasma at about atmospheric pressure prior to application of the lubricant. Another aspect of the invention is articles produced using one or more methods of the invention.

Abstract translation: 一种用于制备物品的一个或多个润滑表面以减少断裂力和滑动摩擦力的方法。 将润滑剂施加到一个或多个表面，并且通过将表面暴露于能量源来处理润滑剂涂覆的表面，其中能量源是在大气压，伽马辐射或电子束辐射下的电离气体等离子体。 在施加润滑剂之前，一个或多个表面可能在大气压下暴露于电离气体等离子体。 本发明的另一方面是使用本发明的一种或多种方法制备的制品。

公开(公告)号：US07482207B2

公开(公告)日：2009-01-27

申请号：US10538870

申请日：2003-12-12

Applicant: Thomas Meredith Brown ,  Henning Sirringhaus

Inventor： Thomas Meredith Brown ,  Henning Sirringhaus

IPC: H01L21/00

CPC classification number: B05D5/12 ,  B05D1/322 ,  B05D3/145 ,  B82Y10/00 ,  B82Y30/00 ,  H01L51/0016 ,  H01L51/0017 ,  H01L51/0021 ,  H01L51/0022 ,  H01L51/0023 ,  H01L51/0036 ,  H01L51/0037 ,  H01L51/0039 ,  H01L51/0043 ,  H01L51/052 ,  H01L51/0525 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/057 ,  H01L51/105 ,  H01L2251/105 ,  Y10S977/887

Abstract: A method for forming an electronic device in a multilayer structure comprising the steps of: defining a topographic profile in a laterally extending first layer; depositing at least one non-planarizing layer on top of the first layer such that the topographic profile of the surface of the or each non-planarizing layer conforms to that of the laterally extending first layer; and depositing a pattern of at least one additional layer onto the top-most non-planarizing layer, such that the lateral location of the additional layer is defined by the shape of the topographic profile of the non-planarizing layer, and whereby the additional layer is laterally aligned with the topographic profile in the first layer.

Abstract translation: 一种用于在多层结构中形成电子器件的方法，包括以下步骤：在横向延伸的第一层中限定形貌轮廓; 在所述第一层的顶部上沉积至少一个非平坦化层，使得所述或每个非平坦化层的表面的形貌轮廓符合所述横向延伸的第一层的表面; 以及将至少一个附加层的图案沉积到最上面的非平坦化层上，使得附加层的横向位置由非平坦化层的形貌构成，并由此附加层 与第一层中的形貌轮廓横向对齐。

公开(公告)号：US07449414B2

公开(公告)日：2008-11-11

申请号：US11499678

申请日：2006-08-07

Applicant: Peter L. G. Ventzek ,  Lee Chen ,  Akira Koshiishi ,  Ikuo Sawada

Inventor： Peter L. G. Ventzek ,  Lee Chen ,  Akira Koshiishi ,  Ikuo Sawada

IPC: H01L21/302

CPC classification number: H05H1/44 ,  B05D1/32 ,  B05D1/62 ,  B05D3/145 ,  H01J37/32027 ,  H01J37/32036 ,  H01J37/32082 ,  H01L21/0273 ,  H01L21/0337 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/76802

Abstract: A method of pre-treating a mask layer prior to etching an underlying thin film is described. A thin film, such as a dielectric film, is etched using plasma that is enhanced with a ballistic electron beam. In order to reduce the loss of pattern definition, such as line edge roughness effects, the mask layer is treated with a hydrocarbon chemistry or hydrofluorocarbon chemistry or fluorocarbon chemistry or combination of two or more thereof prior to proceeding with the etching process.

Abstract translation: 描述了在蚀刻下面的薄膜之前对掩模层进行预处理的方法。 使用通过弹道电子束增强的等离子体蚀刻诸如电介质膜的薄膜。 为了减少图案定义的损失，例如线边缘粗糙度效应，在进行蚀刻工艺之前，用烃化学或氢氟烃化学或碳氟化合物或其两种或更多种的组合处理掩模层。

公开(公告)号：US20080254304A1

公开(公告)日：2008-10-16

申请号：US12138521

申请日：2008-06-13

Applicant: Vinay G. Sakhrani ,  Joel L. Williams ,  Charles Tomasino ,  Paul M. Vernon

Inventor： Vinay G. Sakhrani ,  Joel L. Williams ,  Charles Tomasino ,  Paul M. Vernon

IPC: B32B9/04

CPC classification number: C08J7/047 ,  A61M2005/3131 ,  A61M2205/0222 ,  A61M2205/0238 ,  B05D3/144 ,  B05D3/145 ,  B05D5/08 ,  B05D5/083 ,  B05D7/02 ,  B05D7/22 ,  B29C59/14 ,  B29C59/142 ,  B29C59/16 ,  B29C59/165 ,  B29C2035/085 ,  B29C2035/0877 ,  B29C2059/145 ,  B29L2009/005 ,  B29L2031/7544 ,  C08J7/18 ,  C10M107/38 ,  C10M107/50 ,  C10M2213/043 ,  C10M2213/0606 ,  C10M2229/0415 ,  C10N2250/00 ,  C10N2270/00 ,  F16N15/00 ,  Y10T428/1393 ,  Y10T428/31504 ,  Y10T428/31544 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31938

Abstract: A method for preparing one or more lubricated surfaces of an article to reduce the break-out force and sliding frictional force. A lubricant is applied to one or more surfaces, and the lubricant-coated surface is treated by exposing the surface to an energy source, wherein the energy source is an ionizing gas plasma at about atmospheric pressure, gamma radiation, or electron beam radiation. One or more of the surfaces may be exposed to the ionizing gas plasma at about atmospheric pressure prior to application of the lubricant. Another aspect of the invention is articles produced using one or more methods of the invention.

公开(公告)号：US07259109B2

公开(公告)日：2007-08-21

申请号：US10947016

申请日：2004-09-22

Applicant: Robert P. Meagley

Inventor： Robert P. Meagley

IPC: H01L21/469 ,  C23C4/00

CPC classification number: B05B5/0255 ,  B05D1/04 ,  B05D3/067 ,  B05D3/068 ,  B05D3/145 ,  C23C4/123 ,  C23C26/00

Abstract: A method of forming a thin film on a substrate to fabricate a microelectronic device, a microelectronic device comprising a thin film deposited according to the method, and a system comprising the microelectronic device. The thin film may include on of a low k thin film, a thin film comprising photoresist, and a sacrificial polymer. The method comprises dispersing a precursor preparation into a spray of charged droplets through subjecting the liquid precursor preparation to electrostatic forces; directing the charged droplets to move toward the substrate; and allowing the charged droplets to generate a beam of gas-phase ions as the charged droplets move toward the substrate. The method further includes directing the gas-phase ions to impinge upon the substrate to deposit the thin film thereon to yield a deposited thin film on the substrate.

Abstract translation: 一种在衬底上形成薄膜以制造微电子器件的方法，包括根据该方法沉积的薄膜的微电子器件以及包括该微电子器件的系统。 薄膜可以包括低k薄膜，包含光致抗蚀剂的薄膜和牺牲聚合物。 该方法包括通过使液体前体制剂经受静电力将前体制剂分散在带电液滴的喷雾中; 引导带电液滴朝向衬底移动; 并且随着带电液滴向衬底移动，允许带电液滴产生气相离子束。 该方法还包括引导气相离子冲击衬底以在其上沉积薄膜以在衬底上产生沉积的薄膜。