公开(公告)号：US3629185A

公开(公告)日：1971-12-21

申请号：US3629185D

申请日：1969-10-17

Applicant: KOLLMORGEN CORP

Inventor： SCHNEBLE FREDERICK W JR ,  LEECH EDWARD JOHN ,  MCCORMACK JOHN FRANCIS

IPC: B01J31/08 ,  B01J31/30 ,  B01J47/00 ,  C08K3/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42 ,  C08G51/04

CPC classification number: B01J31/30 ,  B01J31/08 ,  B01J47/016 ,  C08K3/013 ,  C23C18/1608 ,  H05K1/0373 ,  H05K3/28 ,  H05K3/422 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/09436 ,  C08L67/06

Abstract: THERE ARE PROVIDED MOLDING COMPOSITIONS COMPRISING PARTICLES OF RESIN HAVING INCORPORATED THEREWITH FILLERS CATALYTIC TO THE DEPOSITION OF ELECTROLESS METALS. THE CATALYTIC FILLERS ARE MADE BY REPLACING THE CATIONS IN PARTICULATE BASE EXCHANGEABLE MATERIALS WITH A CATION OF A METAL SELECTED FROM GROUPS 1 B AND 8 OF THE PERIODIC TABLE OF ELEMENTS. ARTICLES MOLDED FROM THE COMPOSITIONS AND THE WALLS OF HOLES DRILLED IN THEM ARE METALLIZED ON BEING IMMERSED IN ELECTROLESS METAL DEPOSITION BATHS.

公开(公告)号：US3600330A

公开(公告)日：1971-08-17

申请号：US3600330D

申请日：1967-01-03

Applicant: PHOTOCIRCUITS DIVISION OF KOLI

Inventor： SCHNEBLE FREDERICK W JR ,  LEECH EDWARD J ,  POLICHETTE JOSEPH

IPC: B01J37/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  D06Q1/04 ,  H01B3/30 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  C23C3/00

CPC classification number: H05K3/427 ,  B01J37/00 ,  C23C18/1608 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/40 ,  D06Q1/04 ,  H01B3/30 ,  H05K1/0373 ,  H05K3/108 ,  H05K3/181 ,  H05K3/422 ,  H05K3/428 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/122

Abstract: THERE ARE PROVIDED COMPOSITIONS TO RENDER INSULTING SUBSTRATES CATALYTIC TO ELECTROLESS METAL DEPOSITION COMPRISING MATERIALS, E.G., SOLID AGENTS, HAVING DEPOSITED THEREON A CATIONIC WETTING AGENT IN COMBINATION WITH AN ELEMENTAL FORM OF A METAL FROM GROUPS I-B AND VIII OF THE PERIODIC TABLE OF ELEMENTS, INCLUDING MIXTURES OF SUCH METALS.

公开(公告)号：US3347724A

公开(公告)日：1967-10-17

申请号：US39062364

申请日：1964-08-19

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE JR FREDERICK W ,  JOSEPH POLICHETTE ,  LEECH EDWARD J

IPC: C23C18/16 ,  H05K1/00 ,  H05K1/03 ,  H05K3/18

CPC classification number: H05K3/184 ,  C23C18/1605 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0236 ,  Y10T428/2944 ,  Y10T442/3407

公开(公告)号：US3322881A

公开(公告)日：1967-05-30

申请号：US39064664

申请日：1964-08-19

Applicant: SCHNEBLE JR FREDERICK W ,  JOSEPH POLICHETTE ,  LEECH EDWARD J

Inventor： SCHNEBLE JR FREDERICK W ,  JOSEPH POLICHETTE ,  LEECH EDWARD J

IPC: H05K3/18 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/429 ,  H05K3/182 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0236 ,  H05K2201/092 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K2203/1476

公开(公告)号：US09944768B2

公开(公告)日：2018-04-17

申请号：US14227271

申请日：2014-03-27

Applicant: SABIC Global Technologies B.V.

Inventor： Yunan Cheng ,  Xiaofeng Yu ,  Yuxian An

IPC: H01B3/42 ,  H01B3/30 ,  H01B3/47 ,  C08K3/22 ,  C08K3/04 ,  C08K3/34 ,  C08K3/40 ,  C08L69/00 ,  H05K1/03 ,  H05K3/18 ,  C08K3/32 ,  C08K7/14 ,  C08K3/24

CPC classification number: C08K3/22 ,  C08K3/04 ,  C08K3/24 ,  C08K3/32 ,  C08K3/34 ,  C08K7/14 ,  C08K2003/2251 ,  C08K2003/328 ,  C08L69/00 ,  H01B3/305 ,  H01B3/426 ,  H01B3/47 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08L83/10

Abstract: The present disclosure relates to a polymer composition. The disclosed composition comprises a polycarbonate polymer, a laser direct structuring additive capable of being activated by electromagnetic radiation and thereby forming elemental metal nuclei, reinforcing filler, and a laser direct structuring synergist. Also disclosed is a method for making the disclosed polymer composition and an article of manufacture comprising the disclosed polymer composition.

公开(公告)号：US09859193B2

公开(公告)日：2018-01-02

申请号：US15600793

申请日：2017-05-22

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu ,  Wei-Jen Lai

IPC: H01L23/495 ,  H01L23/60

CPC classification number: H01L23/49503 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/053 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/60 ,  H01L24/17 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.

公开(公告)号：US09801282B2

公开(公告)日：2017-10-24

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H05K3/18 ,  H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

公开(公告)号：US20170236614A1

公开(公告)日：2017-08-17

申请号：US15504268

申请日：2015-09-17

Applicant: LG CHEM, LTD.

Inventor： Shin Hee JUN ,  Dae Ki LEE ,  Se Hui SOHN ,  Han Nah JEONG ,  Cheol-Hee PARK ,  Chee-Sung PARK ,  Jae Hyun KIM ,  Ha Na LEE

IPC: H01B5/14 ,  H05K3/10 ,  H05K1/03 ,  C23C18/40 ,  C08L69/00 ,  C08J7/12 ,  C23C18/16 ,  C23C18/20 ,  H01B1/22 ,  C08K3/32

CPC classification number: H01B5/14 ,  C08J7/123 ,  C08J2369/00 ,  C08J2483/04 ,  C08K3/32 ,  C08K2003/328 ,  C08L69/00 ,  C08L2203/20 ,  C08L2205/06 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/405 ,  H01B1/026 ,  H01B1/22 ,  H05K1/0313 ,  H05K1/0373 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.

公开(公告)号：US09674967B2

公开(公告)日：2017-06-06

申请号：US15184426

申请日：2016-06-16

Applicant: SIERRA CIRCUITS, INC.

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/38 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K3/426 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/387 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

公开(公告)号：US09646854B2

公开(公告)日：2017-05-09

申请号：US14229777

申请日：2014-03-28

Applicant: Intel Corporation

Inventor： Yonggang Yong Li ,  Aritra Dhar ,  Dilan Seneviratne ,  Jon M. Williams

IPC: H01L21/768 ,  H01L23/522 ,  H01L21/48 ,  H05K3/10 ,  H05K3/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  H01L23/498 ,  H05K3/00 ,  H05K3/04 ,  C23C18/38

CPC classification number: H01L21/4857 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  H01L21/288 ,  H01L21/486 ,  H01L21/4864 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0032 ,  H05K3/045 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/072 ,  H05K2203/107

Abstract: Embodiments describe the selective electroless plating of dielectric layers. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. An electroless plating process is used to deposit metal only on the patterned surfaces of the dielectric layer. According to an embodiment, the dielectric layer is doped with an activator precursor. Laser assisted local activation is performed on the patterned surfaces of the dielectric layer in order to selectively form a seed layer only on the patterned surfaces of the dielectric layer by reducing the activator precursor to an oxidation state of zero. According to an additional embodiment, a seed layer is selectively formed on the patterned surfaces of the dielectric layer with a colloidal or ionic seeding solution.