公开(公告)号：US09820394B2

公开(公告)日：2017-11-14

申请号：US15288755

申请日：2016-10-07

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hiromichi Suzuki ,  Masataka Tokoro

IPC: H05K5/00 ,  H05K9/00 ,  H01R12/71 ,  H05K1/02 ,  H05K5/02 ,  G06F1/16 ,  H01R12/52

CPC classification number: H05K5/0069 ,  G06F1/16 ,  G06F1/1626 ,  G06F1/1658 ,  H01R12/52 ,  H01R12/71 ,  H05K1/0215 ,  H05K5/0204 ,  H05K5/0247 ,  H05K9/0015 ,  H05K2201/0311 ,  H05K2201/10409

Abstract: According to one embodiment, a circuit board attachment structure comprise a housing to which the circuit board is attached, a mount provided on the housing and provided outside a portion of the housing where the circuit board is attached, a holding piece extending from the mount to and on the circuit board and sandwiching the circuit board with the housing, and a conductive gasket contacting the circuit board. The gasket is provided at least in a region where the circuit board is sandwiched between the holding piece and the housing, and the gasket is pressed between the holding piece and the housing, and the circuit board and the housing is electrically connected to each other via the pressed gasket.

公开(公告)号：US09801269B1

公开(公告)日：2017-10-24

申请号：US15150834

申请日：2016-05-10

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01P3/08 ,  H01P3/06

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

公开(公告)号：US09787039B2

公开(公告)日：2017-10-10

申请号：US15299215

申请日：2016-10-20

Applicant: Hubbell Incorporated

Inventor： Shadi Alex AbuGhazaleh ,  Joseph Edgar Dupuis ,  Christopher Wayne Gribble ,  Naved Shah Khan ,  Douglas Paul O'Connor

IPC: H01R24/64 ,  H01R13/405 ,  H01R13/66 ,  H05K3/32 ,  H01R13/6466 ,  H01R24/62 ,  H01R43/20 ,  H01R13/24 ,  H01R107/00 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01R24/64 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/405 ,  H01R13/6466 ,  H01R13/6625 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H01R43/205 ,  H01R2107/00 ,  H05K1/18 ,  H05K1/182 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10424 ,  H05K2201/10446 ,  Y02P70/611 ,  Y10S439/941 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151

Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.

公开(公告)号：US09697953B2

公开(公告)日：2017-07-04

申请号：US14667575

申请日：2015-03-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Seok Kyoon Woo ,  Kyoung Jin Jun ,  So Yeon Song ,  Soon Ju Lee

IPC: H01G2/20 ,  H01G4/06 ,  H01G4/228 ,  H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/224 ,  H01G4/012 ,  H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor (MLCC) including first and second external electrodes disposed to be spaced apart from one another on a mounting surface thereof; and first and second terminal electrodes including upper horizontal portions disposed on lower surfaces of the first and second external electrodes, lower horizontal portions disposed to be spaced apart from the upper horizontal portions downwardly, and curved vertical portions connecting one ends of the upper horizontal portions and one ends of the lower horizontal portions, having “⊂” and “⊃” shapes, and disposed on the mounting surface of the MLCC in a facing manner.

公开(公告)号：US20170040760A1

公开(公告)日：2017-02-09

申请号：US15299215

申请日：2016-10-20

Applicant: Hubbell Incorporated

Inventor： Shadi Alex AbuGhazaleh ,  Joseph Edgar Dupuis ,  Christopher Wayne Gribble ,  Naved Shah Khan ,  Douglas Paul O'Connor

IPC: H01R24/64 ,  H01R13/405 ,  H05K1/18 ,  H01R43/20 ,  H05K3/32 ,  H01R13/24 ,  H01R13/66

CPC classification number: H01R24/64 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/405 ,  H01R13/6466 ,  H01R13/6625 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H01R43/205 ,  H01R2107/00 ,  H05K1/18 ,  H05K1/182 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10424 ,  H05K2201/10446 ,  Y02P70/611 ,  Y10S439/941 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151

Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.

Abstract translation: 适于接收配合插头的电连接器利用能够在其PCB固定的基座部分上弯曲的低轮廓的插座端子触头，其基本上平行于PCB。 每个末端接触件的远端连接部分或中间过渡部分中的任何弯曲是渐进的并且形成钝角，从而最小化应力集中。 触点优选地布置在两个相互面对的和交叉的四行触点中。 在一个实施例中，端子触头通过接触支架锚固到PCB，该接触支架将两个间隔开的锚固位置限制每个端子触头的基部，从而允许基部在其间弯曲。 在另一个实施例中，端子触点的基部嵌入至少一个弹性体构件中，该弹性构件安装到PCB上。

公开(公告)号：US09565759B2

公开(公告)日：2017-02-07

申请号：US14700850

申请日：2015-04-30

Applicant: GLOBALFOUNDRIES INC.

Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

IPC: H05K1/11 ,  H01R43/16 ,  H01R12/70 ,  H01R12/71 ,  H05K3/40 ,  H01R13/24 ,  H05K3/32

CPC classification number: H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

Abstract: A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

Abstract translation: 用于微电子器件的接触结构和组件包括螺旋形的第一和第二导电触头。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

公开(公告)号：US09562675B2

公开(公告)日：2017-02-07

申请号：US14308649

申请日：2014-06-18

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： Yasoob Ahmed ,  Steven Sievers

IPC: F21V19/00 ,  F21V23/00 ,  F21V23/06 ,  H05K3/30 ,  F21W111/00 ,  H05K1/18 ,  H05K3/34 ,  F21Y101/00

CPC classification number: F21V19/002 ,  F21V23/005 ,  F21V23/06 ,  F21W2111/00 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/181 ,  H05K3/301 ,  H05K3/308 ,  H05K3/3421 ,  H05K2201/0311 ,  H05K2201/10106 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: A holder structure for mounting light indicators on printed circuit boards using surface mount technology at a position elevated above the surface of the board is provided with a body member including a top wall, a bottom wall, opposed sidewalls, a front wall, and a rear wall, all being formed integrally together. Two spaced-apart recesses are formed and aligned vertically in the front wall of the body member terminating in respective first and second interior wall portions. The first interior wall portion has openings formed on diametrically opposed sides of a vertical partition and lying in a horizontal plane parallel to the bottom wall. The second interior wall portion has openings formed on diametrically opposed sides of a transverse partition and lying in a plane which is rotated a predetermined number of degrees from a vertical plane perpendicular to the bottom wall.

Abstract translation: 一种用于在印刷电路板上使用表面贴装技术将光指示器安装在高于板表面的位置的支架结构设置有主体部件，主体部件包括顶壁，底壁，相对的侧壁，前壁和后部 墙壁，整体形成在一起。 形成两个间隔开的凹部并且在主体构件的前壁中垂直排列，终止于相应的第一和第二内壁部分。 第一内壁部分具有形成在垂直隔板的直径相对的侧面上并且位于平行于底壁的水平面中的开口。 第二内壁部分具有形成在横向隔板的直径相对侧上的开口，并且位于从垂直于底壁的垂直平面旋转预定数量的平面中。

公开(公告)号：US20160126015A1

公开(公告)日：2016-05-05

申请号：US14877765

申请日：2015-10-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK ,  Seok Kyoon WOO ,  Soon Ju LEE ,  So Yeon SONG

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/012 ,  H01G4/12 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic component including a multilayer ceramic capacitor including first and second external electrodes disposed on a mounting surface of a ceramic body; and first and second terminal electrodes each including an upper horizontal part disposed on a lower surface of the respective external electrode, a lower horizontal part disposed below the upper horizontal part and spaced apart from the upper horizontal part, and a connecting part connecting the upper horizontal part and the lower horizontal part, the connecting part having a plurality of openings alternately facing opposite end surfaces of the ceramic body.

Abstract translation: 一种多层陶瓷部件，包括：多层陶瓷电容器，包括设置在陶瓷体的安装表面上的第一和第二外部电极; 以及第一和第二端子电极，每个包括设置在各个外部电极的下表面上的上部水平部分，设置在上部水平部分下方并与上部水平部分间隔开的下部水平部分，以及连接上部水平部分 部分和下部水平部分，连接部分具有交替地面对陶瓷体的相对端表面的多个开口。

公开(公告)号：US09306302B2

公开(公告)日：2016-04-05

申请号：US14391359

申请日：2012-04-30

Applicant: Kevin B. Leigh ,  George D. Megason

Inventor： Kevin B. Leigh ,  George D. Megason

IPC: H01R12/00 ,  H01R12/71 ,  H01R12/70 ,  H05K7/10 ,  H05K3/32

CPC classification number: H01R12/7076 ,  H01R12/712 ,  H01R12/714 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/0311 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: A socket (130) employs a substrate (310) including a conductive network. As array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a roused first contact (136′) that the conductive network routes horizontally in or on the substrate (310).

Abstract translation: 插座（130）采用包括导电网络的基板（310）。 由于第一触点（136）的阵列位于基板（310）的顶表面上并被布置成接合集成电路（110）。 第二触点阵列（138）位于基板（310）的底表面上并且布置成接合电路板（120）。 所述导电网络将所述第一触头（136）分别电连接到所述第二触点（138），并且所述第一触点（136）包括所述导电网络在所述基板（310）中或所述基板（310）上水平地引导的激活的第一触点（136'）， 。

公开(公告)号：US20160050743A1

公开(公告)日：2016-02-18

申请号：US14804748

申请日：2015-07-21

Applicant: FUJITSU LIMITED

Inventor： Jun TAGUCHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

Abstract translation: 电路板包括能够保持印刷电路板的板构件，包括电子部件的印刷电路板和设置在电子部件上的冷却部件，印刷电路板和电子部件位于板部件和 冷却构件; 以及设置到板构件并允许与印刷电路板电连接的电路。