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公开(公告)号：US5045249A
公开(公告)日：1991-09-03
申请号：US150485
申请日：1988-02-09
Applicant: Sungho Jin , John J. Mottine, Jr. , Robert L. Opila, Jr. , Richard C. Sherwood , Thomas H. Tiefel , William C. Vesperman
Inventor： Sungho Jin , John J. Mottine, Jr. , Robert L. Opila, Jr. , Richard C. Sherwood , Thomas H. Tiefel , William C. Vesperman
CPC classification number: H05K3/323 , H01R12/714 , H01R4/04 , H01L2224/83851 , H01L2224/83902 , H01R12/52 , H01R13/2414 , H05K2201/0314 , H05K2201/083 , H05K2201/09945 , H05K2203/104 , H05K2203/1189
Abstract: Electrical interconnections are made by means of a layer or sheet medium comprising chains of magnetically aligned, electrically conducting particles in a nonconducting matrix material. End particles of chains protrude from a surface of the medium, thereby enhancing electrical contact properties of the medium. The medium can be used for temporary as well as permanent connections; in the latter case the use of a nonconductive adhesive material is convenient for physical attachment to contacts on both sides of the medium.
Abstract translation: 电互连通过在非导电基体材料中包含磁性排列的导电颗粒链的层或片介质制成。 链的末端颗粒从介质的表面突出，从而增强介质的电接触性能。 该介质可用于临时和永久连接; 在后一种情况下，使用非导电粘合剂材料便于物理连接到介质两侧的触点。
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公开(公告)号：US4664309A
公开(公告)日：1987-05-12
申请号：US509684
申请日：1983-06-30
Applicant: Leslie J. Allen , Gabe Cherian , Stephen H. Diaz
Inventor： Leslie J. Allen , Gabe Cherian , Stephen H. Diaz
IPC: H01R9/16 , B23K3/06 , B23K35/02 , H05K3/32 , H05K3/34 , H05K3/40 , H05K13/04 , H01L21/58 , B23K1/12
CPC classification number: B23K35/0222 , B23K3/06 , H05K1/0271 , H05K13/0465 , H05K3/325 , H05K3/3436 , H01L2924/00013 , H05K2201/0215 , H05K2201/0314 , H05K2201/0373 , H05K2201/1028 , H05K2201/10378 , H05K2201/10424 , H05K2201/10727 , H05K2201/10946 , H05K2203/0415 , H05K2203/0769 , H05K3/3421 , H05K3/3442 , H05K3/4015 , Y02P70/613
Abstract: A chip mounting device which is hereinafter also referred to as an "interconnection preform placement device", includes a retaining member having a predefined pattern of holes in which are positioned preforms of joint-forming material such as solder. Each preform is of a predefined configuration and has a height or length greater than is cross-sectional dimension. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. A method of forming resilient interconnections comprises placing the interconnection preform placement device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms.
Abstract translation: 在下文中也称为“互连预成型件放置装置”的芯片安装装置包括具有预定图案的孔的保持构件，其中定位有诸如焊料的接合形成材料的预成型件。 每个预成型件具有预定的构造并且具有大于横截面尺寸的高度或长度。 预成型件在互连或焊接工艺之后保持其一般构造，以形成能够承受应力，应变和疲劳的弹性接头。 形成弹性互连的方法包括将互连预制件放置装置放置在导电元件的平行图案之间，诸如电子部件和电路板上的导电焊盘，并且实现导电元件与预成型件的结合。
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公开(公告)号：US4508402A
公开(公告)日：1985-04-02
申请号：US349925
申请日：1982-02-18
Applicant: Tadashi Tomino , Masayuki Higuchi
Inventor： Tadashi Tomino , Masayuki Higuchi
CPC classification number: H05K1/189 , H05K3/326 , H05K7/1023 , H01L2924/0002 , H05K2201/0314 , H05K2201/10053 , H05K2201/10136 , H05K2201/10393 , H05K2201/10446 , H05K2201/10492 , H05K2201/10659 , H05K2201/10689 , H05K2203/167 , H05K3/365
Abstract: There is disclosed an electronic assembly for use in calculators, watches and so forth. The assembly includes an integrated circuit element having a plurality of positioning apertures at the periphery thereof and a circuit board (preferably, a flexible circuit film) having a plurality of terminals to be electrically connected to the respective terminals of the integrated circuit element and also having a plurality of positioning apertures. The assembly further includes an upper casing and a lower casing one of which has a plurality of positioning projections to be received within the positioning apertures in the circuit element and a plurality of positioning projections to be received within the positioning apertures in the circuit board, for determining relative position of the integrated circuit element and the circuit board with respect to the casing. Preferably, the integrated circuit element has a plurality of signal terminals extending from one side and one or more power terminals extending from a second side thereof and in a direction different from that of the signal terminals, with the latter in direct contact with battery terminals when the assembly is completed. The package of the integrated circuit element may be of a polygonal configuration including a pentagon or more and the whole of the integrated circuit element including the power terminals shaped substantially into a rectangle.
Abstract translation: 公开了一种用于计算器，手表等的电子组件。 该组件包括集成电路元件，该集成电路元件在其周边具有多个定位孔，以及具有多个端子的电路板（优选为柔性电路膜），该多个端子电连接到集成电路元件的各个端子，并且还具有 多个定位孔。 该组件还包括上壳体和下壳体，其中一个具有多个定位突起以被容纳在电路元件中的定位孔内，并且多个定位突起被容纳在电路板的定位孔内，用于 确定集成电路元件和电路板相对于壳体的相对位置。 优选地，集成电路元件具有从一侧延伸的多个信号端子和从其第二侧延伸的多个功率端子，并且在与信号端子的方向不同的方向上延伸，其中后者与电池端子直接接触， 装配完成。 集成电路元件的封装可以是包括五边形或更多的多边形结构，并且整个集成电路元件包括大致成矩形的功率端子。
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公开(公告)号：US4400234A
公开(公告)日：1983-08-23
申请号：US368795
申请日：1982-04-15
Applicant: William E. Berg
Inventor： William E. Berg
CPC classification number: H05K7/1061 , H01H1/24 , H05K3/325 , H05K1/0237 , H05K2201/0314 , H05K2201/10393 , H05K2201/10681 , Y10T29/49217 , Y10T29/4922
Abstract: This disclosure describes an electrical connector for joining microcircuit or microcircuit modules, such as leadless integrated or hybrid circuit carriers to utilization means, such as printed or etched circuit boards or similar means. The electrical contacts through which the microcircuit and utilization means are connected are formed and etched in place on an elastomeric material, precisely located; the material acting as a restoring force to maintain connection. The connector when used in a system maintains transmission line mediums in a single environment.
Abstract translation: 本公开描述了一种用于将诸如无引线集成或混合电路载体的微电路或微电路模块连接到诸如印刷或蚀刻电路板或类似装置的利用装置的电连接器。 形成微电路和利用装置连接的电触点，并精确定位在弹性体材料上的适当位置; 该材料作为恢复力维持连接。 连接器在系统中使用时，可以在一个环境中维护传输线介质。
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65.发明授权公开(公告)号：US11894629B2
公开(公告)日：2024-02-06
申请号：US17195738
申请日：2021-03-09
Applicant: TE Connectivity Services GmbH , TYCO ELECTRONICS JAPAN G.K.
Inventor： John Joseph Consoli , Chad William Morgan , Megan Hoarfrost Beers , Christopher William Blackburn , Nathan Lincoln Tracy , Jennifer Love , Clarence Leon Yu , Shinichi Hashimoto , Hiroshi Shirai
CPC classification number: H01R13/2407 , H01R12/52 , H01R12/714 , H01R13/11 , H01R13/2414 , H01R13/6599 , H05K1/095 , H01R12/712 , H05K2201/03 , H05K2201/0314 , H05K2201/0329
Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.
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Patent Agency Ranking
公开(公告)号：US11856690B2
公开(公告)日：2023-12-26
申请号：US17386807
申请日：2021-07-28
Inventor： Carl J. Thrasher , Christopher E. Tabor , Zachary J. Farrell , Nicholas J. Morris
CPC classification number: H05K1/0283 , H05K1/09 , H05K3/10 , H05K3/22 , H05K2201/0245 , H05K2201/0314 , H05K2203/0783 , H05K2203/1105 , H05K2203/1131
Abstract: The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.
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公开(公告)号：US20180263136A1
公开(公告)日：2018-09-13
申请号：US15456490
申请日：2017-03-11
Applicant: Microsoft Technology Licensing, LLC
Inventor： Rohit Koppal , Chandra Subba
CPC classification number: H05K1/181 , F16B5/0241 , F16B5/025 , F16B5/065 , F16B33/006 , H05K2201/0129 , H05K2201/0133 , H05K2201/015 , H05K2201/0314 , H05K2201/10189
Abstract: Devices having flexible or rotatable connectors between two components of an electronic device are described herein. The device may include a support structure and a plurality of connectors affixed to a surface of the support structure. The connectors are configured to connect the support structure with a component of an electronic device. Additionally, when the surface of the support structure is non-planar, each connector is configured to bend or rotate to maintain the connected component within a same plane.
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公开(公告)号：US20180188771A1
公开(公告)日：2018-07-05
申请号：US15398608
申请日：2017-01-04
Applicant: Intel Corporation
Inventor： Nadine L. Dabby , Sasha N. Oster , Aleksandar Aleksov , Braxton Lathrop , Racquel L. Fygenson
CPC classification number: G06F1/163 , G06F1/1656 , H05K1/0283 , H05K1/038 , H05K3/284 , H05K3/321 , H05K3/3463 , H05K2201/0314 , H05K2203/1311 , H05K2203/1383
Abstract: Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device. This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.
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公开(公告)号：US20180035536A1
公开(公告)日：2018-02-01
申请号：US15622412
申请日：2017-06-14
Applicant: FUJITSU LIMITED
Inventor： Takayoshi Matsumura , Shunji Baba , TAKASHI KANDA , NORITSUGU OZAKI , Hidehiko Kira
CPC classification number: H05K1/0283 , H05K1/0271 , H05K1/092 , H05K1/181 , H05K1/189 , H05K3/245 , H05K2201/0314 , H05K2201/0338 , H05K2201/09045 , H05K2201/09281 , H05K2201/09727 , H05K2201/09736 , H05K2201/10015 , H05K2201/10098 , H05K2201/10522
Abstract: A wiring board includes a base having extensibility and a wiring formed on the base. The wiring includes a wiring portion and a conductor portion. The wiring portion is formed on the base and extends in a first direction crossing (for example, perpendicular to) a longitudinal direction of the base. The conductor portion is formed on the wiring portion and extends in the first direction. Even when the wiring board is extended along a main extension axis in parallel with the longitudinal direction of the base, change of the resistance of the wiring is prevented. Thus, the wiring board represents stable characteristics.
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公开(公告)号：US09841548B2
公开(公告)日：2017-12-12
申请号：US15068372
申请日：2016-03-11
Applicant: Apple Inc.
Inventor： Hoon Sik Kim , Yung-Yu Hsu , Paul S. Drzaic , Luisa Petti
CPC classification number: G02B6/0041 , G02B6/00 , G02B6/0021 , G02B6/0036 , G02B6/006 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G06F1/1643 , G06F1/1652 , G06F2203/04102 , G06F2203/04106 , G06F2203/04109 , H01L23/5387 , H01L51/0097 , H01L2224/16225 , H01L2924/15192 , H01L2924/15311 , H05K1/0274 , H05K1/0283 , H05K1/0287 , H05K1/141 , H05K2201/0133 , H05K2201/0314 , H05K2201/09263 , H05K2201/10106 , H05K2201/10151 , H05K2201/10378
Abstract: An electronic device may have control circuitry coupled to input-output devices such as a display. A flexible input-output device may be formed from an elastomeric substrate layer. The substrate layer may have signal paths to which components are mounted. Openings may be formed in the elastomeric substrate layer between the signal paths to create a stretchable mesh-shaped substrate. The electrical components may each include an interposer having solder pads soldered to the elastomeric substrate. Electrical devices such as micro-light-emitting diodes may be soldered to the interposers. The electrical components may also include electrical devices such as sensors and actuators. A stretchable lighting unit may have a stretchable light guide illuminated by a stretchable light source.
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