公开(公告)号：US20070291454A1

公开(公告)日：2007-12-20

申请号：US11845193

申请日：2007-08-27

Applicant: Hyeon-Yong JANG ,  Cheol-Jin PARK

Inventor： Hyeon-Yong JANG ,  Cheol-Jin PARK

IPC: H05K1/00

CPC classification number: H05K3/366 ,  H05K3/225 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09645

Abstract: A hybrid circuit board includes a first circuit board and a second circuit boards. The first circuit board includes a first body having a slot, and a first circuit pattern formed on the first body and extended to the slot. The second circuit board includes a second body, a protruding portion, a second circuit pattern, and a separating member. The protruding portion extends from the second body. The protruding portion is inserted into the slot of the first circuit board to combine the second circuit board to the first circuit board. The second circuit pattern is formed on the second body to be extended to the protruding portion, so that the second circuit pattern is electrically connected to the first circuit pattern of the first circuit board. The separating member is disposed between the second body and the protruding portion to separate the protruding portion from the second body.

Abstract translation: 混合电路板包括第一电路板和第二电路板。 第一电路板包括具有槽的第一主体和形成在第一主体上并延伸到槽的第一电路图案。 第二电路板包括第二主体，突出部分，第二电路图案和分离部件。 突出部分从第二主体延伸。 突出部插入到第一电路板的槽中，以将第二电路板与第一电路板组合。 第二电路图案形成在第二主体上以延伸到突出部分，使得第二电路图案电连接到第一电路板的第一电路图案。 分离构件设置在第二主体和突出部分之间，以将突出部分与第二主体分离。

公开(公告)号：US07238891B2

公开(公告)日：2007-07-03

申请号：US10528648

申请日：2003-09-19

Applicant: Roland Muenzberg

Inventor： Roland Muenzberg

IPC: H05K1/03

CPC classification number: H05K3/4691 ,  H05K3/28 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063

Abstract: A rigid-flexible circuit board with two rigid areas and one flexible area, with a rigid individual layer which is copper-clad on one side, with an adhesive medium and with a copper foil, the adhesive medium having recesses in the flexible area. The rigid-flexible circuit board can be produced especially easily and economically in that at least in the rigid area there is no flexible individual layer, especially no polyimide film, between the adhesive medium and the copper foil.

Abstract translation: 具有两个刚性区域和一个柔性区域的刚性柔性电路板，具有在一侧铜包覆的刚性单层，具有粘合剂介质和铜箔，所述粘合剂介质在柔性区域中具有凹部。 刚性柔性电路板可以特别容易且经济地制造，因为至少在刚性区域中，在粘合剂介质和铜箔之间没有柔性单独层，特别是没有聚酰亚胺膜。

公开(公告)号：US20070126437A1

公开(公告)日：2007-06-07

申请号：US11493802

申请日：2006-07-27

Applicant: Jae-chun Sul

Inventor： Jae-chun Sul

IPC: G01R31/02

CPC classification number: G01R31/2818 ,  H05K1/0269 ,  H05K3/3457 ,  H05K3/4015 ,  H05K2201/09081 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0264

Abstract: A printed circuit board includes a substrate and an inspection piece part having a solder part provided on a surface of the substrate to be inspected by an inspecting apparatus. Thus, the printed circuit board and an inspected unit can efficiently be inspected without being disassembled and damaged.

Abstract translation: 印刷电路板包括基板和具有焊接部分的检查件部件，该焊接部件设置在被检查装置检查的基板的表面上。 因此，印刷电路板和检查单元可以有效地被检查而不被拆卸和损坏。

公开(公告)号：US20070089826A1

公开(公告)日：2007-04-26

申请号：US11580892

申请日：2006-10-16

Applicant: Yukihiro Ueno ,  Yuhji Takamoto

Inventor： Yukihiro Ueno ,  Yuhji Takamoto

IPC: B32B37/00 ,  B32B38/10

CPC classification number: H05K3/4691 ,  H05K3/0032 ,  H05K3/281 ,  H05K3/4652 ,  H05K2201/09127 ,  H05K2201/09781 ,  Y10T156/108

Abstract: A method for producing a multilayer printed wiring board includes an inner layer formation step of forming an inner layer pattern in a core substrate divided corresponding to a flexible portion that is made bendable and a hard portion that is made rigid, and an outer layer formation step of forming an outer layer such that an outer layer material that covers the core substrate is caused to make contact at the hard portion, and an outer layer pattern formation step of forming an outer layer pattern in the surface of the outer layer material, and a removal step of removing a covering portion that is the outer layer material and is covering the flexible portion, and an outer shape formation step of forming the outer shape of a layered substrate formed via the removal step. Also, an inner layer protection pattern is formed in the periphery of the flexible portion before the outer layer formation step, and the method is provided with a step of severing the periphery of the covering portion by irradiating a laser beam on the outer layer material that corresponds to the inner layer protection pattern before the removal step.

Abstract translation: 一种多层印刷线路板的制造方法，其特征在于，具有：内层形成工序，在形成可弯曲的挠性部的芯基板中形成内层图案，硬化部分形成为刚性，外层形成工序 形成外层，使得覆盖芯基板的外层材料在硬质部分接触，外层图案形成工序在外层材料的表面形成外层图案， 去除作为外层材料的覆盖部分并且覆盖柔性部分的去除步骤，以及形成通过去除步骤形成的层状衬底的外形的外形形成步骤。 此外，在外层形成步骤之前的柔性部分的周围形成有内层保护图案，并且该方法设置有通过在外层材料上照射激光束来切断覆盖部分的周边的步骤 对应于去除步骤之前的内层保护图案。

公开(公告)号：US07172805B2

公开(公告)日：2007-02-06

申请号：US10887484

申请日：2004-07-08

Applicant: Gerald A. J. Hermkens ,  Marcel Smeets ,  Roger Theelen ,  Peter J. M. Thoolen ,  Frank Speetjens

Inventor： Gerald A. J. Hermkens ,  Marcel Smeets ,  Roger Theelen ,  Peter J. M. Thoolen ,  Frank Speetjens

IPC: B32B3/00 ,  H01K1/03 ,  H01R9/09

CPC classification number: H05K1/18 ,  H05K3/306 ,  H05K3/308 ,  H05K3/4623 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/044 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/2036 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A method for manufacturing a mid-plane. a multi-layer board having a connection assembly is provided and a dielectric layer with a channel formed therein to define a perimeter of a connector area is provided. The dielectric layer is bonded to the multi-layer board such that the connector area overlaps the part of the connection assembly of the multi-layer board. At least a portion of the connector area in the dielectric layer is removed to expose the connection assembly of the multi-layer board. A rigid multilayer is also disclosed. The rigid multilayer includes a multi-layer board and a dielectric layer. The multi-layer board has a connection assembly. The dielectric layer has a channel formed therein to define a perimeter of a connector area. The dielectric layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board. The connector area can then be removed such as by depth controlled routing. As will be understood by one skilled in the art, the depth tolerance is not critical because the dielectric layer is pre-formed with the channel prior to formation of the rigid multi-layer.

Abstract translation: 一种制造中平面的方法。 提供了具有连接组件的多层板，并且提供了形成在其中以限定连接器区域的周边的通道的介电层。 电介质层与多层板结合，使得连接器区域与多层板的连接组件的部分重叠。 绝缘层中的连接器区域的至少一部分被去除以暴露多层板的连接组件。 还公开了一种刚性多层。 刚性多层包括多层板和电介质层。 多层板具有连接组件。 介电层具有形成在其中的通道，以限定连接器区域的周边。 电介质层与多层板接合，使得连接器区域与多层板的连接组件重叠。 然后可以通过深度控制路由来去除连接器区域。 如本领域技术人员将理解的，深度公差不是关键的，因为介电层在形成刚性多层之前用通道预先形成。

公开(公告)号：US20060278430A1

公开(公告)日：2006-12-14

申请号：US10564215

申请日：2004-07-08

Applicant: Gerald Hermkins

Inventor： Gerald Hermkins

IPC: H05K7/06

CPC classification number: H05K1/18 ,  H05K3/306 ,  H05K3/308 ,  H05K3/4623 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/044 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/2036 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A method for manufacturing a mid-plane. a multi-layer board having a connection assembly is provided and a layer with a channel formed therein to define a perimeter of a connector area is provided. The layer is bonded to the multi-layer board such that the connector area overlaps the part of the connection assembly of the multi-layer board. At least a portion of the connector area in the layer is removed to expose the connection assembly of the multi-layer board. A rigid multilayer is also disclosed. The rigid multilayer includes a multi-layer board and a layer. The multi-layer board has a connection assembly. The layer has a channel formed therein to define a perimeter of a connector area. The layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board. The connector area can then be removed such as by depth controlled routing. As will be understood by one skilled in the art, the depth tolerance is not critical because the layer is pre-formed with the channel prior to formation of the rigid multi-layer.

Abstract translation: 一种制造中平面的方法。 提供了具有连接组件的多层板，并且提供了形成在其中以限定连接器区域的周边的通道的层。 该层被粘合到多层板上，使得连接器区域与多层板的连接组件的部分重叠。 层中的连接器区域的至少一部分被去除以暴露多层板的连接组件。 还公开了一种刚性多层。 刚性多层包括多层板和层。 多层板具有连接组件。 该层具有形成在其中的通道，以限定连接器区域的周边。 该层被粘合到多层板上，使得连接器区域与多层板的连接组件重叠。 然后可以通过深度控制路由来去除连接器区域。 如本领域技术人员将理解的那样，深度公差不是关键的，因为在形成刚性多层之前，该层被预先形成有通道。

公开(公告)号：US07142909B2

公开(公告)日：2006-11-28

申请号：US10236396

申请日：2002-09-06

Applicant: Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61N1/00

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US20060157270A1

公开(公告)日：2006-07-20

申请号：US11329070

申请日：2006-01-11

Applicant: Yukihiro Ueno

Inventor： Yukihiro Ueno

IPC: H05K1/00

CPC classification number: H05K1/0269 ,  H05K1/0266 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09127 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2203/161 ,  H05K2203/163

Abstract: A printed wiring substrate has a circuit wiring area that has a circuit wiring pattern formed thereon and a peripheral area that is placed in the periphery of the circuit wiring area. The peripheral area has a property display area that is provided with a display location specified in association with a property for displaying a property of the printed wiring substrate. The property can be something that indicates an attribute of the printed wiring substrate such as production lot information, information on an inspection result of an electrical property (such as short-circuit defect, disconnection defect and wiring resistance defect), information on a visual inspection result (such as plating defect and silk screen defect), and the like.

Abstract translation: 印刷布线基板具有形成在其上的电路布线图案的电路布线区域和放置在电路布线区域周边的周边区域。 外围区域具有属性显示区域，其具有与用于显示印刷布线基板的属性的属性相关联地指定的显示位置。 该属性可以表示印刷布线基板的属性，例如生产批次信息，电气特性（例如短路缺陷，断线缺陷和布线电阻缺陷）的检查结果的信息，目视检查信息 结果（如电镀缺陷和丝网缺陷）等。

公开(公告)号：US20060112407A1

公开(公告)日：2006-05-25

申请号：US11274151

申请日：2005-11-16

Applicant: Atsushi Kakiuchi

Inventor： Atsushi Kakiuchi

IPC: H04N5/445

CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K2201/09127 ,  H05K2201/09954

Abstract: To provide an electronic apparatus having a tuner circuit board that can prevent undesirable radiation, is laid out to allow a hybrid tuner designed both for digital broadcasting and analog broadcasting to be mounted. On a tuner circuit board 30 having a tuner section 130 on which a vertical-type tuner 41 and a horizontal-type tuner 42 can interchangeably mounted, an IF block 142 and an MPEG IC 140 are disposed at a distance from a power supply section 150, a grounding section 170 extending from the tuner section 130 is provided. In the case of the vertical-type tuner 41, the grounding section 170 is separated off by a tear-off line 173. In the case of the horizontal-type tuner 42, the grounding section 170 is not separated off so that the grounding section 170 reduces the effect of an undesirable radiation emitted by the mounted horizontal-type tuner 42.

Abstract translation: 为了提供具有能够防止不期望的辐射的调谐器电路板的电子设备，布置成允许安装用于数字广播和模拟广播的混合调谐器。 在具有调谐器部分130的调谐器电路板30上，垂直型调谐器41和水平型调谐器42可以互换地安装在其上，IF块142和MPEG IC 140设置在与电源部分150 提供从调谐器部分130延伸的接地部分170。 在垂直型调谐器41的情况下，接地部分170被撕开线173分离。 在水平型调谐器42的情况下，接地部分170不分离，使得接地部分170减小由安装的水平式调谐器42发射的不需要的辐射的影响。

公开(公告)号：US20060101638A1

公开(公告)日：2006-05-18

申请号：US10992399

申请日：2004-11-18

Applicant: Philip Germann ,  Mark Jeanson

Inventor： Philip Germann ,  Mark Jeanson

IPC: H05K3/30 ,  B23P19/02 ,  H05K3/02

CPC classification number: H05K1/117 ,  H05K3/0044 ,  H05K3/4611 ,  H05K2201/09127 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2203/0228 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49821 ,  Y10T29/5313

Abstract: A method and structure are provided for creating printed circuit boards with stepped thickness. A non-laminating breakaway material layer is selectively placed between layers of the printed circuit board. A perimeter portion of the printed circuit board near the breakaway material layer is scored. Then the breakaway material layer and adjacent layers between the perimeter of the printed circuit board are removed.

Abstract translation: 提供了一种制造具有阶梯厚度的印刷电路板的方法和结构。 非层压分离材料层选择性地放置在印刷电路板的层之间。 对分离材料层附近的印刷电路板的周边部分进行刻痕。 然后去除印刷电路板的周边之间的分离材料层和相邻的层。