公开(公告)号：US09904385B2

公开(公告)日：2018-02-27

申请号：US15096543

申请日：2016-04-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Akira Hirai ,  Mikiya Itakura ,  Dong Ho Lee

IPC: H01K3/10 ,  G06F3/041 ,  G06F3/044 ,  H05K1/11 ,  H05K3/24 ,  H05K3/12 ,  H05K3/18 ,  H05K3/42

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/117 ,  H05K3/1275 ,  H05K3/18 ,  H05K3/243 ,  H05K3/244 ,  H05K3/42 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0949 ,  H05K2203/0361 ,  H05K2203/0574 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A touch screen panel includes a film substrate defined by a touch active area and a non-touch active area and the touch area is arranged outside the touch active area. The touch screen panel includes a plurality of sensing electrodes arranged in the touch active area on an upper surface and a lower surface of the film substrate, and outer lines arranged in the non-touch active area on the upper and the lower surfaces of the film substrate. The outer lines are connected to the sensing electrodes along one of a first direction and a second direction, and the outer lines include a transparent electrode layer and a plating layer on the transparent electrode layer.

公开(公告)号：US09538637B2

公开(公告)日：2017-01-03

申请号：US13533895

申请日：2012-06-26

Applicant: Yan yang Zhao ,  Bernd Huebner ,  Tengda Du ,  Yuheng Lee

Inventor： Yan yang Zhao ,  Bernd Huebner ,  Tengda Du ,  Yuheng Lee

IPC: G01J1/42 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  G02B6/42

CPC classification number: G02B6/4279 ,  G01J1/0425 ,  G02B6/4246 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/10121

Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

Abstract translation: 多通道RF馈通。 在一些示例中，多通道RF馈通包括内部部分和外部部分。 内部部分包括形成有第一和第二组迹线的顶表面。 每组轨迹被配置为电气通信通道以承载电气数据信号。 外部部分包括形成第一组迹线的底表面和形成有第二组迹线的顶表面。 一组通孔将内部部分的顶表面和外部部分的底表面之间的第一组迹线连接起来。

公开(公告)号：US09337584B2

公开(公告)日：2016-05-10

申请号：US14547165

申请日：2014-11-19

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R24/00 ,  H01R13/6469 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/66 ,  H01R24/64 ,  H05K1/02 ,  H05K1/11 ,  H01R12/53 ,  H01R24/28 ,  H05K1/16 ,  H01R107/00

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

Abstract translation: 提供了包括至少具有第一至第四导体的通信电缆和附接到电缆的插头的跳线。 插头包括容纳电缆的外壳，印刷电路板，第一至第四插头触头以及将第一至第四导体连接到相应的第一至第四插头触头的第一至第四导电路径。 第一和第二导体，导电路径和插头触点形成第一差分传输线，并且第三和第四导体，导电路径和插头触点形成第二差分传输线。 第一至第四插头触点中的每一个具有沿着印刷电路板的第一表面纵向延伸的第一段，并且进入第一至第四插头触点中的至少一些的第一段的信号电流注入点进入中间部分 的各自的第一部分。

公开(公告)号：US09155195B2

公开(公告)日：2015-10-06

申请号：US13873504

申请日：2013-04-30

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Junichi Nakamura ,  Yuji Kobayashi

IPC: H05K1/11 ,  H05K7/10 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H05K3/40 ,  H05K3/42 ,  H01L21/56 ,  H01L23/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/116 ,  H05K3/205 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/09509 ,  H05K2203/0338 ,  H05K2203/0361 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer.

Abstract translation: 制造布线板的方法包括在支撑板上形成限定开口部分的焊料或电镀抗蚀剂层的抗蚀剂层，使得支撑板的一部分露出。 电极直接形成在开口部内的支撑板上，当使用时，电镀抗蚀剂层被去除。 在电极以及支撑板或阻焊层上形成绝缘层，并且还形成连接到绝缘层处的电极的布线部分。 然后在布线部分上形成具有开口部分的阻焊层，并且去除支撑板以暴露电极的表面或电极和绝缘层的表面。 然后可以在绝缘层的暴露表面上形成具有开口部分的另一阻焊层。

公开(公告)号：US09030836B2

公开(公告)日：2015-05-12

申请号：US13798553

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-soo Park ,  Kyung-suk Kim

IPC: H05K7/00 ,  G06F1/16 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F1/16 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/0949 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad.

Abstract translation: 公开了能够选择性地将不同类型的连接器应用于基板的装置。 存储装置包括具有控制器的基板。 第一和第二连接器焊盘可以布置在衬底的顶表面和底表面的边缘上。 通孔可以布置在控制器和第一和第二连接器焊盘之间。 第一无源器件焊盘可以布置在通孔和第一连接器焊盘之间。 第二无源器件焊盘可以布置在通孔和第二连接器焊盘之间。 无源器件可以仅耦合到第一无源器件焊盘或第二无源器件焊盘中的一个。

公开(公告)号：US08968005B2

公开(公告)日：2015-03-03

申请号：US13671362

申请日：2012-11-07

Applicant: Dai-Ichi Seiko Co., Ltd.

Inventor： Takeshi Hirakawa

IPC: H01R12/00

CPC classification number: H01R12/73 ,  H01R12/78 ,  H01R12/79 ,  H01R13/627 ,  H01R13/639 ,  H02K7/08 ,  H02K7/09 ,  H02K15/14 ,  H05K1/182 ,  H05K3/361 ,  H05K2201/0949 ,  H05K2201/10189 ,  H05K2201/2018

Abstract: A circuit-terminal connecting device comprising a first connector having a first housing fixed to a main circuit board and first contacts supported by the first housing to be connected with first circuit-terminals provided on the main circuit board and a second connector having a second housing attached to a flat circuit member and second contacts supported by the second housing to be connected with second circuit-terminals provided on the flat circuit member. The first housing of the first connector fits into a hole formed in the second housing of the second connector so as to create an electrical piling connection between the main circuit board and the flat circuit member wherein the flat circuit member is laid on top of the main circuit board and the first circuit-terminals are electrically connected with the second circuit-terminals through the first and second connectors.

Abstract translation: 一种电路端子连接装置，包括：第一连接器，其具有固定到主电路板的第一壳体和由所述第一壳体支撑的第一触点，以与设置在所述主电路板上的第一电路端子连接;第二连接器，具有第二壳体 连接到平坦电路构件和由第二壳体支撑以与设置在平坦电路构件上的第二电路端子连接的第二触点。 第一连接器的第一壳体装配到形成在第二连接器的第二壳体中的孔中，以便在主电路板和扁平电路构件之间形成电堆叠连接，其中平板电路构件放置在主体 电路板和第一电路端子通过第一和第二连接器与第二电路端子电连接。

公开(公告)号：US08959762B2

公开(公告)日：2015-02-24

申请号：US13034755

申请日：2011-02-25

Applicant: Donald Joseph Leahy ,  Brian D. Sawyer ,  Stephen Parker ,  Thomas Scott Morris

Inventor： Donald Joseph Leahy ,  Brian D. Sawyer ,  Stephen Parker ,  Thomas Scott Morris

IPC: H01R43/00 ,  H05K13/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H01L23/552 ,  H01L23/00 ,  H05K3/46

CPC classification number: H05K1/0216 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/1461 ,  H05K1/0218 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K3/4614 ,  H05K2201/0715 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09709 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2924/00

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract translation: 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

公开(公告)号：US08920199B2

公开(公告)日：2014-12-30

申请号：US13802882

申请日：2013-03-14

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R24/00 ,  H01R24/64 ,  H05K1/11 ,  H01R13/6469 ,  H01R13/6466 ,  H05K1/02 ,  H01R13/66 ,  H01R12/53 ,  H01R24/28 ,  H05K1/16

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

Abstract translation: 提供了包括至少具有第一至第四导体的通信电缆和附接到电缆的插头的跳线。 插头包括容纳电缆的外壳，印刷电路板，第一至第四插头触头以及将第一至第四导体连接到相应的第一至第四插头触头的第一至第四导电路径。 第一和第二导体，导电路径和插头触点形成第一差分传输线，并且第三和第四导体，导电路径和插头触点形成第二差分传输线。 第一至第四插头触点中的每一个具有沿着印刷电路板的第一表面纵向延伸的第一段，并且进入第一至第四插头触点中的至少一些的第一段的信号电流注入点进入中间部分 的各自的第一部分。

公开(公告)号：US20130210289A1

公开(公告)日：2013-08-15

申请号：US13802882

申请日：2013-03-14

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R24/00

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

Abstract translation: 提供了包括至少具有第一至第四导体的通信电缆和附接到电缆的插头的跳线。 插头包括容纳电缆的外壳，印刷电路板，第一至第四插头触头以及将第一至第四导体连接到相应的第一至第四插头触头的第一至第四导电路径。 第一和第二导体，导电路径和插头触点形成第一差分传输线，并且第三和第四导体，导电路径和插头触点形成第二差分传输线。 第一至第四插头触点中的每一个具有沿着印刷电路板的第一表面纵向延伸的第一段，并且进入第一至第四插头触点中的至少一些的第一段的信号电流注入点进入中间部分 的各自的第一部分。

公开(公告)号：US20130153272A1

公开(公告)日：2013-06-20

申请号：US13598842

申请日：2012-08-30

Applicant: HSING-HUI CHIU ,  PEI-JYUN SU ,  SZE-YU LIN

Inventor： HSING-HUI CHIU ,  PEI-JYUN SU ,  SZE-YU LIN

IPC: H05K1/09

CPC classification number: H05K1/0215 ,  H05K1/116 ,  H05K3/28 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/10409

Abstract: A printed circuit board includes a top layer, a bottom layer, and a mounting hole vertically extending through the top layer and the bottom layer. A first copper ring is located on a top surface of the top layer and around the mounting hole. A second copper ring is located a bottom surface of the bottom layer and around the mounting hole. A number of first pads are positioned on the first copper ring. A number of second pads are positioned on the second copper ring. The first and second copper rings are covered with solder mask, but the first and second pads are not covered with the solder mask.

Abstract translation: 印刷电路板包括顶层，底层和垂直延伸穿过顶层和底层的安装孔。 第一铜环位于顶层的顶表面和安装孔周围。 第二个铜环位于底层的底部表面，并位于安装孔周围。 多个第一焊盘位于第一铜环上。 多个第二垫位于第二铜环上。 第一和第二铜环用焊接掩模覆盖，但第一和第二焊盘不被焊接掩模覆盖。