Abstract:
A wiring board includes a metal cap pad that is arranged so as to surround a mounting position of an electronic component and is connected to an end portion of a metal cap, a power source plane that is connected to the electronic component through a connection member and has a gap, a ground plane that is connected to the electronic component through a connection member, and a plurality of conductive body elements that are repeatedly arranged so as to surround the connection members and the gap. The power source plane and the ground plane extend so as to include at least a part of an area that is surrounded by the plurality of conductive body elements and at least a part of an area facing the plurality of conductive body elements.
Abstract:
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor.
Abstract:
A circuit board (100) includes power supply planes (141, 143) arranged with gaps (147) in a D layer (140), connection members (182, 183, 184) electrically connecting at least one of the power supply planes (141, 143) to an electronic device (181), plural conductor elements (121) repeatedly arranged to surround at least some of the gaps (147) and the connection members (182, 183, 184), and ground planes (111, 171) being located in an A layer (110) or a G layer (170) and extending in a second region or a third region including a region opposing the first region and a region opposing the conductor elements (121).
Abstract:
An object of the present invention is to provide a mechanically and electrically integrated type electronic control apparatus which can be embedded in a compact mechanical part, and has a compact structure while having a high wiring freedom, a high heat dissipation and a high reliability. In a mechanically and electrically integrated type electronic control apparatus provided with a control signal generating part, and an angular wiring member connecting the control signal generating part and a controlled part controlled by a control signal of the control signal generating part, installed within a conductive casing, at least the wiring member has a fixed hole, a surface including the fixed hole is coated in an insulative manner, and the fixed hole is fixed to the conductive casing mechanically while keeping an insulating property.
Abstract:
An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring.
Abstract:
A sensor unit 10 is provided with a metal plate 20 and a resin molded article 30 is formed integral to the metal plate 20. Busbars 50 are arranged in the resin molded article 30 and include exposed end portions 52 exposed from the resin molded article 30. Connecting portions 52A are provided at the leading ends of the exposed end portions 52 and are riveted to an oil temperature sensor 41 on the metal plate 20. Opposite lateral sides of the exposed end portions 52 are partly in contact with the resin molded article 30.
Abstract:
A liquid crystal display device includes a liquid crystal display panel having a liquid crystal layer between a pair of substrates, a light unit arranged in overlapping with the liquid crystal display panel for illuminating the liquid crystal display panel, the light unit including a front case and a back case for housing a light member, and a flexible printed circuit board. The flexible printed circuit board has a folding back portion which is housed at the housing portion provided at the bottom of the case of the backlight unit to adjust its length. The printed circuit board is drawn out from the housing portion to outside and connected to the outer circuits. Accordingly, it is possible to provide a compact and slim type liquid crystal display device.
Abstract:
The portion of a board corresponding to the surrounding portion of a hole 4 formed through the board is arranged to include a patternless section 6 where a conductive film 5 is not provided.
Abstract:
The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.
Abstract:
Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the steel backing and base polyimide, and are positioned between adjacent conductive pads. In addition to facilitating visual inspection, the windows also enable rework of solder. Additionally, solder wicking holes may also be provided in the conductive pads and/or the polyimide and steel backing.