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    Split via surface mount connector and related techniques
    61.
    发明授权
    Split via surface mount connector and related techniques 失效
    通过表面贴装连接器和相关技术拆分

    公开(公告)号：US6137064A

    公开(公告)日：2000-10-24

    申请号：US359849

    申请日：1999-07-23

    Applicant: Sepehr Kiani ,  R. Ryan Vallance

    Inventor： Sepehr Kiani ,  R. Ryan Vallance

    IPC: H01R12/51 ,  H05K1/02 ,  H05K1/11 ,  H05K3/04 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H01R12/04

    CPC classification number: H05K1/0222 ,  H05K1/112 ,  H05K1/115 ,  H05K3/403 ,  H01R12/523 ,  H05K2201/09645 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10893 ,  H05K2201/10969 ,  H05K2203/0455 ,  H05K3/043 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/429

    Abstract: An interconnection circuit includes a plated through hole having a plurality of electrically isolated segments with at least one of the plurality of electrically isolated segments coupled to a signal path and at least one of the electrically isolated segments coupled to ground. With this arrangement, the circuit provides a signal path between a first and a second different layers of a multilayer. By providing one segment as a signal segment and another segment as a ground segment the size and shape of the electrically isolated segments can be selected to provide the interconnection circuit having a predetermined impedance characteristic. The interconnection circuit can thus be impedance matched to circuit board circuits, devices and transmission lines, such as striplines, microstrips and co-planar waveguides. This results in an interconnection circuit which maintains the integrity of relatively high-frequency signals propagating through the interconnection circuit from the first layer to the second layer. The interconnect circuits can be formed by creating distinct conductor paths within the cylindrical plated through-holes using variety of manufacturing techniques including, but not limited to, broaching techniques, electrical discharge milling (EDM) techniques and laser etching techniques.

    Abstract translation: 互连电路包括具有多个电隔离段的电镀通孔，其中所述多个电隔离段中的至少一个耦合到信号路径和耦合到地的电隔离段中的至少一个。 利用这种布置，电路提供了多层的第一和第二不同层之间的信号路径。 通过将一个段作为信号段，另一个段作为接地段，可以选择电隔离段的大小和形状，以提供具有预定阻抗特性的互连电路。 因此，互连电路可以与电路板电路，器件和传输线（例如带状线，微带和共面波导）阻抗匹配。 这导致互连电路，其维持通过互连电路从第一层传播到第二层的相对高频信号的完整性。 可以通过使用各种制造技术（包括但不限于拉削技术，放电铣削（EDM）技术和激光蚀刻技术）在圆柱形电镀通孔内产生不同的导体路径来形成互连电路。

    Electrical relay
    62.
    发明授权
    Electrical relay 失效
    继电器

    公开(公告)号：US5606298A

    公开(公告)日：1997-02-25

    申请号：US496516

    申请日：1995-06-29

    Applicant: Josef Weiser

    Inventor： Josef Weiser

    IPC: H01H1/58 ,  H01H50/02 ,  H01H50/14 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01H51/22

    CPC classification number: H05K3/3426 ,  H01H50/023 ,  H01H50/14 ,  H05K3/308 ,  H01H1/5805 ,  H01H2001/5888 ,  H05K1/0271 ,  H05K1/18 ,  H05K2201/10825 ,  H05K2201/10856 ,  H05K3/3421 ,  Y02P70/613

    Abstract: In an electrical relay for integration on printed circuit boards, terminal leads thereof emerge from an upper side of a housing that faces away from a floor side or from the printed circuit board, and have bent-over sections extending along sidewalls of the housing down into the region of the floor side, where they form press-in pins or SMT solder terminals. As a result thereof, a decoupling of the press-in stems from the seal leadthroughs at the housing occurs, so that a de-adjustment in the interior of the relay due to the press-in is avoided.

    Abstract translation: 在用于集成在印刷电路板上的继电器中，端子引线从外壳的上侧离开地板一侧或从印刷电路板出来，并且具有沿壳体的侧壁延伸的弯曲部分， 地板一侧的区域，形成压入式针脚或SMT焊接端子。 结果是，压入杆从外壳处的密封引线脱离，从而避免了由于压入引起的继电器内部的去调整。

    Feed-through capacitor having a compliant pin terminal
    64.
    发明授权
    Feed-through capacitor having a compliant pin terminal 失效
    具有兼容引脚端子的直通电容器

    公开(公告)号：US4906209A

    公开(公告)日：1990-03-06

    申请号：US271339

    申请日：1988-11-09

    Applicant: Takeshi Tanabe ,  Takaaki Ooi ,  Shingo Okuyama

    Inventor： Takeshi Tanabe ,  Takaaki Ooi ,  Shingo Okuyama

    IPC: H01R12/58 ,  H01R13/7197 ,  H05K3/30

    CPC classification number: H01R13/7197 ,  H05K3/308 ,  H01R12/585 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2201/10833 ,  H05K2201/10856

    Abstract: A compliant pin terminal inserted into a through hole, such as a center hole of a feed-through capacitor or a through hole of a circuit substrate having an electrode at the inner periphery thereof, is mounted into the through hole for electrically connecting with the electrode therein. The pin terminal includes slits, by which linear divided portions and expanded elastic contact portions are formed so that when the body is inserted into the through hole of the capacitor the elastic contact portions come into press-contact with the electrode, thereby obtaining electrical connection with the electrode and mechanical locking by means of the elasticity of each elastic contact portion. A lengthwise pulling force acting on the terminal body is borne by the linear divided portions, but does not act on the elastic portions. Accordingly, an interval between the elastic contact portions opposite to each other resists change, thereby effectively preventing the pin terminal from escaping from the through hole.

    Abstract translation: 插入通孔的柔性引脚端子，例如馈电电容器的中心孔或在其内周具有电极的电路基板的通孔安装在通孔中，以与电极电连接 其中。 销端子包括狭缝，线形分割部分和膨胀弹性接触部分形成为使得当主体插入电容器的通孔中时，弹性接触部分与电极压接，从而获得与 电极和通过每个弹性接触部分的弹性机械锁定。 作用在端子体上的纵向拉力由线状分割部分承受，但不作用在弹性部分上。 因此，彼此相反的弹性接触部之间的间隔抵抗变化，从而有效地防止销端子从通孔逸出。

    Terminal construction
    65.
    发明授权
    Terminal construction 失效
    码头建设

    公开(公告)号：US4368944A

    公开(公告)日：1983-01-18

    申请号：US184766

    申请日：1980-09-08

    Applicant: David M. DeYoung

    Inventor： David M. DeYoung

    IPC: H05K3/30 ,  H05K3/34 ,  H05K7/12 ,  H01R13/40

    CPC classification number: H05K3/308 ,  H05K7/12 ,  H05K2201/10189 ,  H05K2201/10833 ,  H05K2201/10856 ,  H05K2201/10878 ,  H05K3/3447

    Abstract: A rolled up terminal end adapted for insertion into an opening in a PCB or the like comprising a first end section with an effective width less than the diameter of the PCB opening, a second section having a terminal retaining ramp means with an effective width greater than the diameter of the PCB opening and an elongated slot extending throughout at least a portion of the second section.

    Abstract translation: 卷起的终端适于插入到PCB等中的开口中，包括具有小于PCB开口直径的有效宽度的第一端部段，具有端部保持斜面装置的第二部分，有效宽度大于 PCB开口的直径和延伸穿过第二部分的至少一部分的细长槽。

    Pin header assembly and method of forming the same
    67.
    发明授权
    Pin header assembly and method of forming the same 有权
    针头组件及其形成方法

    公开(公告)号：US09153886B2

    公开(公告)日：2015-10-06

    申请号：US13661457

    申请日：2012-10-26

    Applicant: Catalin Nastasa ,  Jacobo Barraza-Rubio

    Inventor： Catalin Nastasa ,  Jacobo Barraza-Rubio

    IPC: H01R9/00 ,  H01R13/42 ,  H01R43/16 ,  H01R12/58 ,  H05K3/34

    CPC classification number: H01R12/585 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2201/2036 ,  Y10T29/49204 ,  Y10T156/1062

    Abstract: Improved pin header assemblies, printed circuit board assemblies and methods of forming the same are disclosed. In an aspect, a method of forming a pin header assembly for use with a printed circuit board is provided. The method includes the step of providing a base formed of an electric insulator. The method further includes the step of forming a plurality of openings through the base. The method further includes the step of inserting a plurality of conductive pins through the openings, wherein a press fit is formed between the conductive pins and the base, and the conductive pins extend from opposite sides of the base.

    Abstract translation: 公开了改进的针头组件，印刷电路板组件及其形成方法。 在一方面，提供了一种形成用于印刷电路板的针头组件的方法。 该方法包括提供由电绝缘体形成的基座的步骤。 该方法还包括通过基底形成多个开口的步骤。 所述方法还包括通过所述开口插入多个导电针的步骤，其中在所述导电针和所述基座之间形成压配合，并且所述导电针从所述底座的相对侧延伸。

    Light emitting diode assembly and methods
    70.
    发明授权
    Light emitting diode assembly and methods 有权
    发光二极管组件及方法

    公开(公告)号：US08324642B2

    公开(公告)日：2012-12-04

    申请号：US12705408

    申请日：2010-02-12

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: H01L33/00

    CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3011 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10856 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Exemplary systems and methods for LED light engines include an LED package with electrical leads, each lead forming a compliant portion for making electrical and mechanical connection upon insertion into a receptacle of a circuit substrate. In an illustrative example, the electrical and mechanical connections may be formed upon the insertion of the compliant portion into the receptacle and without further process steps involving solder. Various examples may further include an elongated thermal dissipation member extending from a bottom of a package that contains the LED, where the elongated thermal member (e.g., tab) may be in substantial thermal communication with the LED die. As an example, the tab may provide a substantially reduced thermal impedance for dissipating heat from the LED die. Upon insertion into a circuit substrate, the LED package may be releasable by mechanical extraction without applied heat to facilitate repair or replacement, for example.

    Abstract translation: 用于LED光引擎的示例性系统和方法包括具有电引线的LED封装，每个引线形成柔性部分，用于在插入到电路基板的插座中时进行电和机械连接。 在说明性示例中，电连接和机械连接可以在柔性部分插入插座中而没有涉及焊料的进一步处理步骤时形成。 各种示例还可以包括从包含LED的封装的底部延伸的细长散热构件，其中细长的热构件（例如，突片）可以与LED管芯实质上热连通。 作为示例，突片可以提供显着降低的热阻抗，用于散发来自LED管芯的热量。 在插入到电路基板中时，例如，LED封装可以通过机械提取而不用施加的热来释放，以便于修理或更换。

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