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公开(公告)号：US20170125645A1
公开(公告)日：2017-05-04
申请号：US15405323
申请日：2017-01-13
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yu-Feng Lin , Yi-Ru Huang
CPC classification number: H01L33/486 , H01L33/38 , H01L33/40 , H01L33/46 , H01L33/502 , H01L33/52 , H01L33/54 , H01L33/62
Abstract: A light emitting device includes a light emitting unit, a light transmissive layer and an encapsulant. The light emitting unit includes a substrate, an epitaxial structure layer disposed on the substrate, and a first electrode and a second electrode disposed on the same side of the epitaxial structure layer, respectively. The light emitting unit is disposed on the light transmissive layer and at least a part of the first electrode and a part of the second electrode are exposed by the light transmissive layer. The encapsulant encapsulates the light emitting unit and at least exposes a part of the first electrode and a part of the second electrode. Each of the first electrode and the second electrode extends outward from the epitaxial structure layer, and covers at least a part of an upper surface of the encapsulant, respectively.
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公开(公告)号：US20170005236A1
公开(公告)日：2017-01-05
申请号：US15264564
申请日：2016-09-13
Applicant: Genesis Photonics Inc.
Inventor： Jing-En Huang , Shao-Ying Ting , Po-Jen Su , Chih-Ling Wu , Yi-Ru Huang , Yu-Yun Lo
CPC classification number: H01L33/502 , H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2933/0033
Abstract: A light emitting diode (LED) package includes at least one light emitting unit having a first electrode and a second electrode, a first molding compound covering a part of the light emitting unit to expose the first electrode and the second electrode, and a first light transmissive plate disposed on the first molding compound opposite the light emitting unit. A side surface of the first molding compound and a side surface of the first light transmissive plate are coplanar or have even adjoined edges.
Abstract translation: 发光二极管（LED）封装包括至少一个具有第一电极和第二电极的发光单元，覆盖发光单元的一部分以暴露第一电极和第二电极的第一模塑料和第一光 设置在与发光单元相对的第一模塑料上的透光板。 第一模塑料的侧表面和第一透光板的侧表面是共面的或具有相邻的边缘。
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公开(公告)号：US20160254428A1
公开(公告)日：2016-09-01
申请号：US15046407
申请日：2016-02-17
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Jing-En Huang , Yi-Ru Huang , Kuan-Chieh Huang
CPC classification number: H01L33/62 , H01L33/0079 , H01L33/38 , H01L33/387 , H01L33/46 , H01L33/486 , H01L33/52 , H01L33/54 , H01L2224/04105 , H01L2224/20 , H01L2933/005 , H01L2933/0066
Abstract: A light emitting device including a circuit board, a light emitting unit, and an anisotropic conductive layer is provided. The circuit board includes a plurality of electrode pads. The light emitting unit includes a semiconductor epitaxial structure layer, a first electrode, and a second electrode. The first electrode and the second electrode are respectively disposed on the same side of the semiconductor epitaxial structure layer. The first electrode and the second electrode are electrically connected to the electrode pads through the anisotropic conductive layer. A fabricating method of a light emitting device is also provided.
Abstract translation: 提供了包括电路板，发光单元和各向异性导电层的发光器件。 电路板包括多个电极焊盘。 发光单元包括半导体外延结构层，第一电极和第二电极。 第一电极和第二电极分别设置在半导体外延结构层的同一侧。 第一电极和第二电极通过各向异性导电层电连接到电极焊盘。 还提供了一种发光器件的制造方法。
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公开(公告)号：US20160247982A1
公开(公告)日：2016-08-25
申请号：US15045454
申请日：2016-02-17
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Sie-Jhan Wu , Jing-En Huang
CPC classification number: H01L25/0753 , H01L33/0095 , H01L33/10 , H01L33/20 , H01L33/382 , H01L33/405 , H01L33/42 , H01L33/46 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2933/0016 , H01L2933/0025 , H01L2933/005 , H01L2933/0058 , H01L2924/00014
Abstract: A light-emitting device including a light-emitting unit, an electrode unit, and an insulating unit is provided. The light-emitting unit includes an illuminator and a packaging sealant. The illuminator generates an optical energy by way of electroluminescence, and the packaging sealant is formed on a part of a surface of the illuminator. The electrode unit includes a first electrode and a second electrode respectively formed on the surface of the illuminator on which no packaging sealant is formed. The insulating unit is formed on the surface of the light-emitting unit and includes a first insulating layer protruded between the first electrode and the second electrode. When the light-emitting device of the invention is electrically connected to an external circuit board using solder, the insulating unit effectively separates the elements to avoid the elements being short-circuited by the solder overflowing.
Abstract translation: 提供了包括发光单元，电极单元和绝缘单元的发光器件。 发光单元包括照明器和包装密封剂。 照明器通过电致发光产生光能，并且包装密封剂形成在照明器的表面的一部分上。 电极单元包括分别形成在其上没有形成包装密封剂的照明器的表面上的第一电极和第二电极。 绝缘单元形成在发光单元的表面上，并且包括在第一电极和第二电极之间突出的第一绝缘层。 当本发明的发光装置使用焊料电连接到外部电路板时，绝缘单元有效地分离元件以避免元件被焊料溢出而短路。
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公开(公告)号：US20160093766A1
公开(公告)日：2016-03-31
申请号：US14957630
申请日：2015-12-03
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yi-Ru Huang , Sie-Jhan Wu , Long-Lin Ke
CPC classification number: H01L33/0095 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/08 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/507 , H01L33/52 , H01L33/62 , H01L33/64 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2224/24137 , H01L2924/0002 , H01L2933/0016 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H05B33/0803 , H05B33/0806 , H05B33/0827 , H01L2924/00
Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.
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Patent Agency Ranking
公开(公告)号：US20160086929A1
公开(公告)日：2016-03-24
申请号：US14957631
申请日：2015-12-03
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yi-Ru Huang , Sie-Jhan Wu , Long-Lin Ke
CPC classification number: H01L33/0095 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/08 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/507 , H01L33/52 , H01L33/62 , H01L33/64 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2224/24137 , H01L2924/0002 , H01L2933/0016 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H05B33/0803 , H05B33/0806 , H05B33/0827 , H01L2924/00
Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.
Abstract translation: 提供一种制造发光单元的方法。 提供包括彼此分离的多个发光骰子的半导体结构。 形成模塑料以封装发光管芯。 每个发光管芯包括发光元件，第一电极和第二电极。 在第一电极和发光管芯的第二电极上形成图案化的金属层。 提供了一种基板，其中模塑料位于基板和发光芯片的发光元件之间。 执行切割处理以切割半导体结构，图案化金属层，模制化合物和基板，以便限定具有串联连接环路，并联连接环路或串联 - 并联连接环路的发光单元。
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公开(公告)号：US20150364660A1
公开(公告)日：2015-12-17
申请号：US14462581
申请日：2014-08-19
Applicant: Genesis Photonics Inc.
Inventor： Kuan-Chieh Huang , Shao-Ying Ting , Jing-En Huang , Yi-Ru Huang
CPC classification number: H01L33/505 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/60
Abstract: A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light emitting surface. The molding compound covers the light emitting unit. The wavelength converting layer is disposed above the molding compound. The wavelength converting layer has a first surface and a second surface opposite to the first surface, wherein the first surface is located between the forward light emitting surface and the second surface, and at least one of the first and second surfaces is non-planar.
Abstract translation: 发光部件包括发光单元，模塑料和波长转换层。 发光单元具有正向发光面。 模塑料覆盖发光单元。 波长转换层设置在模塑料上方。 波长转换层具有与第一表面相对的第一表面和第二表面，其中第一表面位于正向发光表面和第二表面之间，并且第一表面和第二表面中的至少一个是非平面的。
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公开(公告)号：US20150325748A1
公开(公告)日：2015-11-12
申请号：US14705977
申请日：2015-05-07
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yu-Feng Lin , Yi-Ru Huang
CPC classification number: H01L33/486 , H01L33/38 , H01L33/40 , H01L33/46 , H01L33/502 , H01L33/52 , H01L33/54 , H01L33/62
Abstract: A light emitting device includes a light emitting unit, a light transmissive layer and an encapsulant. The light emitting unit includes a substrate, an epitaxial structure layer disposed on the substrate, and a first electrode and a second electrode disposed on the same side of the epitaxial structure layer, respectively. The light emitting unit is disposed on the light transmissive layer and at least a part of the first electrode and a part of the second electrode are exposed by the light transmissive layer. The encapsulant encapsulates the light emitting unit and at least exposes a part of the first electrode and a part of the second electrode. Each of the first electrode and the second electrode extends outward from the epitaxial structure layer, and covers at least a part of an upper surface of the encapsulant, respectively.
Abstract translation: 发光器件包括发光单元，透光层和密封剂。 发光单元包括基板，设置在基板上的外延结构层，以及分别设置在外延结构层的同一侧上的第一电极和第二电极。 发光单元设置在透光层上，第一电极的至少一部分和第二电极的一部分被透光层曝光。 密封剂封装发光单元，并且至少暴露第一电极的一部分和第二电极的一部分。 第一电极和第二电极中的每一个分别从外延结构层向外延伸，并且分别覆盖密封剂的上表面的至少一部分。
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公开(公告)号：US20150188000A1
公开(公告)日：2015-07-02
申请号：US14583210
申请日：2014-12-26
Applicant: Genesis Photonics Inc.
Inventor： Jing-En Huang , Shao-Ying Ting , Po-Jen Su , Chih-Ling Wu , Yi-Ru Huang , Yu-Yun Lo
CPC classification number: H01L33/502 , H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2933/0033
Abstract: A light emitting diode (LED) package includes at least one light emitting unit having a first electrode and a second electrode, a first molding compound covering a part of the light emitting unit to expose the first electrode and the second electrode, and a first light transmissive plate disposed on the first molding compound opposite the light emitting unit. A side surface of the first molding compound and a side surface of the first light transmissive plate are coplanar or have even adjoined edges.
Abstract translation: 发光二极管（LED）封装包括至少一个具有第一电极和第二电极的发光单元，覆盖发光单元的一部分以暴露第一电极和第二电极的第一模塑料和第一光 设置在与发光单元相对的第一模塑料上的透光板。 第一模塑料的侧表面和第一透光板的侧表面是共面的或具有相邻的边缘。
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公开(公告)号：USD731989S1
公开(公告)日：2015-06-16
申请号：US29495848
申请日：2014-07-04
Applicant: Genesis Photonics Inc.
Designer： Jing-En Huang , Kuan-Chieh Huang , Shao-Ying Ting , Yi-Ru Huang
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