公开(公告)号：US20040053505A1

公开(公告)日：2004-03-18

申请号：US10247467

申请日：2002-09-18

Inventor： Jeffrey D. Chinn ,  Michael B. Rattner ,  James A. Cooper ,  Rolf A. Guenther

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B81C1/00626 ,  B81B2201/0214 ,  B81B2201/058 ,  B81C99/009 ,  B81C2201/0132 ,  H01L21/3065 ,  H01L21/3081

Abstract: Disclosed herein is an easy and well-integrated method of etching features to different depths in a crystalline substrate, such as a single-crystal silicon substrate. The method utilizes a specialized masking process and takes advantage of a highly selective etch process. The method provides a system of interconnected, variable depth reservoirs and channels. The plasma used to etch the channels may be designed to provide a sidewall roughness of about 200 nm or less. The resulting structure can be used in various MEMS applications, including biomedical MEMS and MEMS for semiconductor applications.

Abstract translation: 本文公开了一种在晶体衬底（例如单晶硅衬底）中对不同深度蚀刻特征的易于且良好集成的方法。 该方法利用专门的掩蔽过程并利用高选择性蚀刻工艺。 该方法提供了一个互连的，可变深度的储层和通道的系统。 用于蚀刻通道的等离子体可以设计成提供约200nm或更小的侧壁粗糙度。 所得结构可用于各种MEMS应用，包括用于半导体应用的生物医学MEMS和MEMS。

公开(公告)号：US20020094572A1

公开(公告)日：2002-07-18

申请号：US10032280

申请日：2001-12-21

Inventor： Rahul Singhvi ,  Amit Kumar ,  George M. Whitesides ,  Donald E. Ingber ,  Gabriel P. Lopez ,  Daniel I. C. Wang ,  Gregory N. Stephanopoulos

IPC: C12N005/02

CPC classification number: C12N1/00 ,  B01J19/0046 ,  B01J2219/00382 ,  B01J2219/00385 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00621 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00659 ,  B01J2219/0072 ,  B81B2201/0214 ,  B81C1/00206 ,  B81C2201/034 ,  B82Y5/00 ,  B82Y30/00 ,  C12N5/0068 ,  C12N5/067 ,  C12N2535/10 ,  C12Q1/02 ,  C40B60/14

Abstract: The invention provides a device for adhering cells in a specific and predetermined position, and associated methods. The device includes a plate defining a surface and a plurality of cytophilic islands that adhere cells, isolated by cytophobic regions to which cells do not adhere, contiguous with the cytophilic islands. The islands or the regions or both may be formed of a self-assembled monolayer (SAM).

Abstract translation: 本发明提供一种用于将细胞粘附在特定和预定位置的装置以及相关方法。 该装置包括限定表面的板和多个细胞亲和岛，其附着细胞，由细胞不粘附的细胞渗透区隔离，与细胞色素岛邻接。 岛或区域或两者可以由自组装单层（SAM）形成。

公开(公告)号：US11970388B2

公开(公告)日：2024-04-30

申请号：US17550607

申请日：2021-12-14

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng Wu

IPC: B81B3/00 ,  B81C3/00

CPC classification number: B81B3/0018 ,  B81C3/001 ,  B81B2201/0214 ,  B81B2201/03 ,  B81B2203/033 ,  B81B2207/09

Abstract: A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.

公开(公告)号：US11866323B2

公开(公告)日：2024-01-09

申请号：US17053253

申请日：2019-05-07

Applicant: Robert Bosch GmbH

Inventor： Renate Mueller ,  Tobias Sebastian Frey

IPC: G01N27/18 ,  B81C1/00

CPC classification number: B81C1/00182 ,  G01N27/18 ,  B81B2201/0214 ,  B81B2203/0127 ,  B81C2201/019 ,  B81C2201/0115

Abstract: A method for manufacturing at least one membrane system for a micromechanical sensor for the calorimetric detection of gases. A wafer-shaped substrate is provided. At least one reference volume is introduced from a front side into the wafer-shaped substrate with the aid of a surface or volume micromechanical process while forming a reference membrane covering the reference volume at least in some areas. At least one measuring volume, which is adjacent to the at least one reference volume, is introduced into the substrate from a back side or the front side of the wafer-shaped substrate while forming a measuring membrane. A wafer-shaped cap substrate is applied onto the front side of the wafer-shaped substrate. A membrane system and a component are described.

公开(公告)号：US20230235664A1

公开(公告)日：2023-07-27

申请号：US17582816

申请日：2022-01-24

Applicant: Schlumberger Technology Corporation

Inventor： Remi Robutel ,  Cleverson Souza Chaves ,  Mohamed Salim Cherchali ,  Claire Tassin ,  Nicolas Renoux

IPC: E21B47/07 ,  B81B7/00 ,  E21B47/12 ,  E21B47/01

CPC classification number: E21B47/07 ,  B81B7/0074 ,  E21B47/01 ,  E21B47/12 ,  B81B2201/025 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/07 ,  B81B2207/091

Abstract: A downhole sensor system includes a first sensor package having a substrate, an integrated circuit chip mounted to the substrate, the integrated circuit chip including a processor, a transducer chip mounted to the integrated circuit chip, and a plurality of sensors configured to measure at least shock, pressure, temperature, and humidity. At least one of the plurality of sensors is mounted to the transducer chip such that a stack is formed at least from the substrate, the integrated circuit, the transducer chip, and the sensor. The plurality of sensors are in communication with the processor.

公开(公告)号：US20230204554A1

公开(公告)日：2023-06-29

申请号：US17913095

申请日：2020-07-10

Applicant: Wiinaa Co., Ltd.

Inventor： Lei XU ,  Dongcheng XIE ,  Dongliang CHEN

IPC: G01N33/00 ,  B81B7/04

CPC classification number: G01N33/0031 ,  B81B7/04 ,  G01N33/0073 ,  B81B2201/0214

Abstract: A MEMS gas sensor (A), array thereof, and preparation method therefor. The MEMS gas sensor comprises a first substrate (A2) provided with a first cavity (A1), and N gas detection assemblies (A3) provided at an opening of A1, each A3 comprises: a supporting arm (A31) and a gas detection part (A32) provided on the A31; the A32 comprises a strip-shaped heating electrode part (A321), an insulating layer (A322), a strip-shaped detection electrode part (A323), and a gas-sensitive material part (A324) that are stacked sequentially; the A323 comprises a first detection electrode part (A323-1) and a second detection electrode part (A323-2) with a first opening (A325) therebetween; the A324 is provided at the A325; a first end of the A324 is connected to the A323-1, a second end of the A324 is connected to the A323-2; strip-shaped heating electrode parts in each A3 are connected sequentially to form a heater (A8).

公开(公告)号：US20180354781A1

公开(公告)日：2018-12-13

申请号：US15855097

申请日：2017-12-27

Applicant: Silicon Optronics, Inc.

Inventor： Chi-Hsing HSU

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/00 ,  B01L3/00

CPC classification number: B81B7/0006 ,  B01L3/508 ,  B01L2200/02 ,  B01L2200/12 ,  B01L2300/04 ,  B01L2300/0819 ,  B81B2201/0214 ,  B81C1/00095 ,  B81C1/00206 ,  B81C1/00888 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/214 ,  H01L2224/95001

Abstract: A biosensor package structure is provided. The biosensor package structure includes a protection layer and a redistribution layer disposed over the protection layer. The protection layer has a plurality of openings exposing the redistribution layer. The biosensor package structure includes at least one die disposed over the protection layer and the redistribution layer, a plurality of pads disposed on a lower surface of the die, and a plurality of vias disposed between the pads and the redistribution layer. The biosensor package structure includes a dielectric material disposed over the protection layer and the redistribution layer and adjacent to the die, pads and vias. The biosensor package structure further includes at least one biosensing region at the top portion of the die. The top surfaces of the pads are disposed at a level that is lower than the top surface of the biosensing region and higher than the bottom surface of the die.

公开(公告)号：US20180186623A1

公开(公告)日：2018-07-05

申请号：US15911133

申请日：2018-03-04

Applicant: Kris Vossough ,  Farhang Yazdani

Inventor： Kris Vossough ,  Farhang Yazdani

IPC: B81B3/00 ,  G01C19/5712 ,  G01P15/08 ,  G01L9/00 ,  G01N33/00 ,  H01L29/06 ,  H01L29/84 ,  H04R19/04 ,  H04R19/00

CPC classification number: B81B3/0021 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B82Y15/00 ,  G01C19/5712 ,  G01C19/5783 ,  G01L9/0042 ,  G01N33/0027 ,  G01P15/0802 ,  G01P15/124 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/16 ,  H01L29/1608 ,  H01L29/20 ,  H01L29/775 ,  H01L29/84 ,  H01L51/0048 ,  H04R19/005 ,  H04R19/04 ,  H04R23/006 ,  H04R2201/003

Abstract: This invention describes the structure and function of an integrated multi-sensing system. Integrated systems described herein may be configured to form a microphone, pressure sensor, gas sensor, multi-axis gyroscope or accelerometer. The sensor uses a variety of different Field Effect Transistor technologies (horizontal, vertical, Si nanowire, CNT, SiC and III-V semiconductors) in conjunction with MEMS based structures such as cantilevers, membranes and proof masses integrated into silicon substrates. It also describes a configurable method for tuning the integrated system to specific resonance frequency using electronic design.

公开(公告)号：US09989494B2

公开(公告)日：2018-06-05

申请号：US14621702

申请日：2015-02-13

Applicant: ARKRAY, INC.

Inventor： Naotsugu Onuma

IPC: G01N27/447 ,  B32B38/00 ,  B32B37/12 ,  B01L3/00

CPC classification number: G01N27/44791 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2300/0822 ,  B01L2300/0851 ,  B01L2300/16 ,  B01L2400/0421 ,  B29C65/08 ,  B29C65/18 ,  B29C66/026 ,  B29C66/1122 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/919 ,  B29C66/929 ,  B29C66/949 ,  B29L2031/756 ,  B32B37/12 ,  B32B38/0008 ,  B32B2037/243 ,  B32B2310/0481 ,  B81B2201/0214 ,  B81B2201/058 ,  B81C1/00206 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2027/06 ,  B29K2023/38 ,  B29K2071/00 ,  B29K2025/06 ,  B29K2027/18 ,  B29K2023/12 ,  B29K2023/06

Abstract: A method for manufacturing a chip that includes a microchannel is described, wherein the method includes the steps of: fixing a cationic polymer having a quaternary onium group to at least one surface of each of a pair of resin substrates; and joining the resin substrates together on the surfaces on which the cationic polymer has been fixed.

公开(公告)号：US20180148328A1

公开(公告)日：2018-05-31

申请号：US15825818

申请日：2017-11-29

Applicant: Commissariat a l'energie atomique et aux energies alternatives

Inventor： Vincent AGACHE ,  Francois BALERAS

IPC: B81C1/00

CPC classification number: B81C1/00476 ,  B81B3/0021 ,  B81B2201/0214 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81C1/00944 ,  B81C1/00952 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0176 ,  B81C2201/0178 ,  B81C2201/0181 ,  B81C2201/019 ,  B81C2201/053

Abstract: The invention is a process for producing an electromechanical device including a movable portion that is able to deform with respect to a fixed portion. The process implements steps based on fabrication microtechnologies, applied to a substrate including an upper layer, an intermediate layer and a lower layer. These steps are: a) forming first apertures in the upper layer; b) forming an empty cavity in the intermediate layer, which step is referred to as a pre-release step because a central portion of the upper layer lying between the first apertures is pre-released; c) applying what is called a blocking layer to the upper layer, this layer covering the first apertures, the blocking layer and the central portion together forming a suspended microstructure above the empty cavity; d) producing a boundary trench in the suspended microstructure, so as to form, in this microstructure, a movable portion and a fixed portion, the movable portion forming a movable member of the electromechanical device.