公开(公告)号：US20180372563A1

公开(公告)日：2018-12-27

申请号：US16014912

申请日：2018-06-21

Applicant: University of Florida Research Foundation, Incorporated

Inventor： John E. Rogers ,  Mark Sheplak ,  Yong Kyu Yoon ,  Jack Judy

IPC: G01L1/14 ,  G01L9/00 ,  B81B3/00 ,  H01Q13/10

CPC classification number: G01L1/148 ,  B81B3/0021 ,  B81B7/02 ,  B81B2201/0264 ,  B81C2201/0143 ,  G01L9/0042 ,  G01L9/0047 ,  G01L9/0073 ,  G01L9/0077 ,  H01Q1/002 ,  H01Q1/2208 ,  H01Q9/0428 ,  H01Q13/106

Abstract: Methods and apparatuses for measuring static and dynamic pressures in harsh environments are disclosed. A pressure sensor according to one embodiment of the present invention may include a diaphragm constructed from materials designed to operate in harsh environments. A waveguide may be operably connected to the diaphragm, and an electromagnetic wave producing and receiving (e.g., sensing) device may be attached to the waveguide, opposite the diaphragm. A handle may be connected between the diaphragm and the waveguide to provide both structural support and electrical functionality for the sensor. A gap may be included between the handle and the diaphragm, allowing the diaphragm to move freely. An antenna and a ground plane may be formed on the diaphragm or the handle. Electromagnetic waves may be reflected off the antenna and detected to directly measure static and dynamic pressures applied to the diaphragm.

公开(公告)号：US20180267075A1

公开(公告)日：2018-09-20

申请号：US15763240

申请日：2016-03-18

Applicant: Hitachi, Ltd.

Inventor： Shuntaro MACHIDA ,  Nobuyuki SUGII ,  Keiji WATANABE ,  Daisuke RYUZAKI ,  Tetsufumi KAWAMURA ,  Kazuki WATANABE

IPC: G01P15/08 ,  B81C99/00

CPC classification number: G01P15/0802 ,  B81C99/001 ,  B81C99/0025 ,  B81C99/0065 ,  B81C2201/0143 ,  B81C2201/0181 ,  B81C2203/038 ,  G01P15/125

Abstract: For the purpose of shortening the MEMS manufacturing TAT, the MEMS manufacturing method according to the present invention includes a step of extracting the first MEMS with first characteristic in a range approximate to the required characteristic from the plurality of MEMS preliminarily prepared on the main surface of the substrate, and a step of forming a second MEMS having the required characteristic by directly processing the first MEMS.

公开(公告)号：US09822443B1

公开(公告)日：2017-11-21

申请号：US15010653

申请日：2016-01-29

Applicant: Multibeam Corporation

Inventor： Michael C. Smayling ,  Kevin M. Monahan ,  David K. Lam ,  Theodore A. Prescop

IPC: H01J37/30 ,  C23C14/48

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for targeted, maskless modification of material on or in a substrate using charged particle beams. Electrostatically-deflected charged particle beam columns can be targeted in direct dependence on the design layout database to perform direct and knock-on ion implantation, producing patterned material modifications with selected chemical and 3D-structural profiles. The number of required process steps is reduced, reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Local gas and photon injectors and detectors are local to corresponding individual columns, and support superior, highly-configurable process execution and control. Targeted implantation can be used to prepare the substrate for patterned blanket etch; patterned ALD can be used to prepare the substrate for patterned blanket deposition; neither process requiring photomasks or resist. Arrays of highly configurable beam columns can also be used to perform both positive and negative tone lithography in a single pass.

公开(公告)号：US20170247252A1

公开(公告)日：2017-08-31

申请号：US15444086

申请日：2017-02-27

Applicant: SMARTTIP BV

Inventor： Edin Sarajlic

IPC: B81C1/00

CPC classification number: B81C1/0015 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150396 ,  A61B5/150511 ,  A61B5/150519 ,  A61B5/150984 ,  A61B5/15142 ,  A61M37/0015 ,  B81B2201/057 ,  B81B2201/12 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00111 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0198 ,  C01B21/0687

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process, a layer of first material is deposited on a wafer comprising a plurality of pits a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits; using the second layer as a shadow mask when depositing a third layer at an angle, covering a part of the first material with said third material at the central locations, and etching the exposed parts of the first layer using the third layer as a protective layer.

公开(公告)号：US09364807B2

公开(公告)日：2016-06-14

申请号：US13635972

申请日：2011-03-10

Applicant: Christian Schoen ,  Michael Wagner

Inventor： Christian Schoen ,  Michael Wagner

IPC: B01J4/00 ,  B01D3/00 ,  B81C1/00 ,  B01L3/00

CPC classification number: B01J4/001 ,  B01L3/502707 ,  B01L3/502738 ,  B01L3/502746 ,  B01L2200/0621 ,  B01L2200/10 ,  B01L2300/0636 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0822 ,  B01L2300/0864 ,  B01L2300/0887 ,  B01L2300/161 ,  B01L2400/0406 ,  B01L2400/0688 ,  B01L2400/088 ,  B81C1/00047 ,  B81C1/00063 ,  B81C2201/0105 ,  B81C2201/0143 ,  B81C2201/0156 ,  Y10T137/85938

Abstract: The invention relates to a component (4) of a biosensor, comprising at least one first device (6) for receiving a sample liquid, wherein the device (6) is connected via a distributor channel (7) to further receiving devices (8 to 11), into each of which a feed channel (71, 72, 73, 74) branching off from the distributor channel (7) opens, and the feed channels (71, 72, 73, 74) are arranged in succession in flow direction (S) of the sample liquid passed on through the distributor channel (7). In accordance with the invention, it is envisaged that, in the distributor channel (7), in each case between two immediately successive feed channels (71, 72; 72, 73; 73, 74) in flow direction (S), at least one region (K) for at least temporary slowing or stoppage of the capillary flow of the sample liquid has been inserted. It is thus possible to control the capillary flow of the sample liquid such that always only one receiving device (8, 9, 10, 11) is filled with the volume flow of sample liquid available before the next is filled, and effectively simultaneous filling of the receiving devices (8, 9, 10, 11) is prevented. This leads to rapid and complete filling of the respective receiving device (8, 9, 10, 11). Additionally presented is a process with which the regions (K) can be inserted into the distributor channel (7) in a simple manner.

Abstract translation: 本发明涉及生物传感器的组件（4），其包括用于接收样品液体的至少一个第一装置（6），其中所述装置（6）经由分配器通道（7）连接到另外的接收装置（8至 其中，从分配器通道（7）分支出的进料通道（71,72,73,74）打开，并且进料通道（71,72,73,74）在流动方向上连续地排列 （S）通过分配器通道（7）通过的样品液体。 根据本发明，设想在分配器通道（7）中，在每种情况下，在流动方向（S）处的两个紧邻的供给通道（71,72; 72,73; 73,74）之间至少 已经插入了用于至少暂时放慢或停止样品液体的毛细管流动的区域（K）。 因此，可以控制样品液体的毛细管流动，使得总是只有一个接收装置（8,9,10,11）填充下一个填充之前可用的样品液体的体积流量，并且有效地同时填充 接收装置（8,9,10,11）被防止。 这导致相应的接收装置（8,9,10,11）的快速和完全的填充。 另外提出了一种可以简单地将区域（K）插入到分配器通道（7）中的过程。

公开(公告)号：US20150107752A1

公开(公告)日：2015-04-23

申请号：US14397054

申请日：2013-04-25

Applicant: ALERE SAN DIEGO, INC.

Inventor： Erik Mikael Olsson ,  Jonathan Riveron ,  Armando Raul Tovar

IPC: B29C65/16 ,  B29C65/08 ,  B29C59/00 ,  B29C69/00 ,  B29C45/00 ,  B29C47/00

CPC classification number: B29C65/7855 ,  B23K26/244 ,  B23K26/324 ,  B23K26/60 ,  B23K2103/30 ,  B29C59/16 ,  B29C65/08 ,  B29C65/1606 ,  B29C65/1609 ,  B29C65/1612 ,  B29C65/1616 ,  B29C65/1632 ,  B29C65/1635 ,  B29C65/1654 ,  B29C65/1664 ,  B29C65/1677 ,  B29C65/1683 ,  B29C65/1696 ,  B29C65/72 ,  B29C66/0246 ,  B29C66/028 ,  B29C66/1122 ,  B29C66/21 ,  B29C66/232 ,  B29C66/234 ,  B29C66/24244 ,  B29C66/30223 ,  B29C66/3452 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/73361 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/81267 ,  B29C66/836 ,  B29C66/9513 ,  B29C2035/0838 ,  B29C2791/009 ,  B29K2995/0027 ,  B29L2009/00 ,  B29L2031/756 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0143 ,  B81C2201/019 ,  Y10T156/1039 ,  Y10T156/1064 ,  B29K2025/06 ,  B29K2069/00 ,  B29K2033/12 ,  B29K2067/00 ,  B29K2071/00 ,  B29K2909/08

Abstract: The present invention relates to methods for joining materials as well as articles manufactured using such processes. The invention pertains to a process for joining a first substrate to a second substrate. The process includes irradiating a portion of a first substrate with a laser beam having a first wavelength and intensity sufficient to increase the absorbance of the first substrate to light having a second, different wavelength. The laser beam may carbonize at least a portion of the irradiated portion of the first substrate imparting a higher absorbance to light than non-irradiated portions of the first substrate. A second substrate is then placed in contact with the irradiated portion of the first substrate. The first substrate is then irradiated with a second laser having a second wavelength, different to the first wavelength; with a sufficient intensity to heat and, preferably melt, the irradiated portion of the first substrate.

Abstract translation: 本发明涉及用于连接材料的方法以及使用这些方法制造的制品。 本发明涉及将第一衬底接合到第二衬底的方法。 该方法包括用具有第一波长和强度的激光束照射第一衬底的一部分，该第一波长和强度足以将第一衬底的吸光度增加到具有第二不同波长的光。 所述激光束可以将所述第一基板的照射部分的至少一部分碳化，使得比所述第一基板的未照射部分赋予更高的吸光度。 然后将第二衬底放置成与第一衬底的照射部分接触。 然后用具有与第一波长不同的第二波长的第二激光器照射第一衬底; 具有足够的强度以加热并且优选地熔化第一基底的照射部分。

公开(公告)号：US20150059449A1

公开(公告)日：2015-03-05

申请号：US14478620

申请日：2014-09-05

Applicant: Technische Universiteit Delft

Inventor： Qiang Xu ,  Gregory Schneider ,  Henny Zandbergen ,  Mengyue Wu ,  Bo Song ,  Cornelis Dekker

IPC: G01N33/487 ,  B81C1/00

CPC classification number: G01N33/48721 ,  B81C1/00492 ,  B81C1/00531 ,  B81C2201/0143 ,  B81C2203/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/00 ,  G03F7/2037 ,  G03F7/2059 ,  Y10T428/24355

Abstract: A method for removing a high definition nanostructure in a partly free-standing layer, the layer, a sensor comprising said layer, a use of said sensor, and a method of detecting a species, and optional further characteristics thereof, using said sensor. The sensor and method are suited for detecting single ions, molecules, low concentrations thereof, and identifying sequences of base pairs, e.g., in a DNA-strand.

Abstract translation: 一种用于去除部分自立层中的高分辨率纳米结构的方法，该层，包括所述层的传感器，所述传感器的使用，以及使用所述传感器检测物种的方法及其可选的其它特征。 传感器和方法适用于检测单个离子，分子，低浓度，以及鉴定碱基对序列，例如DNA链。

公开(公告)号：US20140349078A1

公开(公告)日：2014-11-27

申请号：US14455745

申请日：2014-08-08

Applicant: Honeywell International Inc.

Inventor： Robert Jon Carlson

IPC: B29C33/38 ,  B81B7/00 ,  B29C41/00 ,  B29C59/16 ,  B29C59/14

CPC classification number: B29C33/3842 ,  B29C41/00 ,  B29C59/14 ,  B29C59/16 ,  B29K2909/00 ,  B29K2995/0037 ,  B81B7/00 ,  B81B2201/05 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C99/009 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/034 ,  C23F1/02 ,  H01L21/30604 ,  Y10T428/24496

Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

Abstract translation: 本发明涉及用作至少部分微机电特征的模具的图案化气凝胶基层。 气凝胶的密度小于MEMS制造中使用的典型材料的密度，例如多晶硅，氧化硅，单晶硅，金属，金属合金等。 因此，可以以明显高于在较致密的材料中形成结构特征的速率的速率在气凝胶层中形成结构特征。 本发明还包括一种图案化气凝胶层以产生这种基于气凝胶的模具的方法。 本发明还包括使用基于气凝胶的模具制造微机电特征的方法。 该方法包括将致密材料层直接沉积在已经形成在气凝胶层中的微机电特征的至少一部分的轮廓上。

公开(公告)号：US20140326702A1

公开(公告)日：2014-11-06

申请号：US14331957

申请日：2014-07-15

Applicant: Osamu NUKAGA ,  Satoshi YAMAMOTO ,  Kazuhito TABATA ,  Masakazu SUGIYAMA

Inventor： Osamu NUKAGA ,  Satoshi YAMAMOTO ,  Kazuhito TABATA ,  Masakazu SUGIYAMA

IPC: B81C1/00 ,  B23K26/00

CPC classification number: B81C1/00547 ,  B23K26/50 ,  B32B3/266 ,  B81B2201/0214 ,  B81B2201/058 ,  B81B2203/0353 ,  B81C1/00507 ,  B81C2201/013 ,  B81C2201/0143 ,  C03C15/00 ,  C03C23/0025 ,  Y10T428/24273

Abstract: A method of manufacturing a base body having a microscopic hole, includes: forming at least one of a first modified region and a second modified region by scanning inside of a base body with a focal point of a first laser light having a pulse duration on order of picoseconds or less; forming a periodic modified group formed of a plurality of third modified regions and fourth modified regions by scanning an inside of the base body with a focal point of a second laser light having a pulse duration on order of picoseconds or less; obtaining the base body which is formed so that the first modified region and the second modified region overlap or come into contact with the modified group; and forming a microscopic hole by removing the first modified region and the third modified regions by etching.

Abstract translation: 一种制造具有微小孔的基体的方法，包括：通过用具有脉冲持续时间的第一激光的焦点在基体上扫描来形成第一改质区域和第二改质区域中的至少一个 皮秒或更少; 通过用脉冲持续时间为皮秒或更小的第二激光的焦点扫描基体的内部，形成由多个第三改质区域和第四改质区域形成的周期性修饰基团; 获得形成为使得第一改质区域和第二改质区域与改性基团重叠或接触的基体; 并通过蚀刻去除第一改质区和第三改质区而形成微孔。

公开(公告)号：US20140222182A1

公开(公告)日：2014-08-07

申请号：US14169336

申请日：2014-01-31

Applicant: PowerPhotonic Ltd.

Inventor： Matthew Oren Currie ,  Simon Clovis Younger ,  Roy McBride

IPC: G05B15/02

CPC classification number: G05B19/41865 ,  B81C2201/0143 ,  Y02P90/20 ,  Y02P90/26 ,  Y10S977/889

Abstract: A process for the manufacture of custom freeform optical elements utilising parameterized modelling. A system for the automatic manufacture of a custom optical element is also described with the manufacturing being by laser micro-machining. The process and system allow customers to specify and order via a web interface and so reduce engineering time, overhead and cost.

Abstract translation: 使用参数化建模制造定制自由形状光学元件的过程。 还通过激光微加工制造用于自动制造定制光学元件的系统。 流程和系统允许客户通过Web界面指定和订购，从而减少工程时间，开销和成本。