公开(公告)号：US09717119B2

公开(公告)日：2017-07-25

申请号：US14152928

申请日：2014-01-10

Applicant: Tomas Rodinger ,  Gimmy Chu ,  Christian Yan

Inventor： Tomas Rodinger ,  Gimmy Chu ,  Christian Yan

IPC: H05B33/08 ,  F21V29/00 ,  H05K1/02 ,  F21K9/232 ,  F21Y101/00 ,  F21Y115/10 ,  F21Y107/40

CPC classification number: H05B33/0806 ,  F21K9/232 ,  F21V29/004 ,  F21V29/50 ,  F21Y2101/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/0815 ,  H05K1/0278 ,  H05K2201/047 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2203/0228 ,  Y02B20/348 ,  H01L2924/00

Abstract: An LED bulb comprises a structural shell formed by folding a flat PCB into a three-dimensional polyhedron shape and a fitting for removably coupling the bulb to a light socket. The PCB comprises a plurality of LEDs, at least one LED mounted electronically on a plurality of faces of the polyhedron, and a driver circuit for driving each LED. The perimeter of the PCB is shaped to join adjacent faces. Each LED produces minimal excess heat, which is partially conducted by a metallic heat sink bridge to the PCB and dissipated to the air through the PCB and through a plurality of spaces in the shell.

公开(公告)号：US09692476B2

公开(公告)日：2017-06-27

申请号：US14387418

申请日：2013-04-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Douglas B. Gundel ,  Zulfiqar A. Khan ,  Alexander W. Barr ,  Steven A. Neu

IPC: H04B1/40 ,  H05K1/02 ,  H04B10/80 ,  H04B1/3827 ,  H05K1/14 ,  H04B5/00 ,  H04B7/0413 ,  H05K3/36

CPC classification number: H04B1/40 ,  G02B6/4279 ,  H04B1/3827 ,  H04B5/0037 ,  H04B5/0075 ,  H04B7/0413 ,  H04B10/803 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/144 ,  H05K1/18 ,  H05K3/366 ,  H05K5/0026 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/10098 ,  H05K2201/10189

Abstract: A wireless connector includes a plurality of printed circuit boards (PCBs) (901, 902) disposed within a housing of the electronic system. Each PCB comprises a plurality of transceivers (910a, 910b, 920a, 920b) configured to wirelessly transmit and receive modulated carrier signals (910, 920). Each transceiver in the system is configured to receive signals transmitted by every other transceiver in the system.

公开(公告)号：US20170020030A1

公开(公告)日：2017-01-19

申请号：US15164895

申请日：2016-05-26

Applicant: COMPAL BROADBAND NETWORKS INC.

Inventor： Cheng-Shan Lin ,  Chung-Ming Pan

IPC: H05K7/20 ,  H05K7/18

CPC classification number: G02B6/0096 ,  H01B11/1895 ,  H01H3/12 ,  H01R9/05 ,  H01R13/646 ,  H01R33/94 ,  H02J7/0068 ,  H02J7/007 ,  H02J9/06 ,  H02M3/24 ,  H04B1/036 ,  H04W88/08 ,  H05K1/0203 ,  H05K1/14 ,  H05K7/186 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20163 ,  H05K7/20172 ,  H05K2201/047 ,  H05K2201/2018

Abstract: An electronic apparatus for processing a network communication operation includes a covering module including a lighting unit and at least one input unit; a base module including a heat-dissipation unit; a plurality of vertical electronic modules; a frame module including a plurality of connecting units for connecting the covering module and the base module to form a trapezoid column body, and the plurality of vertical electronic modules disposed to an edge of the trapezoid column body to form a column-shape wind channel; and a housing configured to cover the column-shape wind channel for protecting the plurality of vertical electronic modules.

Abstract translation: 一种用于处理网络通信操作的电子设备包括：覆盖模块，包括照明单元和至少一个输入单元; 基座模块，包括散热单元; 多个垂直电子模块; 框架模块，包括用于连接覆盖模块和基座模块以形成梯形柱体的多个连接单元，以及设置在梯形柱体的边缘上以形成柱状风道的多个垂直电子模块; 以及壳体，其构造成覆盖所述列状风道以保护所述多个垂直电子模块。

公开(公告)号：US20160359426A1

公开(公告)日：2016-12-08

申请号：US15103617

申请日：2014-12-11

Applicant: ROMPOWER ENERGY SYSTEMS INC.

Inventor： Ionel Jitaru ,  Ian Poynton ,  Enrique Velasco

IPC: H02M7/00 ,  H02M7/21 ,  H05K1/14 ,  H05K1/02 ,  H05K9/00 ,  H05K1/18

CPC classification number: H02M7/003 ,  H02M7/21 ,  H05K1/0203 ,  H05K1/0256 ,  H05K1/14 ,  H05K1/181 ,  H05K3/366 ,  H05K9/0071 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/047 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10166

Abstract: Meeting todays requirement in power supply technology demands significant technological advancement in optimizing circuit topology, components and materials, thermal and packaging designs. These requirements are being pushed mainly by continuously increasing power density and efficiency requirements. Ultimately, these trends will come to a point whereby limitations from the above mentioned technological advancements is dependent on one of the above, which is the packaging design. To realize this dependence, we need to look at the growing power systems for modern equipment out there. Let us enumerate some of the available AC adapters in terms of power densities of a 45 W adapter. Firstly, square type architecture introduced by Apple is about 7 W/in3, considering the packaging has a profile limitation whereby its AC plug is removable thus occupying relatively bigger chunk of the volume. The next one is by Asus of similar profile to Apple incorporating the AC Plug eliminating the socket assembly in the packaging; which packs about 9 W/in3. Lastly, the typical rectangular profile by Eos which is about 7 W/in3. As for this particular embodiment it is about 40% smaller in profile, in contrast to the 45 W Apple packaging, with increase power density of about 12 W/in3. Packaging design method plays a great role in achieving the above requirements for a very high density converters.

Abstract translation: 电源技术的今天要求在优化电路拓扑，组件和材料，热和封装设计方面需要显着的技术进步。 这些要求主要是通过不断提高功率密度和效率要求来推动的。 最终，这些趋势将会出现，上述技术进步的限制取决于上述之一，即包装设计。 为了实现这种依赖，我们需要看现在的设备不断增长的电力系统。 在45 W适配器的功率密度方面，我们列举一些可用的交流适配器。 首先，Apple推出的Square型架构约为7W / in3，考虑到封装具有配置限制，其AC插头可拆卸，因此占据相对较大的块体积。 接下来的一个是华硕与苹果相似的配置，包括交流插头，消除了包装中的插座组件; 其中包装约9 W / in3。 最后，Eos的典型矩形轮廓约为7 W / in3。 对于这个特定的实施例，与45W苹果包装相比，其功率密度增加约为12W / in3，约为40％。 包装设计方法对于实现上述高密度转换器的要求起着重要作用。

公开(公告)号：US09408309B2

公开(公告)日：2016-08-02

申请号：US14305453

申请日：2014-06-16

Applicant: OLYMPUS CORPORATION

Inventor： Takanori Sekido

IPC: H05K7/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/183 ,  H01L2224/16227 ,  H01L2924/15156 ,  H01L2924/15157 ,  H01L2924/1627 ,  H05K1/0284 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/047

Abstract: An electronic component mounting structure includes a three-dimensional substrate having a three-dimensional shape and including a hollow portion formed on at least one of side surfaces of the three-dimensional substrate, and an electronic component mounted on a bottom face of the hollow portion. The three-dimensional substrate includes an opening portion on a side surface different from a side surface on which the hollow portion is formed for allowing observation of a connection portion between the bottom face of the hollow portion and the electronic component from an outer periphery side of the three-dimensional substrate.

Abstract translation: 电子部件安装结构包括具有三维形状的三维基板，并且包括形成在三维基板的至少一个侧表面上的中空部分，以及安装在中空部分的底面上的电子部件 。 三维基板包括在与形成有中空部分的侧表面不同的侧表面上的开口部分，用于允许从中空部分的底面与电子部件之间的连接部分从外周侧观察到 三维基板。

公开(公告)号：US20160169495A1

公开(公告)日：2016-06-16

申请号：US14953814

申请日：2015-11-30

Applicant: Augustine J. DiCiacce

Inventor： Augustine J. DiCiacce

IPC: F21V23/06 ,  F21V23/00

CPC classification number: A63H33/044 ,  A63H33/042 ,  B44C3/12 ,  B44C5/00 ,  G09F19/02 ,  H05K1/14 ,  H05K2201/047 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10424

Abstract: An illuminated modular decorative article includes a base control panel and a side panel. The base control panel includes a base, a first electrical/mechanical connection interface, and a power source. The side panel includes a base, a second electrical/mechanical connection interface, and illumination sources. The first electrical/mechanical connection interface connects to the second electrical/mechanical connection interface to electrically connect the base control panel to the side panel and to mechanically connect the base control panel substantially orthogonally to the side panel.

Abstract translation: 照明的模块化装饰品包括底座控制面板和侧面板。 基座控制面板包括基座，第一电/机械连接接口和电源。 侧面板包括基座，第二电气/机械连接接口和照明源。 第一电气/机械连接接口连接到第二电气/机械连接接口，以将基座控制面板电连接到侧面板，并且将基座控制面板基本正交地与侧面板连接。

公开(公告)号：US20160084479A1

公开(公告)日：2016-03-24

申请号：US14786792

申请日：2014-04-28

Applicant: CCS INC.

Inventor： Takuzo TOGAWA

IPC: F21V15/01 ,  F21V23/02

CPC classification number: F21V15/01 ,  F21V19/003 ,  F21V23/001 ,  F21V23/02 ,  F21V29/507 ,  F21Y2107/50 ,  F21Y2107/80 ,  G01N21/8806 ,  H05K1/148 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10106

Abstract: A lighting apparatus which provides an heat dissipation effect, high output and large light emitting area including: housing having rectangular cylindrical shape obtained by forming belt-like body including plurality of holding bodies in rectangular cylindrical shape and connecting end portions of belt-like body formed in rectangular cylindrical shape; and circuit board mounted on inner surface of the housing and including a light source. The circuit board includes: mounting portion mounted on inner surface of the housing and having a surface provided with the light source; and connecting portion which connects mounting portions adjacent to each other in peripheral direction of the housing and is bendable at a corner of adjacent inner surfaces of the housing, and rear surface of mounting portion contacts inner surface of the holding body. Therefore, it is possible to provide lighting apparatus which provides an excellent heat dissipation effect, high output and large light emitting area.

Abstract translation: 一种提供散热效果，高输出和大发光面积的照明装置，包括：具有矩形圆柱形状的壳体，其通过形成包括多个矩形保持体的带状体形成，并且形成带状体的连接端部 矩形圆柱形; 并且电路板安装在壳体的内表面上并且包括光源。 电路板包括：安装部分，其安装在壳体的内表面上并具有设置有光源的表面; 以及连接部，其在壳体的周向连接彼此相邻的安装部，并且能够在壳体的相邻内表面的角部弯曲，并且安装部的后表面接触保持体的内表面。 因此，可以提供提供优异的散热效果，高输出和大的发光面积的照明装置。

公开(公告)号：US09215799B2

公开(公告)日：2015-12-15

申请号：US14684857

申请日：2015-04-13

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Shunjiro Takemori ,  Shigeru Narakino

IPC: H05K1/02 ,  G06F21/86 ,  H05K5/02 ,  H05K1/14

CPC classification number: H05K1/0275 ,  G06F21/86 ,  H05K1/0213 ,  H05K1/141 ,  H05K1/147 ,  H05K5/0208 ,  H05K2201/0314 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2203/178

Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.

Abstract translation: 终端单元包括主板，在主板上实现的电子部件，覆盖在电子部件上的子板，以及围绕电子部件设置在主板和子板之间的框架部件。 柔性印刷电路覆盖框架构件的壁部的外侧，并且被从壁部的上侧和下侧卷绕在框架构件上以覆盖壁部的内侧的至少一部分。 形成在柔性印刷电路上的布线图案电连接到电子部件，并且如果布线图案被切断或短路，则存储在电子部件上的要被保护的信息变得不可读。

公开(公告)号：US20140355270A1

公开(公告)日：2014-12-04

申请号：US14457859

申请日：2014-08-12

Applicant: Cree, Inc.

Inventor： George R. Brandes ,  Julio A. Garceran

IPC: F21K99/00 ,  F21V29/02 ,  F21V15/01 ,  F21V29/00

CPC classification number: F21V29/70 ,  F21K9/135 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21K9/60 ,  F21K9/64 ,  F21K9/90 ,  F21V3/049 ,  F21V3/08 ,  F21V3/12 ,  F21V23/005 ,  F21V23/02 ,  F21V29/006 ,  F21V29/506 ,  F21V29/507 ,  F21V29/51 ,  F21V29/57 ,  F21V29/677 ,  F21V29/74 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10 ,  F21Y2115/30 ,  H05K2201/047 ,  H05K2201/10106 ,  Y10S362/80 ,  Y10T29/4913

Abstract: LED light bulbs include openings in base or cover portions, and optional forced flow elements, for convective cooling. Thermally conductive optically transmissive material may be used for cooling, optionally including fins. A LED light engine may be fabricated from a substrate via planar fabrication techniques and shaped to form a substantially rigid upright support structure. Mechanical, electrical, and thermal connections may be made between a LED light engine and a LED light bulb.

Abstract translation: LED灯泡包括底座或盖部分的开口，以及可选的强制流动元件，用于对流冷却。 导热透光材料可用于冷却，可选地包括翅片。 LED光引擎可以通过平面制造技术由衬底制造并成形为形成基本刚性的直立支撑结构。 机械，电气和热连接可以在LED光引擎和LED灯泡之间进行。

公开(公告)号：US20140293531A1

公开(公告)日：2014-10-02

申请号：US13851750

申请日：2013-03-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Robert J. Brooks ,  Scott Michael Fehringer

IPC: G06F1/16 ,  H05K3/00 ,  G06F1/20

CPC classification number: H05K3/00 ,  G06F1/18 ,  G06F1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F2200/201 ,  H05K1/148 ,  H05K7/1487 ,  H05K2201/047 ,  H05K2201/10159 ,  Y10T29/4913

Abstract: According to an example, a server node may include a base module and a plurality of face modules rotatably coupled to the base module to form an enclosure. The base module and a face module of the plurality of face modules may each include an inner surface that includes an electrical component. A flexible printed circuit interconnect may communicatively interconnect the electrical component on the inner surface of the base module to the electrical component on the inner surface of the face module.

Abstract translation: 根据示例，服务器节点可以包括基本模块和可旋转地联接到基本模块以形成外壳的多个面模块。 多个面部模块的基座模块和面部模块可以各自包括包括电气部件的内表面。 柔性印刷电路互连可以将基座模块的内表面上的电气部件可通信地互连到面部模块的内表面上的电气部件。