公开(公告)号：US20080158834A1

公开(公告)日：2008-07-03

申请号：US11952406

申请日：2007-12-07

Applicant: Tomohide Ogura ,  Motoyoshi Kitagawa

Inventor： Tomohide Ogura ,  Motoyoshi Kitagawa

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/3463 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1572

Abstract: A module includes a board having a through-hole provided therein, an auxiliary board provided on a lower surface of the board, a first electronic component mounted on an upper surface of the board, a conductive cover covering the first electronic component, and a second electronic component mounted on an upper surface of the auxiliary board. The auxiliary board includes a sealing portion sealing the through-hole. The second electronic component is positioned in the through-hole provided in the board and on the upper surface of the auxiliary board. The second electronic component is taller than the first electronic component. This module is thin.

Abstract translation: 模块包括：具有设置在其中的通孔的板，设置在板的下表面上的辅助板，安装在板的上表面上的第一电子部件，覆盖第一电子部件的导电盖， 电子部件安装在辅助板的上表面上。 辅助板包括密封通孔的密封部分。 第二电子部件定位在设置在板中的通孔中和辅助板的上表面上。 第二电子部件比第一电子部件高。 这个模块很薄。

公开(公告)号：US07372515B2

公开(公告)日：2008-05-13

申请号：US10994733

申请日：2004-11-22

Applicant: Jeoung-Gwen Lee ,  Seung-Je Lee ,  Hyun-Su Park

Inventor： Jeoung-Gwen Lee ,  Seung-Je Lee ,  Hyun-Su Park

IPC: G02F1/1335

CPC classification number: H05K1/182 ,  G02B6/0031 ,  G02B6/0055 ,  G02B6/0065 ,  G02B6/0083 ,  G02B6/0088 ,  G02B6/009 ,  G02F1/133308 ,  G02F1/1336 ,  G02F1/133608 ,  G02F1/133615 ,  G02F1/13452 ,  G02F2001/133314 ,  G02F2201/465 ,  G06F1/1616 ,  G06F1/1637 ,  G06F1/1654 ,  H04M1/22 ,  H05K1/141 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/1003 ,  H05K2201/10189

Abstract: Disclosed is a liquid crystal display device of which overall size and weight can be minimized. The liquid crystal display device has a light generating unit for generating a light. A light guiding plate guides the light to a display unit for displaying an image. A reflection plate is disposed under the light guiding plate for reflecting the light to the light guiding plate. A receiving container receives the reflection plate, the light guiding plate and the light generating unit. At least one boss is formed on a bottom of the receiving container for preventing the light generating unit from being moved by guiding a position of the light generating unit. Accordingly, the number of the parts installed in the liquid crystal display device can be reduced, and the manufacturing cost can be decreased because the manufacturing process is simplified in comparison with the liquid crystal display device including a separate lamp cover.

Abstract translation: 公开了一种液晶显示装置，其总体尺寸和重量可以最小化。 液晶显示装置具有用于产生光的光产生单元。 导光板将光引导到用于显示图像的显示单元。 反射板设置在导光板的下方，用于将光反射到导光板。 接收容器容纳反射板，导光板和光产生单元。 在接收容器的底部形成有至少一个凸台，用于通过引导光产生单元的位置来防止光产生单元的移动。 因此，与包括单独的灯罩的液晶显示装置相比，可以减少安装在液晶显示装置中的部件的数量，并且制造成本可以降低，因为制造工艺简化。

公开(公告)号：US07344918B2

公开(公告)日：2008-03-18

申请号：US11384964

申请日：2006-03-20

Applicant: Donald T. Tran

Inventor： Donald T. Tran

IPC: H01L23/02

CPC classification number: H01L23/50 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/183 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10409 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00

Abstract: In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.

Abstract translation: 在一些示例性实施例中，集成电路，电子组件和方法提供用于向处理器供电的电流路径。 作为示例，集成电路包括具有从基座的上表面延伸的电力触点的基座。 集成电路还包括安装到基座的上表面以将基板电耦合到基座的基板。 模具安装在基板上，使得模具电耦合到基板。 基座上表面上的电源触点接合子板，使得管芯能够通过基座上表面上的电源触点从安装在子板上的电压源接收电力。

公开(公告)号：US20080014770A1

公开(公告)日：2008-01-17

申请号：US11606098

申请日：2006-11-30

Applicant: Yaw-Huey Lai

Inventor： Yaw-Huey Lai

IPC: H05K1/00

CPC classification number: H05K1/141 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/09172 ,  H05K2201/10189

Abstract: A coupling assembly includes a first board and a second board. The first board includes a plurality of first conductive pieces located at an end surface thereof and spaced from one another in a predetermined interval. The second board includes a plurality of second conductive pieces spaced from one another in a predetermined interval and located at at least one end surface thereof close to a lateral edge thereof. The second board includes a plurality of recessed portions recessed inward from the lateral edge thereof and located among the second conductive pieces. The first and second boards are perpendicular to each other. The conductive pieces of at least one of the two boards are provided with soldering. The soldering of each of the conductive pieces is heated to liquate out and then contact the perpendicular corresponding conductive pieces to couple the corresponding first and second conductive pieces with each other.

Abstract translation: 联接组件包括第一板和第二板。 第一板包括位于其端表面并以预定间隔彼此间隔开的多个第一导电片。 第二板包括以预定间隔彼此间隔开的多个第二导电片，并位于靠近其侧边缘的至少一个端面。 第二板包括从其侧边缘向内凹陷并位于第二导电片之间的多个凹陷部分。 第一和第二板彼此垂直。 两个板中的至少一个的导电片设置有焊接。 每个导电片的焊接被加热以液化，然后与垂直相对应的导电片接触，以将相应的第一和第二导电片彼此耦合。

公开(公告)号：US20070279880A1

公开(公告)日：2007-12-06

申请号：US11757261

申请日：2007-06-01

Applicant: Steve WEIR ,  Scott MCMORROW

Inventor： Steve WEIR ,  Scott MCMORROW

IPC: H05K1/11

CPC classification number: H05K1/141 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/3011 ,  H03H7/01 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0263 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09254 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.

公开(公告)号：US20070257349A1

公开(公告)日：2007-11-08

申请号：US11774846

申请日：2007-07-09

Applicant: James Wehrly ,  David Roper

Inventor： James Wehrly ,  David Roper

IPC: H01L23/02 ,  H01L23/52

CPC classification number: H05K1/147 ,  H01L23/49827 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3421 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: There is provided a stacked IC module including first and second leaded packages in stacked disposition, each of the first and second leaded packages having plural leads emergent along at least one side of each of the respective leaded packages, and a flexible circuit disposed in part between the first and second leaded packages, wherein the flexible is folded back on itself to create an arcuate connective field that is compressed to have conformity with the plural leads of the first and second leaded packages.

Abstract translation: 提供了一种堆叠IC模块，包括堆叠配置的第一和第二引线封装，每个第一和第二引线封装具有多个引线沿着每个相关引线封装的至少一侧出现，并且柔性电路部分地设置在 第一和第二引线封装，其中柔性件自身折回以产生被压缩以与第一和第二引线封装的多个引线一致的弓形连接场。

公开(公告)号：US20070238324A1

公开(公告)日：2007-10-11

申请号：US11399351

申请日：2006-04-07

Applicant: Der-Yu Ho

Inventor： Der-Yu Ho

IPC: H01R12/00

CPC classification number: H01R13/22 ,  H01R12/7076 ,  H05K1/0313 ,  H05K1/141 ,  H05K3/325 ,  H05K3/403 ,  H05K2201/0133 ,  H05K2201/049 ,  H05K2201/0949 ,  H05K2201/10378

Abstract: An electrical connector for connection between two electronic devices by means of compressive contact is disclosed to include an electrically insulative connector body, which has a plurality of through holes cut through the top and bottom surfaces thereof, a plurality of conductors respectively formed on the top and bottom surface of the electrically insulative body, and a connection structure, which is formed of a conducting material covered on the surface of each of the through holes to electrically connect the conductors on the top surface of the electrically insulative connector body to the conductors on the bottom surface of the electrically insulative connector body respectively.

Abstract translation: 公开了一种用于通过压缩接触连接在两个电子设备之间的电连接器，其包括电绝缘连接器体，其具有穿过其顶表面和底表面的多个通孔，分别形成在顶部和 电绝缘体的底表面，以及连接结构，其由覆盖在每个通孔的表面上的导电材料形成，以将电绝缘连接器主体的顶表面上的导体电连接到电绝缘体的导体上 电绝缘连接器主体的底面。

公开(公告)号：US20070133188A1

公开(公告)日：2007-06-14

申请号：US11555777

申请日：2006-11-02

Applicant: Yi-Hsiung Su

Inventor： Yi-Hsiung Su

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/144 ,  G06F1/185 ,  H05K1/117 ,  H05K2201/049 ,  H05K2201/10189

Abstract: The present invention discloses an apparatus for operatively connecting a PCI-X or AGP device card (having a PCI-X or AGP bus) to a PCI-E bus connection on a mother board by mounting the PCI-X or AGP device card to a right edge connector mounted on a surface of an adapter card, the adapter card having a PCI-X (or AGP) to PCI-E bridge circuit for interconnecting a PCI-X (or AGP) bus to a PCI-E bus.

Abstract translation: 本发明公开了一种用于通过将PCI-X或AGP设备卡安装到主板上来将PCI-X或AGP设备卡（具有PCI-X或AGP总线）可操作地连接到母板上的PCI-E总线连接的装置 右侧连接器安装在适配器卡的表面上，适配器卡具有用于将PCI-X（或AGP）总线与PCI-E总线互连的PCI-E桥接电路的PCI-X（或AGP）。

公开(公告)号：US20070104926A1

公开(公告)日：2007-05-10

申请号：US11595088

申请日：2006-11-09

Applicant: Christian Goebl ,  Rainer Popp

Inventor： Christian Goebl ,  Rainer Popp

IPC: B32B15/04 ,  B32B3/02

CPC classification number: H01L25/165 ,  H01L23/3675 ,  H01L24/33 ,  H01L25/162 ,  H01L2924/1301 ,  H01L2924/13091 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/366 ,  H05K7/20445 ,  H05K7/209 ,  H05K2201/0352 ,  H05K2201/049 ,  H05K2201/09736 ,  H05K2201/10674 ,  Y10T428/24777 ,  Y10T428/31678 ,  H01L2924/00

Abstract: A frequency converter is presented. The frequency converter includes a circuit module, which is interconnected to a circuit board and is connected to a heat sink. For attaining a frequency converter in a modular version with optimal cooling properties, the circuit module has a flexible, electrically insulating plastic film, which on one side has a circuit-structured logic metal layer and on the opposite side has a circuit-structured power metal layer that is contacted with a contact edge to a peripheral portion of the circuit board. The flexible circuit module protrudes at an angle away from the circuit board. Power semiconductor chips are contacted on the power metal layer. A substrate is secured to the heat sink and is embodied with a circuit structure for contacting the power semiconductor chips.

Abstract translation: 提出了一种变频器。 变频器包括电路模块，其连接到电路板并连接到散热器。 为了以具有最佳冷却特性的模块化版本获得变频器，电路模块具有柔性的电绝缘塑料膜，其一侧具有电路结构的逻辑金属层，并且在相对侧上具有电路结构的功率金属 该层与电路板的周边部分的接触边缘接触。 柔性电路模块以远离电路板的角度突出。 功率半导体芯片在功率金属层上接触。 基板被固定到散热器，并且具有用于接触功率半导体芯片的电路结构。

公开(公告)号：US20060258205A1

公开(公告)日：2006-11-16

申请号：US11432586

申请日：2006-05-11

Applicant: Ivo Locher ,  Gerhard Troester

Inventor： Ivo Locher ,  Gerhard Troester

IPC: H01R33/945

CPC classification number: H05K1/038 ,  A41D1/005 ,  D03D1/0088 ,  D10B2401/16 ,  D10B2401/18 ,  H01L23/49894 ,  H01L24/18 ,  H05K1/141 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/049

Abstract: The invention relates to a textile comprising a conductor line system and a method for its production. The conductor line system has an arrangement of a plurality of electric conductor lines. At least one electric component is connected to specific electric conductor lines. In accordance with the invention an adapter element is arranged between the electric component and the conductor line system. On one side the adapter element has at least one connecting portion that is adapted to the arrangement of the electric conductor lines. On the other side the adapter element has at least one connecting portion that is adapted to a connecting arrangement of the electric component.

Abstract translation: 本发明涉及一种包括导线系统的织物及其生产方法。 导线系统具有多根导电线的布置。 至少一个电气部件连接到特定的导电线。 根据本发明，适配器元件布置在电气部件和导线系统之间。 在一侧，适配器元件具有至少一个连接部分，该连接部分适合于电导线的布置。 在另一侧，适配器元件具有至少一个连接部分，其适于电气部件的连接装置。