公开(公告)号：US20110308850A1

公开(公告)日：2011-12-22

申请号：US12841518

申请日：2010-07-22

Applicant: Hsiang-Chih Ni ,  Ching-Feng Hsieh

Inventor： Hsiang-Chih Ni ,  Ching-Feng Hsieh

IPC: H05K1/11 ,  B23K31/02

CPC classification number: H05K1/111 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/0939 ,  Y02P70/611

Abstract: A notch positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least one notch, and the solder pads are installed in an alignment direction on the printed circuit board, such that the notch positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract translation: 凹口定位型焊接结构和防止引脚偏移的方法可以防止当引脚​​通过焊料焊接到印刷电路板上时电子部件的多个引脚偏离，并且至少两个焊盘中的每一个包括 至少一个切口，并且焊盘沿着印刷电路板上的排列方向安装，使得凹口定位型焊接结构和防止引脚偏离的方法可以提高制造工艺的效率并降低制造成本。

公开(公告)号：US20110284277A1

公开(公告)日：2011-11-24

申请号：US13106991

申请日：2011-05-13

Applicant: Hisashi KATO

Inventor： Hisashi KATO

IPC: H05K1/00

CPC classification number: H05K1/113 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/3489 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/0939 ,  H05K2201/0969 ,  H05K2203/041 ,  H05K2203/0557

Abstract: A printed wiring board including an insulation layer, a conductive circuit on the insulation layer, an outermost interlayer resin insulation layer formed on the insulation layer and the conductive circuit and having a via-conductor opening connected to the conductive circuit, a land structure including a first land formed on the outermost interlayer resin insulation layer around the via-conductor opening and a second land formed on the outermost interlayer resin insulation layer around the first land, and a via conductor formed in the via-conductor opening through the outermost interlayer resin insulation layer such that the first land of the land structure on the outermost interlayer resin insulation layer is connected to the conductive circuit on the insulation layer. The land structure has a space between the first land and second land of the land structure, and the first land of the land structure is directly connected to the via conductor.

Abstract translation: 一种印刷线路板，包括绝缘层，绝缘层上的导电电路，形成在绝缘层上的最外层间树脂绝缘层和导电电路，并具有连接到导电电路的通路导体开口， 在通孔导体开口周围的最外层间树脂绝缘层上形成的第一焊盘和形成在第一焊盘周围的最外层间树脂绝缘层上的第二焊盘，以及通过最外层间树脂绝缘体形成在通孔导体开口中的通孔导体 使得最外层间树脂绝缘层上的焊盘结构的第一焊盘与绝缘层上的导电电路连接。 土地结构在土地结构的第一个土地和第二个土地之间有一个空间，土地结构的第一个土地直接连接到通道。

公开(公告)号：US07416106B1

公开(公告)日：2008-08-26

申请号：US10674080

申请日：2003-09-29

Applicant: Stuart D. Downes ,  Jin Liang ,  Larry Norris

Inventor： Stuart D. Downes ,  Jin Liang ,  Larry Norris

IPC: B23K31/02

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  B23K2101/42 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming, for each pad profile, a soldering pad having a set of radii corresponding to the set of rounded corners of that pad profile to create a set of soldering pads for the component mounting location. Each soldering pad is configured for a high bond strength solder joint. The technique further involves removing the mask layer from the circuit board and soldering a component to the component mounting location. This technique is well-suited for robustly mounting the component to the circuit board at solder joints with relatively high solder joint bond strengths.

Abstract translation: 一种用于处理电路板的技术包括将掩模层放置在电路板上，其中掩模层限定用于部件安装位置的一组焊盘轮廓。 每个垫子轮廓都有一组圆角。 该技术还涉及为每个焊盘型材形成具有与该焊盘型材的一组圆角对应的一组半径的焊盘，以形成用于部件安装位置的一组焊盘。 每个焊盘都配置为高粘结强度的焊点。 该技术还包括从电路板去除掩模层并将部件焊接到部件安装位置。 这种技术非常适合在具有相对高的焊点接合强度的焊点处牢固地将部件安装到电路板上。

公开(公告)号：US06405920B1

公开(公告)日：2002-06-18

申请号：US09614830

申请日：2000-07-12

Applicant: Bjoern Erik Brunner ,  Vivek Amir Jairazbhoy ,  Richard Keith McMillan

Inventor： Bjoern Erik Brunner ,  Vivek Amir Jairazbhoy ,  Richard Keith McMillan

IPC: B23K3102

CPC classification number: H05K3/3442 ,  H05K1/111 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/10636 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

Abstract translation: 这里公开了一种印刷电路板（PCB），其具有用于套印锡膏和修补焊点的增强安装垫。 PCB包括：电介质基板10，其上具有至少一个安装垫20，其中每个安装垫以与电子部件30的相应端子32相配的关系布置。每个安装垫20包括主体部分24和一个或 更多的手指状的延伸部分26从主体部分向外延伸并且远离电子部件的投影足迹34。

公开(公告)号：US6111204A

公开(公告)日：2000-08-29

申请号：US246864

申请日：1999-02-08

Applicant: Lakhi Nandlal Goenka

Inventor： Lakhi Nandlal Goenka

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K2201/0361 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09736 ,  H05K2201/09772 ,  H05K2201/098 ,  H05K3/062 ,  H05K3/4685 ,  Y02P70/611

Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising: an electrically insulative substrate surface, a plurality of tri-metal-layer bond pads arranged in a generally straight row on the substrate surface wherein the row defines a width direction therealong, and a circuit trace arranged on the substrate surface, wherein the circuit trace runs between two adjacent ones of the plurality of tri-metal-layer bond pads. Each bond pad comprises: (1) a bottom layer attached to the substrate surface, the bottom layer being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer disposed above and generally concentric with the bottom layer, the top layer being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer made of a second metal connecting the bottom layer and the top layer. The bond pads are specially shaped such that W2>W1 for at least the two adjacent bond pads, thus enabling the circuit trace to be spaced closely to the bottom layers of the two adjacent bond pads, while allowing the top layers of the pads to be made much larger so as to avoid delamination thereof from their associated middle layers.

Abstract translation: 专为细间距应用设计的蚀刻三金属层空气桥接电路板，包括：电绝缘基板表面，多个三基金属层接合焊盘，其布置在基板表面上的大致直线上，其中该行 限定其宽度方向和布置在基板表面上的电路迹线，其中电路迹线在多个三金属层接合焊盘中的两个相邻的三个金属层接合焊盘之间延伸。 每个接合焊盘包括：（1）附着到基板表面的底层，底层由第一金属制成，具有沿宽度方向测量的总宽度W1; （2）顶层，其设置在所述底层的上方并且与所述底层大致同心，所述顶层由所述第一金属制成，并且具有沿宽度方向测量的总宽度W2; 和（3）由连接底层和顶层的第二金属制成的中间层。 接合焊盘是特别成形的，使得W2> W1用于至少两个相邻的接合焊盘，从而使得电路迹线能够与两个相邻接合焊盘的底层紧密地间隔开，同时允许焊盘的顶层为 做得更大，以避免与其相关联的中间层分层。

公开(公告)号：US5982626A

公开(公告)日：1999-11-09

申请号：US868256

申请日：1997-06-03

Applicant: Masahiro Kodama

Inventor： Masahiro Kodama

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01R12/61 ,  H05K1/118 ,  H05K3/363 ,  H05K1/0393 ,  H05K1/14 ,  H05K2201/048 ,  H05K2201/091 ,  H05K2201/09181 ,  H05K2201/0939 ,  H05K2203/167

Abstract: A flexible printed circuit board assembly comprising a first flexible printed circuit board and a second flexible printed circuit board, wherein each of the first and second flexible printed circuit boards is provided with a position fixing coupling to determine the position of the second flexible printed circuit board relative to the first flexible printed circuit board.

Abstract translation: 一种柔性印刷电路板组件，包括第一柔性印刷电路板和第二柔性印刷电路板，其中第一和第二柔性印刷电路板中的每一个设置有位置固定联接器，以确定第二柔性印刷电路板的位置 相对于第一柔性印刷电路板。

公开(公告)号：US5859474A

公开(公告)日：1999-01-12

申请号：US839052

申请日：1997-04-23

Applicant: Yezdi N. Dordi

Inventor： Yezdi N. Dordi

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48

CPC classification number: H05K3/3436 ,  H01L23/3128 ,  H01L23/49816 ,  H05K1/111 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H05K2201/09227 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

Abstract: A first array of elongate pads is formed on a first surface, such as that of an integrated circuit substrate, and a second array of elongate pads is formed on a second surface, such as that of a printed circuit board. An array of solder balls are reflow attached to the pads of the first array and then to the pads of the second array, to thereby electrically connect the substrate to the printed circuit board. The reflow solder balls thereby conform to the elongate shapes of the pads to be configured like truncated ellipsoids. Due to the surface tension forces between the pads and the balls therebetween, the "ellipsoids" advantageously have a high standoff. Also, the pads on each of the sides of the perimeter of the array are aligned longitudinally perpendicular to the respective sides. Thereby, wide channels between adjacent elongate pads are defined, through which one or more additional traces can advantageously be routed on the surface between the pads.

Abstract translation: 在第一表面（例如集成电路基板的第一表面）上形成第一阵列的细长焊盘，并且第二阵列的细长焊盘形成在诸如印刷电路板的第二表面上。 一组焊球被回流焊接到第一阵列的焊盘上，然后连接到第二阵列的焊盘，从而将衬底电连接到印刷电路板。 回流焊球因此符合要被配置为截头椭圆体的焊盘的细长形状。 由于垫片和其间的球之间的表面张力，“椭圆体”有利地具有高的间隔。 此外，阵列周边的每个侧面上的焊盘在纵向垂直于相应的侧面对准。 因此，限定相邻细长焊盘之间的宽通道，一个或多个附加迹线可以通过该宽通道在焊盘之间的表面上有利地布线。

公开(公告)号：US5627730A

公开(公告)日：1997-05-06

申请号：US606663

申请日：1996-02-26

Applicant: Walter Konig ,  Albert Modl ,  Peter F. Baur

Inventor： Walter Konig ,  Albert Modl ,  Peter F. Baur

IPC: H01R12/50 ,  H01R12/52 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H01R13/40

CPC classification number: H01R13/2414 ,  H01R12/52 ,  H01R12/714 ,  H01R23/6873 ,  H05K3/325 ,  H05K3/368 ,  H05K1/117 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10378 ,  H05K2201/10719

Abstract: A printed circuit board assembly which includes a two-dimensional array of connectors to provide significantly higher data transfer rates than typical one-dimensional connectors, without sacrificing board space. The assembly preferably includes a plurality of connection pads on each printed circuit board. An anisotropically conducting material is placed between the connection pads and the boards pressed together.

Abstract translation: 一种印刷电路板组件，其包括连接器的二维阵列，以提供比典型的一维连接器显着更高的数据传输速率，而不牺牲电路板空间。 组件优选地包括在每个印刷电路板上的多个连接焊盘。 将各向异性导电材料放置在连接垫和压在一起的板之间。

公开(公告)号：US5471090A

公开(公告)日：1995-11-28

申请号：US28023

申请日：1993-03-08

Applicant: Alina Deutsch ,  David A. Lewis ,  Chandrasekhar Narayan ,  Anthony L. Plachy

Inventor： Alina Deutsch ,  David A. Lewis ,  Chandrasekhar Narayan ,  Anthony L. Plachy

IPC: H01L23/12 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H01L23/48 ,  H01L29/44

CPC classification number: H01L23/5385 ,  H05K1/0216 ,  H05K1/111 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0289 ,  H05K2201/0373 ,  H05K2201/0792 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/10719 ,  H05K2203/061 ,  H05K3/4614 ,  Y02P70/611

Abstract: Electrical interconnection structures are described. The electrical interconnection structures are formed by electrically interconnecting in a stack a plurality of discrete substrates. By using a plurality of discrete substrates, a multilayer dielectric/electrical conductor structure can be fabricated from individual discrete substrates each of which can be tested prior to forming a composite stack so that defects in each discrete substrate can be eliminated before inclusion into the stack. Electrical interconnection between adjacent substrate is provided by an array of contact locations on each surface of the adjacent substrates. Corresponding contacts on adjacent substrates are adapted for mutual electrical engagement. Adjacent contact locations can be thermocompression bonded. To reduce the parasitic capacitance and coupled noise between the contact pads and the electrical conductors within the interior of each discrete substrate, the contact pads on each substrate have elongated shape. The elongated contact pads or lattice pads on adjacent substrates are nonparallel and preferably orthogonal so that the corresponding pads of adjacent substrates electrically interconnect an intersecting area which varies in location along the elongated contact pads as the placement of the adjacent substrates varies in the manufacture.

Abstract translation: 描述电互连结构。 电互连结构通过在堆叠中电互连而形成，多个分立的衬底。 通过使用多个分立的衬底，多层电介质/电导体结构可以由单独的离散衬底制成，每个离散衬底可以在形成复合堆叠之前进行测试，以便在包含在堆叠中之前可以消除每个离散衬底中的缺陷。 相邻基板之间的电气互连通过相邻基板的每个表面上的接触位置阵列来提供。 相邻基板上的相应触点适于相互电接合。 相邻的接触位置可以热压粘合。 为了减小接触焊盘和每个离散衬底内部的电导体之间的寄生电容和耦合噪声，每个衬底上的接触焊盘具有细长形状。 相邻基板上的细长接触焊盘或网格焊盘是不平行的并且优选地是正交的，使得相邻衬底的相应焊盘在制造中随着相邻衬底的布置变化而沿着细长的接触焊盘将位置变化的相交区域电连接。

公开(公告)号：US5453581A

公开(公告)日：1995-09-26

申请号：US112928

申请日：1993-08-30

Applicant: Henry F. Liebman ,  Peter E. Albertson

Inventor： Henry F. Liebman ,  Peter E. Albertson

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

Abstract: A pad arrangement (100) for aligning and attaching a surface mount component (402) with other circuitry includes a substrate (102) upon which opposing pads (108) are attached. Each of the pads occupies a substantially rectangular area (110) having four sides. In order to facilitate alignment of the surface mount component the substantially rectangular area has two opposing flat sides an outwardly extending arcuate area (112) along at least one of the other two sides.

Abstract translation: 用于将表面安装部件（402）与其它电路对准和附接的焊盘装置（100）包括衬底（102），相对的焊盘（108）附接在衬底上。 每个垫片占据具有四个侧面的大致矩形区域（110）。 为了便于表面安装部件的对准，基本上矩形区域具有两个相对的平坦侧面，沿着另外两个侧面中的至少一个的向外延伸的弧形区域（112）。