公开(公告)号：US20180054898A1

公开(公告)日：2018-02-22

申请号：US15666444

申请日：2017-08-01

Applicant: FINISAR CORPORATION

Inventor： Wei Shi

IPC: H05K3/36 ,  H01L23/498

CPC classification number: H05K3/363 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/36 ,  H05K2201/0367 ,  H05K2201/09445 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/2036 ,  H01L2924/00

Abstract: In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad.

公开(公告)号：US09899719B2

公开(公告)日：2018-02-20

申请号：US14938881

申请日：2015-11-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui

IPC: H01P3/08 ,  H01L23/12 ,  H01P5/02 ,  H05K1/11 ,  H05K1/14 ,  H01L23/66 ,  H05K1/02

CPC classification number: H01P3/08 ,  H01L23/12 ,  H01L23/66 ,  H01L2924/0002 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0191 ,  H05K2201/058 ,  H05K2201/0919 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.

公开(公告)号：US20170359897A1

公开(公告)日：2017-12-14

申请号：US15620866

申请日：2017-06-13

Applicant: Infineon Technologies Austria AG

Inventor： Frank Pueschner ,  Peter Stampka ,  Jens Pohl ,  Marcus Janke

IPC: H05K1/18 ,  H05K3/40 ,  H01R12/71

CPC classification number: H05K1/181 ,  G06K19/07722 ,  G06K19/07733 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07741 ,  G06K19/07747 ,  G06K19/07766 ,  G06K19/07773 ,  H01R12/714 ,  H05K1/0275 ,  H05K1/11 ,  H05K1/113 ,  H05K3/4007 ,  H05K3/4608 ,  H05K3/4694 ,  H05K2201/086 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/09663 ,  H05K2201/10098 ,  H05K2201/10719

Abstract: In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

公开(公告)号：US09491851B2

公开(公告)日：2016-11-08

申请号：US14339470

申请日：2014-07-24

Applicant: WINTEK CORPORATION

Inventor： Jung-Sung Lin ,  Hsua-Yun Lee ,  Pin-Hao Chi ,  Chih-Yuan Lin ,  Ming-Chuan Lin

IPC: H02H9/00 ,  H05K1/02 ,  H05F3/00 ,  H05F3/02 ,  H01R13/648 ,  H01R12/71 ,  H01R12/70 ,  H01R12/77 ,  H05K1/11

CPC classification number: H05K1/0259 ,  H01R12/7005 ,  H01R12/714 ,  H01R12/775 ,  H01R13/6485 ,  H05F3/00 ,  H05F3/02 ,  H05K1/111 ,  H05K1/113 ,  H05K2201/09354 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/097

Abstract: A connection structure of an electronic device includes a circuit board, a plurality of conductive contact pads and a conductive pattern. The conductive contact pads and the conductive pattern are disposed on the circuit board. The conductive contact pads are electrically insulated from one another. The conductive pattern is electrically insulated from the conductive contact pads. The conductive pattern is disposed on at least three sides of the conductive contact pads so as to generate an electrostatic discharge protection effect for the conductive contact pads.

Abstract translation: 电子设备的连接结构包括电路板，多个导电接触焊盘和导电图案。 导电接触焊盘和导电图案设置在电路板上。 导电接触垫彼此电绝缘。 导电图案与导电接触垫电绝缘。 导电图案设置在导电接触焊盘的至少三个侧面上，以便为导电接触焊盘产生静电放电保护效果。

公开(公告)号：US09030011B2

公开(公告)日：2015-05-12

申请号：US13959567

申请日：2013-08-05

Applicant: Xintec Inc.

Inventor： Chao-Yen Lin ,  Yi-Hang Lin

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/525 ,  H01L29/06

CPC classification number: H01L24/05 ,  G06K9/0004 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/525 ,  H01L24/08 ,  H01L24/13 ,  H01L24/48 ,  H01L29/06 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/06165 ,  H01L2224/06167 ,  H01L2224/0801 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/3701 ,  H05K1/181 ,  H05K2201/09418 ,  H05K2201/09445 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/03

Abstract: An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.

Abstract translation: 本发明的实施例提供了一种芯片封装，其包括：载体基板; 具有上表面和下表面的半导体衬底，设置在载体衬底上; 位于所述半导体衬底的上表面上的器件区域或感测区域; 导电焊盘，位于所述半导体衬底的上表面上; 导电层，电连接到导电焊盘并从半导体衬底的上表面延伸到半导体衬底的侧壁; 以及位于导电层和半导体衬底之间的绝缘层。

公开(公告)号：US20140355228A1

公开(公告)日：2014-12-04

申请号：US14289249

申请日：2014-05-28

Applicant: FINISAR CORPORATION

Inventor： Wei Shi

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K3/363 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/36 ,  H05K2201/0367 ,  H05K2201/09445 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/2036 ,  H01L2924/00

Abstract: In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad.

Abstract translation: 在示例性实施例中，电路互连包括第一印刷电路板（PCB），第二PCB，间隔物和导电焊接点。 第一PCB包括第一导电焊盘。 第二PCB包括第二导电垫。 间隔件配置成相对于第二PCB定位第一PCB，使得在第一导电焊盘和第二导电焊盘在焊接过程中导电连接之后，第一PCB和第二PCB之间留有空间。 导电焊接点导电连接第一导电焊盘和第二导电焊盘。

公开(公告)号：US20140306014A1

公开(公告)日：2014-10-16

申请号：US14223242

申请日：2014-03-24

Applicant: Johnson Electric S.A.

Inventor： Vincent Daniel Jean Salle ,  Martin Wallace Edmonds

IPC: G06K19/02

CPC classification number: G06K19/02 ,  G06F21/86 ,  G08B13/2434 ,  H05K1/0275 ,  H05K1/0386 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09445

Abstract: An electronic device is protected from unauthorized access by use of a security wrap having a security screen connected to an alarm circuit of the electronic device. The security screen has a pair of screen terminals interconnected by a conductor. The conductor is formed on a substrate. The substrate is arranged such that attempts to remove the security wrap will result in the substrate being torn and the conductor being damaged or broken whereby the resistance of the conductive path formed by the conductor changes to indicate an alarm condition.

Abstract translation: 通过使用具有连接到电子设备的报警电路的安全屏幕的安全保护装置来保护电子设备免受未经授权的访问。 安全屏幕具有通过导体互连的一对屏幕端子。 导体形成在基板上。 基板被布置成使得去除安全包裹的尝试将导致基板被撕裂并且导体被损坏或破坏，由此由导体形成的导电路径的电阻改变以指示报警状态。

公开(公告)号：US20140125884A1

公开(公告)日：2014-05-08

申请号：US14072813

申请日：2013-11-06

Applicant: WINTEK CORPORATION

Inventor： Yueh-Fang Wang

IPC: G06F3/041 ,  H01R13/02

CPC classification number: G06F3/0412 ,  H01R12/65 ,  H05K1/118 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09445

Abstract: A touch-sensing device includes a substrate, a touch-sensing structure, a signal transmitting layer, a first connecting pin assembly and a second connecting pin assembly. The touch-sensing structure is disposed on the substrate. The signal transmitting layer is disposed on the substrate and electrically connected to the touch-sensing structure. The first connecting pin assembly is disposed on the substrate in a position different from the touch-sensing structure. The first connecting pin assembly has a plurality first connecting pins electrically connected to the signal transmitting layer. The second connecting pin assembly is disposed on the substrate in a position different from the touch-sensing structure. The second connecting pin assembly has a plurality second connecting pins electrically connected to the signal transmitting layer. The first axis of the second connecting pin assembly and the second axis of the first connecting pin assembly are not arranged in the same axis.

Abstract translation: 触摸感测装置包括基板，触摸感测结构，信号传输层，第一连接销组件和第二连接销组件。 触摸感测结构设置在基板上。 信号传输层设置在基板上并电连接到触摸感测结构。 第一连接销组件设置在与触摸感测结构不同的位置的基板上。 第一连接销组件具有电连接到信号传输层的多个第一连接引脚。 第二连接销组件设置在与触摸感测结构不同的位置的基板上。 第二连接销组件具有电连接到信号传输层的多个第二连接引脚。 第二连接销组件的第一轴线和第一连接销组件的第二轴线不排列在相同的轴线上。

公开(公告)号：US20130322031A1

公开(公告)日：2013-12-05

申请号：US13483522

申请日：2012-05-30

Applicant: Rohit Krishna KOPPAL ,  Martin Earl HOLMAN, IV ,  Patrick Yves MAS ,  Douglas Wayne MOSKOWITZ

Inventor： Rohit Krishna KOPPAL ,  Martin Earl HOLMAN, IV ,  Patrick Yves MAS ,  Douglas Wayne MOSKOWITZ

IPC: H05K7/14 ,  H05K3/00

CPC classification number: H05K1/147 ,  H01R12/79 ,  H04M1/0252 ,  H04M1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/148 ,  H05K1/189 ,  H05K3/36 ,  H05K3/365 ,  H05K7/1402 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1031 ,  H05K2201/2009 ,  Y02P70/611 ,  Y10T29/49124

Abstract: A flexible printed circuit connector structure and assembly method. A panel with a back side that is parallel to a first plane and a flexible printed circuit backer that has a base and a backing structure. The base is attached to the back side of the panel. The backing structure depends from the base and extends along a second plane that forms an angle with the first plane. A first flexible circuit side of the flexible printed circuit is attached to a first side and an opposite second side of the backing structure. The flexible printed circuit has exposed conductors on a second flexible circuit side that is opposite the first flexible circuit side.

Abstract translation: 柔性印刷电路连接器结构及组装方法。 具有平行于第一平面的背面的面板和具有底座和背衬结构的柔性印刷电路支架。 基座连接到面板的背面。 背衬结构从底部延伸并且沿着与第一平面成角度的第二平面延伸。 柔性印刷电路的第一柔性电路侧连接到背衬结构的第一侧和相对的第二侧。 柔性印刷电路在第二柔性电路侧具有与第一柔性电路侧相对的露出导体。

公开(公告)号：US20130264103A1

公开(公告)日：2013-10-10

申请号：US13858955

申请日：2013-04-09

Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.

Inventor： Huilin Ye ,  Jing Yu ,  Hua Luo ,  Zongke Chiu ,  Yau-Chen Jiang ,  Jianbin Yan ,  Defa Wu

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/0213 ,  H05K1/0277 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K3/38 ,  H05K2201/09172 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/099

Abstract: The present disclosure discloses a bonding structure, wherein a plurality of first bonding pads is located on a first substrate. A second substrate is disposed to partially face first substrate. A plurality of second bonding pads is located on second substrate with one side, and partially overlapped with the first bonding pads with the other side to form a bonding region and a peripheral region located in the periphery of the bonding region. An anisotropic conductive film is disposed between first bonding pads and second bonding pads. The anisotropic conductive film includes a plurality of conductive particles. At least one move structure is disposed in the periphery region. When the conductive particles of the anisotropic conductive film are moving during the bonding process, the groove structure can accommodate the conductive particles moved hereto. Accordingly, short circuit caused by accumulation of the conductive particles in the bonding process can be avoided.

Abstract translation: 本公开公开了一种接合结构，其中多个第一接合焊盘位于第一基板上。 第二基板设置成部分地面对第一基板。 多个第二接合焊盘位于具有一侧的第二基板上，并且与第一接合焊盘与另一侧部分地重叠以形成接合区域和位于接合区域周边的周边区域。 各向异性导电膜设置在第一接合焊盘和第二接合焊盘之间。 各向异性导电膜包括多个导电颗粒。 至少一个移动结构设置在周边区域中。 当各向异性导电膜的导电颗粒在接合过程中移动时，沟槽结构可以容纳移动到其上的导电颗粒。 因此，可以避免在接合过程中由导电性粒子的积聚引起的短路。