公开(公告)号：US6079620A

公开(公告)日：2000-06-27

申请号：US176662

申请日：1998-10-21

Applicant: Min-Fang Wu ,  Hung-Chi Yu ,  Yu-Ming Ho

Inventor： Min-Fang Wu ,  Hung-Chi Yu ,  Yu-Ming Ho

IPC: H01R12/50 ,  H01R12/72 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K5/02 ,  G06K7/06 ,  H05K7/02

CPC classification number: H05K5/0265 ,  H01R23/688 ,  H05K1/141 ,  H05K5/0286 ,  H01R12/721 ,  H05K1/0219 ,  H05K1/0262 ,  H05K1/117 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K3/3447 ,  H05K3/366

Abstract: A board adapter for electrically transmitting signals between an electrical card connector and a mother board, includes a plurality of signal traces formed on both faces of the board adapter for electrically connecting signal holes with corresponding conductive pads. The signal holes respectively receive the corresponding contacts of the card connector. The conductive pads electrically engage with corresponding contacts disposed within a receiving slot defined in a card edge connector when the board adapter is inserted therein and stabilizing means ensures proper engagement therebetween. The stabilizing means comprises a cutout defined on a bottom edge of the board adapter and a post formed in the receiving slot of the card edge connector. The engagement between the cutout and the post ensures that the conductive pads of the board adapter are properly aligned with the contacts of the card edge connector.

Abstract translation: 用于在电卡连接器和母板之间电传输信号的板适配器包括形成在板适配器的两个表面上的多个信号迹线，用于将信号孔与相应的导电焊盘电连接。 信号孔分别接收卡连接器的相应触点。 当板适配器插入其中时，导电垫与设置在卡边缘连接器中限定的接收槽内的相应触点电连接，并且稳定装置确保其间的适当接合。 稳定装置包括限定在板适配器的底部边缘上的切口和形成在卡缘连接器的接收槽中的柱。 切口和柱之间的接合确保了板适配器的导电垫与卡边缘连接器的触头正确对准。

公开(公告)号：US6025988A

公开(公告)日：2000-02-15

申请号：US213472

申请日：1998-12-17

Applicant: Yan Yan

Inventor： Yan Yan

IPC: G11B5/48 ,  H05K1/00 ,  H05K3/22 ,  H05K3/32 ,  H05K3/36 ,  H05K63/30

CPC classification number: G11B5/486 ,  H05K3/225 ,  H05K3/361 ,  H05K1/0292 ,  H05K1/0295 ,  H05K2201/0397 ,  H05K2201/09954 ,  H05K3/328

Abstract: In a disk drive, an interconnect adapter for coupling a head of a suspension assembly to front-end read/write circuitry includes a pad set with a plurality of specially designed pads. The pads are formed with an integrated frame and multiple tabs. The tabs enable removal and replacement of the pad set from the suspension assembly to enable suspension assembly rework. The interconnect adapter is designed to adapt to polarity specifications of various head and read/write circuitry designs. The pad set design is configured for connection with a variety of traces, with a piezoelectric microactuator, pre-amplification circuitry, and any of a variety of heads.

Abstract translation: 在磁盘驱动器中，用于将悬挂组件的头部耦合到前端读/写电路的互连适配器包括具有多个特别设计的焊盘的焊盘组。 焊盘形成有一个集成的框架和多个接头。 标签能够从悬挂组件移除和更换垫组，以实现悬挂组装返工。 互连适配器被设计为适应各种头和读/写电路设计的极性规范。 焊盘组设计被配置为与各种迹线连接，具有压电微致动器，预放大电路以及各种磁头中的任一种。

公开(公告)号：US5949824A

公开(公告)日：1999-09-07

申请号：US604121

申请日：1996-02-20

Applicant: Hans Donovan ,  Thomas R. Hicks

Inventor： Hans Donovan ,  Thomas R. Hicks

IPC: G11C5/00 ,  H05K1/11 ,  H04B3/00

CPC classification number: H05K1/117 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2203/168

Abstract: A SIMM format printed circuit board with a data terminal equipment and a data communication equipment interface. The connectors for each interface have independent pin assignments. The pin assignments are arranged such that for every signal received on a pin on one connector, the corresponding signal is transmitted on a same-numbered pin on the other connector. Resultingly, the data terminal equipment and data communication equipment interfaces have common line driver/receivers.

Abstract translation: 一种具有数据终端设备和数据通信设备接口的SIMM格式印刷电路板。 每个接口的连接器都有独立的引脚分配。 引脚分配被布置成使得对于在一个连接器上的引脚上接收到的每个信号，相应的信号在另一个连接器上的相同编号的引脚上传输。 因此，数据终端设备和数据通信设备接口具有公共线驱动器/接收器。

公开(公告)号：US5852397A

公开(公告)日：1998-12-22

申请号：US900787

申请日：1997-07-25

Applicant: Chi-Ming Chan ,  Michael Zhang ,  Daniel Chandler ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

Inventor： Chi-Ming Chan ,  Michael Zhang ,  Daniel Chandler ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

IPC: H01C1/14 ,  H01C7/02 ,  H01C17/065 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01C7/10

CPC classification number: H05K1/184 ,  H01C1/14 ,  H01C1/1406 ,  H01C17/06586 ,  H01C7/027 ,  H05K3/3442 ,  H05K1/182 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  H05K3/0097 ,  H05K3/403 ,  Y02P70/613 ,  Y10T29/49085 ,  Y10T29/49101 ,  Y10T29/49103

Abstract: A circuit protection device which comprises first and second laminar electrodes; a laminar PTC conductive polymer resistive element sandwiched between the electrodes; a third laminar conductive member which is secured to the same face of the PTC element as the second electrode but is separated therefrom; and an electrical connector which connects the third conductive member and the first electrode. This permits connection to both electrodes from the same side of the device, so that the device can be connected flat on a printed circuit board, with the first electrode on top, without any need for leads. The connector is preferably a cross-conductor which passes through an aperture in the PTC element, because this makes it possible to carry out the steps for preparing the devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.

Abstract translation: 一种电路保护装置，包括第一和第二层状电极; 夹在电极之间的层状PTC导电聚合物电阻元件; 第三层状导电构件，其固定到PTC元件的与第二电极相同的表面，但与其分离; 以及连接第三导电构件和第一电极的电连接器。 这允许从器件的相同侧连接到两个电极，使得器件可以平坦地连接在印刷电路板上，第一电极在顶部，而不需要引线。 连接器优选是穿过PTC元件中的孔的交叉导体，因为这使得可以在对应于多个单独装置的组件上执行用于准备装置的步骤，将组件划分为 最后一步。

公开(公告)号：US5777853A

公开(公告)日：1998-07-07

申请号：US642572

申请日：1996-05-03

Applicant: Mitchell G. Dorfmeyer

Inventor： Mitchell G. Dorfmeyer

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/34 ,  H05K7/02

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10689 ,  H05K3/3421 ,  Y02P70/611

Abstract: A printed circuit board has a first plurality of pin receptors configured to receive a first type of keyboard controller and a second plurality of pin receptors configured to receive a second type of keyboard controller. The first plurality of pin receptors are in the form of a square which defines an outer boundary of an area wherein the second plurality of pin receptors are formed. The second plurality of pin receptors are also in the form of a square. Equal numbers of pin receptors are provided on each side of each square, and the corresponding sides of the two squares are mutually parallel. Conductive traces are formed between corresponding pin receptors of the first and second plurality of pin receptors. The pin receptor configuration allows two different types of keyboard controllers to be used with the printed circuit board without requiring additional space on the printed circuit board.

Abstract translation: 印刷电路板具有被配置为接收第一类型的键盘控制器的第一多个引脚接收器和被配置为接收第二类型的键盘控制器的第二多个引脚接收器。 第一组多个针式接收器是方形的形式，其定义了形成第二组多个针式接收器的区域的外部边界。 第二组多个针脚受体也是正方形的形式。 在每个正方形的每一侧设置相等数量的针式接收器，两个正方形的相应侧相互平行。 导电迹线形成在第一和第二多个引脚受体的相应引脚受体之间。 引脚接收器配置允许两个不同类型的键盘控制器与印刷电路板一起使用，而不需要印刷电路板上的额外空间。

公开(公告)号：US5682297A

公开(公告)日：1997-10-28

申请号：US615155

申请日：1996-03-12

Applicant: David J. Silva

Inventor： David J. Silva

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K1/0206 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/09954 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/10704 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A dual footprint for servicing either of two types of microprocessor packaging systems. A first footprint capable of receiving and servicing a first type of microprocessor packaging system, for example, a tape carrier package microprocessor package, is formed within a second footprint capable of receiving and servicing a second type of microprocessor packaging system, for example, a pin grid array microprocessor package. In a preferred form, the two footprints are electrically interconnected and the first footprint is offset by a selected angle from the second footprint to allow increased connectivity between the two footprints.

Abstract translation: 用于维护两种微处理器封装系统中的任一种的双重封装。 能够接收和维护第一类型的微处理器封装系统（例如，载带封装微处理器封装）的第一覆盖区形成在能够接收和维护第二类微处理器封装系统的第二覆盖区内，例如，引脚 网格阵列微处理器封装。 在优选形式中，两个覆盖区是电互连的，并且第一覆盖区从第二覆盖区偏移选定的角度以允许两个覆盖区之间的连接增加。

公开(公告)号：US5557505A

公开(公告)日：1996-09-17

申请号：US278798

申请日：1994-07-22

Applicant: David J. Silva

Inventor： David J. Silva

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K1/0206 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/09954 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/10704 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A dual footprint for servicing either of two types of microprocessor packaging systems. A first footprint capable of receiving and servicing a first type of microprocessor packaging system, for example, a tape carrier package microprocessor package, is formed within a second footprint capable of receiving and servicing a second type of microprocessor packaging system, for example, a pin grid array microprocessor package. In a preferred form, the two footprints are electrically interconnected and the first footprint is offset by a selected angle from the second footprint to allow increased connectivity between the two footprints.

Abstract translation: 用于维护两种微处理器封装系统中的任一种的双重封装。 能够接收和维护第一类型的微处理器封装系统（例如，载带封装微处理器封装）的第一覆盖区形成在能够接收和维护第二类微处理器封装系统的第二覆盖区内，例如，引脚 网格阵列微处理器封装。 在优选形式中，两个覆盖区是电互连的，并且第一覆盖区从第二覆盖区偏移选定的角度以允许两个覆盖区之间的连接增加。

公开(公告)号：US5444187A

公开(公告)日：1995-08-22

申请号：US329222

申请日：1994-10-26

Applicant: Daniel R. Bree ,  Rafael Lem

Inventor： Daniel R. Bree ,  Rafael Lem

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K1/0243 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613

Abstract: The method of surface mounting radio frequency components includes using at least one radio frequency component having a pair of input/output contact points or areas at corners on the underside of the component, wherein each of the input/output contact points or areas abuts the adjoining edges of the corners. The component is positioned relative to a pair of traces on a circuit board for enabling an electrical connection thereto in a range of angular dispositions. By using a single non-customized component, adjacent components can be configured with a signal flow path of a range between about 0.degree. (a chain configuration) and about 180.degree. (a "U"-turn).

Abstract translation: 表面安装射频成分的方法包括使用至少一个具有一对输入/输出接触点的射频分量或在组件的下侧的拐角处的区域，其中每个输入/输出接触点或区域邻接相邻的 角落的边缘。 该组件相对于电路板上的一对迹线定位，以使得能够在一定范围的角度配置中进行电连接。 通过使用单个非定制组件，相邻组件可以配置在约0°（链式配置）和约180°（“U”转）之间的范围内的信号流路径。

公开(公告)号：US5258890A

公开(公告)日：1993-11-02

申请号：US843923

申请日：1992-02-21

Applicant: Henricus J. M. de Veer

Inventor： Henricus J. M. de Veer

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K7/02

CPC classification number: H05K1/11 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09227 ,  H05K2201/09954 ,  H05K2201/10689

Abstract: A printed circuit board for connecting, in n different ways, connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on the printed circuit board, where n is an integer .gtoreq.2. The printed circuit board comprises contact holes which are electrically connected to the printed circuitry and are each suitable for receiving a connection pin of the DIL package. To avoid the use of so-called jumper blocks for the different ways of connection, the contact holes form a matrix of p columns and q rows, with p being at least equal to the number of connection pins on a long side of the DIL package, q being at least equal to 2n, and the distance between successive rows of contact holes being such that n-1 rows of free contact holes are located between the rows of connection pins on the opposite long sides of the DIL package when these rows of connection pins have been mounted in two rows of contact holes. The contact holes are preferably located in an IC base, so that the desired connection can be chosen by placing the package in this base in one of the n possible ways.

公开(公告)号：US5061825A

公开(公告)日：1991-10-29

申请号：US592157

申请日：1990-10-03

Applicant: Robert W. Catlin

Inventor： Robert W. Catlin

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K1/181 ,  H05K2201/09954 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A printed cirucit board design capable of accepting both first and second versions of an IC device. First and second IC devices (10, 20) have pins disposed along respective first and second rectangular peripheries (12a-b and 15a-b; 22a-b and 23a-b). Each pin on the first IC devices has a functional counterpart pin on the second IC device. The board configuration contains pads in first and second arrays (32a-b and 35a-b; 32a, 32c, 33a-b) that correspond to the pins on the first and second IC devices. At least some of the pads (32b) of the first array do not physically conicide with pads in the second array and are located within the rectangle defined by the second array. Each non-overlapping pad in the first array is connected by a circuit board trace (40) to a respective pad in the second array such that each circuit board trace joins two pads corresponding to counterpart pins.

Abstract translation: 一种能够接受IC器件的第一和第二版本的印刷电路板设计。 第一和第二IC器件（10,20）具有沿相应的第一和第二矩形周边（12a-b和15a-b; 22a-b和23a-b）布置的销。 第一IC器件上的每个引脚在第二IC器件上具有功能对应引脚。 板配置包括与第一和第二IC器件上的引脚对应的第一和第二阵列（32a-b和35a-b; 32a，32c，33a-b）中的焊盘。 第一阵列的至少一些焊盘（32b）不与第二阵列中的焊盘物理地分离，并且位于由第二阵列限定的矩形内。 第一阵列中的每个非重叠焊盘通过电路板迹线（40）连接到第二阵列中的相应焊盘，使得每个电路板迹线连接对应于对应引脚的两个焊盘。