公开(公告)号：US20120063094A1

公开(公告)日：2012-03-15

申请号：US12882362

申请日：2010-09-15

Applicant: Michael A. Gaynes ,  Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

Inventor： Michael A. Gaynes ,  Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

IPC: H05K7/20 ,  H05K3/20

CPC classification number: H05K3/30 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15321 ,  H05K1/0206 ,  H05K1/141 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/10098 ,  H05K2201/10477 ,  Y10T29/49128 ,  Y10T29/49137 ,  H01L2924/014

Abstract: Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.

Abstract translation: 技术在与集成电路封装相关联的组件中提供改进的热界面材料应用。 例如，一种装置包括集成电路模块，印刷电路板和传热装置。 集成电路模块安装在印刷电路板的第一表面上。 印刷电路板具有与集成电路模块对准的至少一个热界面材料施加通孔。 传热装置安装在印刷电路板的第二表面上，并且热耦合到集成电路模块。 印刷电路板的第二表面与印刷电路板的第一表面相对。

公开(公告)号：US20120051017A1

公开(公告)日：2012-03-01

申请号：US13019370

申请日：2011-02-02

Applicant: Gyeong-Im Lee ,  Sung-Gon Seo ,  Jae-Mo Chung

Inventor： Gyeong-Im Lee ,  Sung-Gon Seo ,  Jae-Mo Chung

IPC: H05K1/18 ,  H05K3/34 ,  H05K3/30

CPC classification number: H05K3/341 ,  H01L2224/45139 ,  H01L2224/48091 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10477 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In electronic component which can be readily miniaturized and compacted, and which has a simple manufacturing process, and in a method of manufacturing the same, the electronic component includes a printed circuit board (PCB) having a first surface and a second surface facing each other, and a predetermined through-hole, a semiconductor device mounted in the through-hole and combined with the first surface of the PCB, and at least one passive device combined with the first surface of the PCB.

Abstract translation: 在易于小型化和紧凑化的电子部件中，具有简单的制造工艺，并且在其制造方法中，电子部件包括具有彼此面对的第一表面和第二表面的印刷电路板（PCB） 以及预定的通孔，安装在通孔中并与PCB的第一表面组合的半导体器件，以及与PCB的第一表面组合的至少一个无源器件。

公开(公告)号：US07965520B2

公开(公告)日：2011-06-21

申请号：US11625426

申请日：2007-01-22

Applicant: Håkan Bygdö ,  Per Holmberg

Inventor： Håkan Bygdö ,  Per Holmberg

IPC: H05K9/00

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K1/182 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.

Abstract translation: 提供了一种电子设备，其包括具有顶表面，底表面和在顶表面和底表面之间延伸的孔的主印刷电路板（PCB）。 电子设备还包括具有安装在模块PCB的顶表面上的至少一个电气部件的模块PCB，其中模块PCB被倒置并组装在主PCB附近，使得模块PCB的顶表面面向 主PCB，并且至少一个电气部件延伸到孔中。 此外，电子设备包括基本上覆盖孔的主PCB底面上的盖。

公开(公告)号：US07947906B2

公开(公告)日：2011-05-24

申请号：US11528322

申请日：2006-09-28

Applicant: Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

Inventor： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC: H05K3/02 ,  H05K1/00

CPC classification number: H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

Abstract: A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate such that an anodic oxide layer is formed on upper and lower sides of the metal substrate, respectively; forming an inner layer circuit on upper and lower anodic oxide layers, respectively; etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded; mounting the electronic component in the cavity with a chip bond adhesive; and forming an outer layer circuit on upper and lower sides of the metal substrate, respectively, such that a multi-layer circuit is formed.

Abstract translation: 一种多层印刷电路板和使用金属基板作为核心部件并且具有嵌入在金属基板中的电子部件的多层印刷电路板的制造方法，该方法包括阳极氧化金属基板以使阳极氧化物 层分别形成在金属基板的上侧和下侧; 分别在上下阳极氧化层上形成内层电路; 蚀刻金属基板以形成与要嵌入电子部件的位置相对应的空腔; 用芯片粘合剂将电子部件安装在腔体中; 并且在金属基板的上侧和下侧分别形成外层电路，使得形成多层电路。

公开(公告)号：US07903426B2

公开(公告)日：2011-03-08

申请号：US11836988

申请日：2007-08-10

Applicant: Masahiro Kimura ,  Yoshifumi Saito

Inventor： Masahiro Kimura ,  Yoshifumi Saito

IPC: H05K7/00

CPC classification number: H05K1/141 ,  H01L23/15 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/284 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/10477 ,  H05K2203/308 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multilayer electronic component including a resin layer disposed on a mounting board side is mounted on a mounting board, and has a structure such that, even when deformation, such as deflection and strain, occurs, a stress on the multilayer electronic component is relieved. In the multilayer electronic component, ends of columnar conductors protrude from a main surface of a resin layer facing the outside. The multilayer electronic component is mounted on a mounting board, and the ends of the columnar conductors are electrically connected to conductive lands. In this case, a predetermined gap is formed between the multilayer electronic component and the mounting board.

Abstract translation: 包括设置在安装板侧的树脂层的多层电子部件安装在安装板上，并且具有这样的结构，使得即使发生诸如挠曲和应变的变形，也可以减轻对多层电子部件的应力。 在多层电子部件中，柱状导体的端部从面向外部的树脂层的主面突出。 多层电子部件安装在安装板上，柱状导体的端部电连接到导电焊盘。 在这种情况下，在多层电子部件和安装基板之间形成规定的间隙。

公开(公告)号：US20100327723A1

公开(公告)日：2010-12-30

申请号：US12492238

申请日：2009-06-26

Applicant: Pei-Choa WANG

Inventor： Pei-Choa WANG

IPC: H01J1/02

CPC classification number: F21V29/51 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/021 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10477

Abstract: A light emitting diode (LED) illumination device includes a vapor chamber, a circuit board and at least one LED. At least one protrusion is formed on a surface of the vapor chamber, and a heat conducting tin layer is formed on the protrusion. The circuit board includes at least one through hole for passing the protrusion. The circuit board is formed by sequentially stacking an insulating layer and a heat conducting layer. The LEDs are installed on and contacted with the protrusions respectively, and each LED has two pins electrically connected to the circuit board. The LED device of the present invention is in a direct contact with the protrusion of the LED, such that the heat dissipated from the LED can be conducted to the vapor chamber, and then the vapor chamber carries away the heat quickly.

Abstract translation: 发光二极管（LED）照明装置包括蒸气室，电路板和至少一个LED。 在蒸气室的表面上形成至少一个突起，并且在突起上形成导热锡层。 电路板包括用于使突出部通过的至少一个通孔。 电路板通过依次层叠绝缘层和导热层而形成。 LED分别安装在突起上并与突起接触，并且每个LED具有两个电连接到电路板的引脚。 本发明的LED装置与LED的突起直接接触，使得从LED散发的热量可以传导到蒸气室，然后蒸气室快速传递热量。

公开(公告)号：US20100155930A1

公开(公告)日：2010-06-24

申请号：US12714193

申请日：2010-02-26

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L23/488

CPC classification number: H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the first surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Another electronic device, such as another semiconductor device package, may communicate electrically with the die of the semiconductor device assembly through the contact pads on the first surface of the substrate. In some embodiments, the other electronic device may be stacked with the semiconductor device assembly.

Abstract translation: 半导体器件组件包括与衬底的第一表面相邻的衬底和半导体管芯。 衬底还包括与第一表面相对的第二表面，从第一表面和第二表面延伸的开口，第一表面上的接触焊盘以及与开口相邻的第二表面上的衬底焊盘。 半导体管芯的焊盘与通过衬底的开口对准。 诸如接合线的中间导电元件从半导体管芯的接合焊盘延伸通过开口，延伸到衬底的相对的第二表面上的衬底焊盘。 填充开口并覆盖中间导电元件的密封剂突出超过衬底的第二表面所在的平面。 诸如另一半导体器件封装的另一电子器件可以通过衬底的第一表面上的接触焊盘与半导体器件组件的管芯电连通。 在一些实施例中，其他电子设备可以与半导体器件组件堆叠。

公开(公告)号：US07667143B2

公开(公告)日：2010-02-23

申请号：US11474432

申请日：2006-06-26

Applicant: Chia-Jung Wu ,  Che-Chih Chang

Inventor： Chia-Jung Wu ,  Che-Chih Chang

IPC: H01R12/04 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K3/363 ,  H05K2201/048 ,  H05K2201/09081 ,  H05K2201/10477 ,  Y10T29/49126

Abstract: A circuit board module and a forming method thereof are provided. The circuit board module includes a first circuit board, a second circuit board and a conductive structure. The first circuit board has a first surface, a second surface and an opening. The opening passes through the first surface and the second surface. The first surface has a first solder pad. The second circuit board has a second solder pad. Part of the second circuit board passes through the opening from the first surface to the second surface, so that part of the second solder pad is exposed on the first surface. The conductive structure is electrically connected to the first solder pad and the second solder pad, so that the first circuit board is electrically connected to the second circuit board.

Abstract translation: 提供一种电路板模块及其形成方法。 电路板模块包括第一电路板，第二电路板和导电结构。 第一电路板具有第一表面，第二表面和开口。 开口穿过第一表面和第二表面。 第一表面具有第一焊盘。 第二电路板具有第二焊盘。 第二电路板的一部分从第一表面穿过开口到第二表面，使得第二焊盘的一部分暴露在第一表面上。 导电结构电连接到第一焊盘和第二焊盘，使得第一电路板电连接到第二电路板。

公开(公告)号：US07652383B2

公开(公告)日：2010-01-26

申请号：US11305282

申请日：2005-12-16

Applicant: Seung-Duk Baek ,  Sun-Won Kang ,  Dong-Ho Lee ,  Jong-Joo Lee ,  Sang-Wook Park

Inventor： Seung-Duk Baek ,  Sun-Won Kang ,  Dong-Ho Lee ,  Jong-Joo Lee ,  Sang-Wook Park

IPC: H01L23/29

CPC classification number: H01L25/105 ,  H01L23/3107 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1005 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19107 ,  H05K1/181 ,  H05K3/284 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package module having no solder balls and a method of manufacturing the semiconductor package module are provided. The semiconductor package module includes a module board on which a plurality of semiconductor devices are able to be mounted, a semiconductor package bonded on the module board using an adhesive, being wire-bondable to the module board, and having already undergone an electrical final test, second wires electrically connecting second bond pads of the semiconductor package to bond pads of the module board; and a third sealing resin enclosing the second wires and the semiconductor package. Because the semiconductor package module does not use solder balls, degradation of solder joint reliability (SJR) can be prevented. Further, the use of a semiconductor package that has already undergone an electrical test can reduce degradation of the yield of a completed semiconductor package module.

Abstract translation: 提供一种不具有焊球的半导体封装模块和制造该半导体封装模块的方法。 该半导体封装模块包括：模块板，多个半导体器件能够安装在该模块板上;半导体封装，使用粘合剂结合在模块板上，可与模块板接合，并且已经经过电气最终测试 ，将所述半导体封装的第二接合焊盘与所述模块板的焊盘电连接的第二布线; 以及封装第二导线和半导体封装的第三密封树脂。 由于半导体封装模块不使用焊球，因此可以防止焊点可靠性（SJR）的劣化。 此外，使用已经经历电测试的半导体封装可以降低完成的半导体封装模块的产量的劣化。

公开(公告)号：US07491894B2

公开(公告)日：2009-02-17

申请号：US11085342

申请日：2005-03-21

Applicant: Takeshi Suzuki ,  Toshiyuki Ilmura ,  Kazushige Osumi ,  Shinichi Tsuyuki

Inventor： Takeshi Suzuki ,  Toshiyuki Ilmura ,  Kazushige Osumi ,  Shinichi Tsuyuki

IPC: H05K1/16

CPC classification number: H05K1/141 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0218 ,  H05K1/056 ,  H05K3/284 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A hybrid integrated circuit device of the present invention includes: a circuit board having a front surface subjected to an insulation process; a conductive pattern formed on the front surface of the circuit board; a circuit element placed at a desired position on the conductive pattern and electrically connected to the conductive pattern; and a plurality of leads fixed to the conductive pattern and led to the outside. End portions of the leads which are led to the outside extend approximately parallel to the circuit board in a plane different from that of the front surface of the circuit board.

Abstract translation: 本发明的混合集成电路器件包括：具有经过绝缘处理的正面的电路板; 形成在所述电路板的前表面上的导电图案; 电路元件放置在导电图案上的期望位置并电连接到导电图案; 以及多个引线固定到导电图案并被引导到外部。 引导到外部的引线的端部在与电路板的前表面的平面不同的平面中大致平行于电路板延伸。