公开(公告)号：US09962729B2

公开(公告)日：2018-05-08

申请号：US15027336

申请日：2014-10-09

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Olivier Dellea ,  Pascal Fugier

IPC: B05D1/36 ,  B05D1/20 ,  B05D5/08

CPC classification number: B05D1/204 ,  B05D5/08 ,  B05D2518/10

Abstract: An installation for forming a compact film of particles on a surface of a carrier fluid, including a zone acting as a reservoir of carrier fluid, an inclined ramp, a particle storage and transfer zone, a mechanism moving the carrier fluid, a mechanism for dispensing the particles in solution, configured to dispense the particles on the surface of the carrier fluid in the zone acting as a reservoir, and a structure for deflecting the particles configured to favor, along a transverse direction of the installation, spreading of the particles at the outlet of the zone acting as a reservoir. The structure for deflecting particles is permeable to the carrier fluid.

公开(公告)号：US09938779B2

公开(公告)日：2018-04-10

申请号：US15652125

申请日：2017-07-17

Applicant: Halliburton Energy Services, Inc.

Inventor： Daniel Patrick Carter ,  Will Edgar Hendricks ,  Chuka Benjamin Onya

IPC: E21B17/00 ,  C23C4/18 ,  C23C4/02 ,  C23C4/11 ,  E21B47/12 ,  B05D1/36 ,  B05D1/08 ,  B05D7/00

CPC classification number: E21B17/003 ,  B05D1/08 ,  B05D1/36 ,  B05D7/542 ,  B05D7/582 ,  B05D7/584 ,  C23C4/02 ,  C23C4/11 ,  C23C4/18 ,  E21B47/122

Abstract: A process for applying an insulative coating to a mandrel can be used in an electromagnetic telemetry antenna assembly. One process includes applying a bond coat to at least a portion of an outer radial surface of a mandrel; applying an electrical isolation layer to the bond coat; applying a first sealant layer to the electrical isolation layer; and heat treating the mandrel in an oven.

公开(公告)号：US09905389B2

公开(公告)日：2018-02-27

申请号：US15675835

申请日：2017-08-14

Applicant: BRITISH TELECOMMUNICATIONS public limited company

Inventor： Robert Ghanea-Hercock

IPC: H01J19/04 ,  H01J21/10 ,  H01J21/04 ,  B29C64/188 ,  H01J19/08 ,  B05D1/26 ,  B05D1/36 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y30/00

CPC classification number: H01J19/04 ,  B05D1/265 ,  B05D1/36 ,  B29C64/00 ,  B29C64/188 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01J19/08 ,  H01J21/04 ,  H01J21/10

Abstract: A method of manufacturing an article with integral active electronic component includes using an additive manufacturing process to: a) form a non-electrically conductive substrate; b) form a non-electrically conductive perforated layer having an aperture; c) form electrically conductive anode and cathode elements spaced in the aperture; d) deposit a conductive electrical connection to each of the elements suitable for imparting an electrical potential difference between the elements; and e) form a non-electrically conductive sealing layer atop the perforated layer so as to retain and seal the aperture in the perforated layer.

公开(公告)号：US09899279B2

公开(公告)日：2018-02-20

申请号：US14517053

申请日：2014-10-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William E. Bernier ,  Timothy H. Daubenspeck ,  Virendra R. Jadhav ,  Valerie A. Oberson ,  David L. Questad

IPC: H01L23/538 ,  H05K1/18 ,  B05D1/36 ,  G01N25/16 ,  H01L21/66 ,  H01L23/00 ,  G01N3/60 ,  G01N19/04

CPC classification number: H01L22/30 ,  B05D1/36 ,  G01N3/60 ,  G01N19/04 ,  G01N25/16 ,  G01N2203/0296 ,  G01N2203/0298 ,  H01L24/13 ,  H01L2224/131 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00

Abstract: A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.

公开(公告)号：US09897547B2

公开(公告)日：2018-02-20

申请号：US14775269

申请日：2014-03-12

Applicant: John F. Rabolt ,  Wenqiong Tang ,  D. Bruce Chase ,  Donald L. Sparks

Inventor： John F. Rabolt ,  Wenqiong Tang ,  D. Bruce Chase ,  Donald L. Sparks

IPC: G01N21/65 ,  B82Y30/00 ,  B32B5/02 ,  B32B5/26 ,  B01J31/06 ,  D01F6/62 ,  C01B32/50 ,  B05D7/00 ,  B05D1/18 ,  B05D1/36

CPC classification number: G01N21/658 ,  B01J31/06 ,  B01J2231/70 ,  B05D1/185 ,  B05D1/36 ,  B05D7/52 ,  B05D7/56 ,  B32B5/028 ,  B32B5/26 ,  B32B2262/0276 ,  B32B2307/402 ,  B32B2457/00 ,  B82Y30/00 ,  C01B32/50 ,  D01F6/625

Abstract: A nanocomposite structure includes: a) a charged fibrous substrate including fibers having disposed on their surfaces a multilayer structure including a layer of a first polyelectrolyte and disposed thereon a layer of a second polyelectrolyte of opposite charge from the first, the second polyelectrolyte forming the outermost layer of the charged fibrous substrate; and b) charged nanorods having a charge opposite that of the charged fibrous substrate, including gold nanorods each having disposed on its surface one or more layers, the outermost of which is a third polyelectrolyte having a charge opposite that of the second polyelectrolyte, wherein the first and third polyelectrolytes may be the same or different; wherein the charged nanorods are disposed unaligned with respect to each other on the charged fibrous substrate.

公开(公告)号：US09868862B2

公开(公告)日：2018-01-16

申请号：US14119999

申请日：2012-05-25

Applicant: Jia Liu ,  Christopher C. Cypcar

Inventor： Jia Liu ,  Christopher C. Cypcar

IPC: C09D5/20 ,  C09J7/02 ,  C09D175/04 ,  C09J175/04 ,  C09D7/12 ,  B05D1/36 ,  B05D3/02 ,  B05D7/00 ,  B32B7/06 ,  B32B27/00 ,  B32B27/40 ,  C08G18/08

CPC classification number: C09D5/20 ,  B05D1/36 ,  B05D3/02 ,  B05D7/51 ,  B05D7/52 ,  B05D2508/00 ,  B32B7/06 ,  B32B27/00 ,  B32B27/40 ,  B32B2250/02 ,  B32B2375/00 ,  C08G18/0819 ,  C08G2170/80 ,  C08L75/04 ,  C09J7/22 ,  C09J7/35 ,  C09J175/04 ,  C09J2475/00 ,  C09J2475/006

Abstract: A coating system for a surface (such as a floor) including a liquid adhesive layer composition including a heat-activated adhesive that forms an adhesive layer upon drying after application to a surface, and a liquid maintenance layer composition comprising a dispersible polymer that forms a maintenance layer upon drying after application to the adhesive layer. The adhesive layer and the maintenance layer may form a peelable coating. An adhesive strength between the adhesive layer and the maintenance layer may be greater than an adhesive strength between the adhesive layer and the surface. The peelable coating may have a tensile strength that is greater than the adhesive strength between the adhesive layer and the surface. The peelable coating may be configured to be peeled from the surface without the adhesive layer and the maintenance layer separating from one another.

公开(公告)号：US09839939B2

公开(公告)日：2017-12-12

申请号：US14581057

申请日：2014-12-23

Applicant: JOHNSON & JOHNSON CONSUMER COMPANIES, INC.

Inventor： Curt Binner ,  Kenneth A. Pelley

IPC: B05D1/32 ,  B05D1/36 ,  B05C9/06 ,  B05C21/00 ,  B29C39/12

CPC classification number: B05D1/32 ,  B05B12/20 ,  B05C9/06 ,  B05C21/005 ,  B05D1/36 ,  B29C39/123 ,  Y10T428/31768 ,  Y10T428/31844 ,  Y10T428/31935 ,  Y10T428/31938 ,  Y10T428/31971

Abstract: A process includes placing a mask over a substrate; delivering liquid film-forming compositions through the mask to the substrate; removing the mask to leave a multilayered raw shape on the substrate; and curing the multilayered raw shape to form the multilayered shaped film product disposed on the substrate. The mask has a delivery surface, an opposite surface and at least one aperture having a design corresponding to the desired shaped film product. The film-forming compositions are delivered through a multistream nozzle. The movement of the mask and the delivery of the first and second liquid film-forming compositions to the mask aperture are controlled to provide a volumetric flow rate of the first and second liquid film-forming compositions to the mask aperture corresponding to the volume of a void. The nozzle is in contact with the delivery surface of the mask.

公开(公告)号：US20170312489A1

公开(公告)日：2017-11-02

申请号：US15595891

申请日：2017-05-15

Applicant: MICRODERMICS INC.

Inventor： Boris STOEBER ,  Iman MANSOOR ,  Urs Otto HÄFELI

IPC: A61M37/00 ,  B21G1/00 ,  B81C1/00 ,  B05D1/36

CPC classification number: A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0053 ,  B05D1/36 ,  B05D2201/06 ,  B21G1/00 ,  B81C1/00111

Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

公开(公告)号：US09789704B2

公开(公告)日：2017-10-17

申请号：US14574193

申请日：2014-12-17

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Taniuchi

IPC: B05D1/36 ,  B32B37/24 ,  B32B38/10 ,  C09D11/54 ,  B41J11/00 ,  B32B37/00 ,  B05D5/00 ,  B29C67/00 ,  B33Y30/00 ,  B41J2/005 ,  B33Y10/00 ,  B32B37/12 ,  B41M5/00 ,  B41J2/01 ,  B41J2/21 ,  C09D11/322 ,  C09D11/40 ,  B41J2/14

CPC classification number: B41J11/0015 ,  B05D1/36 ,  B05D5/00 ,  B29C64/165 ,  B32B37/025 ,  B32B37/1292 ,  B32B37/24 ,  B32B38/10 ,  B32B2037/243 ,  B33Y10/00 ,  B33Y30/00 ,  B41J2/0057 ,  B41J2/01 ,  B41J2/14 ,  B41J2/2114 ,  B41J2002/012 ,  B41M5/0017 ,  B41M5/0047 ,  C09D11/322 ,  C09D11/40 ,  C09D11/54

Abstract: A method of manufacturing a pattern includes providing a pattern of a first liquid on a medium, applying a powder material to the provided pattern, and providing a second liquid to the powder material applied to the first liquid.

公开(公告)号：US20170232469A1

公开(公告)日：2017-08-17

申请号：US15587137

申请日：2017-05-04

Applicant: Hewlett-Packard Industrial Printing Ltd.

Inventor： Alex VEIS ,  Alex DAVIDSON

IPC: B05D1/02 ,  B41F3/00 ,  B41J2/01 ,  B05D1/36

CPC classification number: B05D1/02 ,  B05B3/00 ,  B05B7/00 ,  B05B12/02 ,  B05B12/04 ,  B05B12/12 ,  B05D1/36 ,  B41F3/00 ,  B41J2/01 ,  B41J2/07 ,  B41J2/205 ,  B41J2/2114 ,  B41J2/2132 ,  B41J2/2135 ,  B41J2/2146 ,  B41J2/515 ,  B41J3/543 ,  B41J11/0015 ,  B41J11/008 ,  B41J29/393

Abstract: According to one example there is provided a system for applying fluid to a substrate using a first and second array of fluid applicators.