公开(公告)号：US20150264806A1

公开(公告)日：2015-09-17

申请号：US14335700

申请日：2014-07-18

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Akihiko HAPPOYA ,  Daigo SUZUKI

IPC: H05K1/02 ,  H05K3/38 ,  H05K3/10

CPC classification number: H05K1/0298 ,  H05K1/028 ,  H05K1/0281 ,  H05K3/0061 ,  H05K3/10 ,  H05K3/38 ,  H05K2201/09036 ,  H05K2201/2009 ,  Y10T29/49155

Abstract: According to one embodiment, a printed wiring board includes a circuit board, a ground pattern provided on the circuit board, a wiring pattern provided on the circuit board, a conductive reinforcing plate covering the ground pattern and the wiring pattern and electrically connected with the ground pattern, and an insulating portion provided between the conductive reinforcing plate and the wiring pattern.

Abstract translation: 根据一个实施例，印刷电路板包括电路板，设置在电路板上的接地图案，设置在电路板上的布线图案，覆盖接地图案的导电加强板和布线图案并与地面电连接 以及设置在导电性加强板和布线图案之间的绝缘部。

公开(公告)号：US20150257255A1

公开(公告)日：2015-09-10

申请号：US14719321

申请日：2015-05-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: H05K1/02 ,  G11C29/04 ,  G11C5/02 ,  G11C5/06 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

公开(公告)号：US20150255423A1

公开(公告)日：2015-09-10

申请号：US14720496

申请日：2015-05-22

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Tzu-Chih LIN ,  Chien-Ko LIAO

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L23/13 ,  H01L23/49822 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/10175 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/81007 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2924/15786 ,  H01L2924/3841 ,  H05K1/0306 ,  H05K3/0023 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/09045 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A copper clad laminate is disclosed to include a substrate defining a plurality of carrier zones for attachment of chips and having a plurality of barrier portions each arranged around at least one of the carrier zones for isolating the carrier zones. Thus, when tin sheets mounted between the chips and the carrier zones of the substrate become liquids in a thermal reflow process, the barrier portions of the substrate will stop an overflow of molten tin to prevent the chips from damage caused by a solder bridge problem.

Abstract translation: 公开了一种覆铜层压板，其包括限定用于连接芯片的多个载体区域的基板，并且具有多个阻挡部分，每个阻挡部分围绕至少一个承载区域布置以隔离载体区域。 因此，当安装在芯片和衬底的载体区域之间的锡片在热回流过程中变成液体时，衬底的阻挡部分将停止熔融锡的溢出，以防止芯片由于焊料桥问题而造成损坏。

公开(公告)号：US09126260B2

公开(公告)日：2015-09-08

申请号：US14247282

申请日：2014-04-08

Applicant: Infineon Technologies AG

Inventor： Joerg Ortner ,  Michael Sorger

IPC: B22D19/00 ,  H01L21/02 ,  H01L21/768 ,  H01L21/311 ,  H01L21/48 ,  H01L23/00 ,  G03F7/00 ,  B82Y10/00 ,  B82Y40/00

CPC classification number: B22D19/0072 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/02 ,  H01L21/311 ,  H01L21/486 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02371 ,  H01L2224/0346 ,  H01L2224/03472 ,  H01L2224/0502 ,  H01L2224/06182 ,  H01L2224/06188 ,  H01L2224/94 ,  H01L2924/181 ,  H05K1/02 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/308 ,  Y10S977/887 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into the trench, the imprint material in the trench may be embossed using a stamp device, and the stamp device may be removed from the trench.

Abstract translation: 在根据实施例的处理衬底的方法中，沟槽可以形成在衬底中，压印材料可以至少沉积到沟槽中，沟槽中的压印材料可以使用压印装置压印，并且印模 器件可以从沟槽中移除。

公开(公告)号：US09122968B2

公开(公告)日：2015-09-01

申请号：US13647982

申请日：2012-10-09

Applicant: X-Card Holdings, LLC

Inventor： Mark A. Cox

IPC: H05K7/02 ,  H05K1/09 ,  H05K1/00 ,  G06K19/077

CPC classification number: C08L33/14 ,  B32B3/08 ,  B32B3/26 ,  B32B27/08 ,  B32B27/20 ,  B32B37/06 ,  B32B37/08 ,  B32B37/10 ,  B32B2250/40 ,  B32B2264/02 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2425/00 ,  B32B2457/00 ,  B32B2457/08 ,  C08L27/06 ,  C08L75/04 ,  C08L75/06 ,  C08L75/14 ,  C08L75/16 ,  C08L2203/206 ,  G06K19/07722 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K1/0313 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/10037 ,  Y10T29/49126 ,  Y10T428/24612 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31598 ,  Y10T428/31605 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31692 ,  Y10T428/31699 ,  H01L2924/00

Abstract: The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

Abstract translation: 本公开提供了可交联聚合物组合物，用于包含这种交联组合物的信息载体卡的芯层，所得到的信息携带卡及其制备方法。 可交联聚合物组合物包含液体或糊状形式的可固化基础聚合物树脂和颗粒状热塑性填料。 基础聚合物树脂选自氨基甲酸酯丙烯酸酯，硅氧烷丙烯酸酯，环氧丙烯酸酯，氨基甲酸酯，丙烯酸酯，硅氧烷和环氧树脂。 颗粒状热塑性填料可以是聚烯烃，聚氯乙烯（PVC），氯乙烯和至少另一种单体的共聚物，或聚酯如聚对苯二甲酸乙二醇酯（PET），其化合物或共混物。

公开(公告)号：US20150243371A1

公开(公告)日：2015-08-27

申请号：US14705971

申请日：2015-05-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: G11C29/12 ,  G01R31/28 ,  H01L25/065 ,  H01L23/498 ,  G11C5/02 ,  H01L25/18

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

公开(公告)号：US09119299B2

公开(公告)日：2015-08-25

申请号：US12309118

申请日：2006-07-21

Applicant: Oskar Schallmoser

Inventor： Oskar Schallmoser

IPC: H05K1/16 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/0231 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: Surface mounted ceramic capacitors (14) on printed circuit boards (10′) are subject to vibrations (18) caused by the piezo effect. Other electronic components are subject to magnetostriction and likewise generate vibrations. In prior art, the vibrations can propagate (20) on a printed circuit board (10). To suppress the propagation of the vibrations caused by the electronic component (14), the invention provides at least one slot (22) in the printed circuit board (10′). The slot (22) extends, for example, parallel to a side wall of the electronic component (14).

Abstract translation: 印刷电路板（10'）上的表面安装陶瓷电容器（14）受到由压电效应引起的振动（18）。 其他电子元件会受到磁致伸缩的影响，并产生振动。 在现有技术中，振动可以在印刷电路板（10）上传播（20）。 为了抑制由电子部件（14）引起的振动的传播，本发明在印刷电路板（10'）中提供至少一个槽（22）。 槽（22）例如平行于电子部件（14）的侧壁延伸。

公开(公告)号：US20150237733A1

公开(公告)日：2015-08-20

申请号：US14700204

申请日：2015-04-30

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.

Abstract translation: 一种印刷电路板，具有由多个相互连接的层或层构成的两个完整的印刷电路板元件，其中至少一个印刷电路板元件具有切口或凹陷，所述切口或凹陷包含待集成在其中一个印刷电路板元件上的部件或 在所述至少一个印刷电路板元件的切口中，并且所述印刷电路板元件与容纳在所述切口中的所述部件连接，由此可以获得所述部件在所述印刷电路板元件中的可靠和可靠的容纳 电路板。 此外，这种印刷电路板还包含集成在其中的电子部件。

公开(公告)号：US20150230336A1

公开(公告)日：2015-08-13

申请号：US14428454

申请日：2013-09-13

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Dominique Vicard ,  Jean Brun

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/11 ,  H01L23/10 ,  H01L23/3157 ,  H01L24/66 ,  H01L24/69 ,  H01L2224/66 ,  H01L2224/69 ,  H01L2224/72 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0091 ,  H05K3/46 ,  H05K2201/09036 ,  H01L2224/48 ,  H01L2924/00

Abstract: The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5′) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).

Abstract translation: 盖（1）旨在与至少一个芯片元件（2）组装，所述盖包括多个电绝缘层（1a）的堆叠，所述电绝缘层限定形成第一凹槽的一部分的至少一个肩部（3） （4），用于容纳有线元件（12）。 所述帽还包括：布置在所述堆叠的组装表面（7）处的至少一个电气凸块接触件（6），所述组装表面（7）旨在安装在所述切屑元件（2）的表面上; 布置在肩部（3）的壁上的至少一个电连接端子（5,5'）; 电连接元件（8），将所述电连接端子（5）电连接到电气凸块触点（6）。

公开(公告)号：US09101050B2

公开(公告)日：2015-08-04

申请号：US14090387

申请日：2013-11-26

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaya Shimamura ,  Kenzo Kitazaki ,  Eiji Mugiya ,  Tatsuro Sawatari ,  Tetsuo Saji ,  Hiroshi Nakamura

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0216 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/107 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/09972 ,  H01L2924/00

Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.

Abstract translation: 电路模块包括电路基板，安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有从密封体的主表面到安装表面形成的沟槽。 沟槽包括由安装表面侧的第一侧壁和主表面侧的第二侧壁构成的侧壁。 连接第一点和第二点的直线具有比靠着安装表面的第一斜坡更缓和的第二斜率。 屏蔽罩覆盖密封体并具有形成在沟槽内的内屏蔽部分和设置在主表面和内屏蔽上的外屏蔽部分。