公开(公告)号：US20120300424A1

公开(公告)日：2012-11-29

申请号：US13577447

申请日：2010-11-16

Applicant: Fei Lv ,  Hu Ge ,  Jie Song

Inventor： Fei Lv ,  Hu Ge ,  Jie Song

IPC: H05K7/00 ,  H05K3/00

CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

Abstract translation: 本发明公开了一种没有外部封装的晶体器件，其包括：晶体（21）和两个引脚（22），其中晶体（21）是具有外部封装（15）的晶体的圆柱形主体端口，以及 冗余引脚（12,13）被去除，并且被水平布置在印刷电路板（PCB）上。 两个销（22）连接到晶体（21）的底端。 两个销（22）的延伸部分朝向PCB倾斜，并且当它们到达PCB并且被焊接到PCB时变得水平，并且两个销（22）之间的间隔逐渐增加。 本公开还公开了一种用于制造没有封装的晶体器件的方法。 该装置和方法可以降低成本，使焊接更方便。

公开(公告)号：US20110114353A1

公开(公告)日：2011-05-19

申请号：US12674505

申请日：2008-08-21

Applicant: Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

Inventor： Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

IPC: H05K5/06 ,  H05K1/11 ,  H05K1/03

CPC classification number: H01L23/49838 ,  H01L23/053 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.

Abstract translation: 电子部件封装具有从顶部观察为矩形形状的基部和金属盖。 使用导电性粘合剂材料将基底面上的端子电极和电路基板接合。 在电子部件封装中，包括形成为平行的两个以上的端子电极的第一端子电极组偏心地形成在底部底面的一个拐角位置，单个第二端子电极或包括两个以上的第二端子电极组 形成为平行的端子电极偏心地形成为与一个角位置对角地相对的第一对角线位置。 此外，在基部的短边方向上的与一个角位置相对的另一个角位置设置有沿着基部的短边没有形成端子电极的无电极区域，并且与另一个角部对角地相对的第二对角线位置 位置。 至少一个端子电极是连接到金属盖的接地端子电极。

公开(公告)号：US20100201579A1

公开(公告)日：2010-08-12

申请号：US12651539

申请日：2010-01-04

Applicant: Nirod K. Das

Inventor： Nirod K. Das

IPC: H01Q1/38

CPC classification number: H01Q1/38 ,  H05K1/024 ,  H05K1/0251 ,  H05K1/0366 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0281 ,  H05K2201/10068

Abstract: Substrate arrangements useful for high-performance radio-frequency planar circuits and antennas eliminate excitation of parallel-plate or surface-wave radiations. By eliminating such radiation which escapes sideways through the substrates, the loss of valuable power carried away by these radiations can be avoided, and/or complications resulting from these radiations (e.g., in the form or electromagnetic interference, cross-talk between circuit components or poor signal integrity) can be avoided. A new type of substrate layer is embedded with thin conducting wires that are closely packed and oriented normal to the substrate layering. These conducting wires change the substrate behavior in a unique way. Such new substrate layers may be used in slotline/coplanar waveguide circuits and microstrip antennas to achieve high-performance radio-frequency operations.

Abstract translation: 用于高性能射频平面电路和天线的衬底布置消除了平行板或表面波辐射的激发。 通过消除通过基板横向逸出的这种辐射，可以避免由这些辐射带走的有价值功率的损失，和/或由这些辐射引起的并发症（例如，形式或电磁干扰，电路部件之间的串扰或 信号完整性差）。 一种新型的基底层被埋入细密的导线，其紧密堆积并且垂直于基底分层。 这些导线以独特的方式改变基板行为。 这种新的衬底层可以用于槽线/共面波导电路和微带天线中，以实现高性能的射频操作。

公开(公告)号：US20090051447A1

公开(公告)日：2009-02-26

申请号：US12229113

申请日：2008-08-20

Applicant: Jeffrey A. McCracken ,  Thomas A. Knecht

Inventor： Jeffrey A. McCracken ,  Thomas A. Knecht

IPC: H03L1/04

CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2201/10537

Abstract: An ovenized oscillator package including a ball grid array substrate seated on a circuit board, a heater and a temperature sensor mounted on the ball grid array substrate, and a crystal package mounted to the ball grid array substrate and overlying at least the heater. A layer of thermally conductive epoxy or adhesive material couples the heater to the crystal package. Stabilizer posts, which are made of an insulative adhesive or epoxy material, are formed between the ball grid array substrate and the circuit board for stabilizing and relieving the stress on the ball grid array substrate. A lid is seated on the circuit board and covers and defines an oven for the ball grid array substrate.

Abstract translation: 包括安置在电路板上的球栅阵列基板，安装在球栅阵列基板上的加热器和温度传感器的加热振荡器封装以及安装到球栅阵列基板并至少覆盖加热器的晶体封装。 一层导热环氧树脂或粘合材料将加热器与晶体封装相结合。 在球栅阵列基板和电路板之间形成由绝缘粘合剂或环氧材料制成的稳定柱，用于稳定和减轻球栅阵列基板上的应力。 盖子安置在电路板上并覆盖并限定了用于球栅阵列基板的烘箱。

公开(公告)号：US20090015266A1

公开(公告)日：2009-01-15

申请号：US11817280

申请日：2006-03-22

Applicant: Kaoru Narita ,  Taras Kushta

Inventor： Kaoru Narita ,  Taras Kushta

IPC: G01R31/12 ,  H01P3/02

CPC classification number: H05K1/0268 ,  G01R27/2617 ,  G01R31/2805 ,  H05K1/16 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/10068

Abstract: A plurality of through-hole vias connected to conductor layers is disposed with gaps left between these vias around opening parts disposed in the conductor layers in a printed board in which these conductor layers are disposed parallel to each other so as to sandwich a dielectric layer in between. Furthermore, through-hole vias used for excitation are disposed in the opening parts of the conductor layers and regions of the dielectric layer matching these opening parts in a non-contact manner with the conductor layers. When the complex dielectric constant is measured, a high-frequency power is applied to the through-hole vias, and the power loss between the through-hole vias and the conductor layers is measured by the S parameter method. As a result, the complex dielectric constant and the frequency dependency of this complex dielectric constant can be measured with a high precision in a frequency range extending from several gigahertzes to 20 GHz, and there is no electrical interference with other parts even when this resonator is mounted on a board.

Abstract translation: 连接到导体层的多个通孔过孔被布置成在印刷电路板的布置在导体层中的开口部分周围的这些通孔之间留有间隙，其中这些导体层彼此平行设置，以将电介质层夹在 之间。 此外，用于激励的通孔过孔以与导体层非接触的方式设置在导体层的开口部分和与这些开口部分匹配的电介质层的区域。 当测量复介电常数时，对通孔通孔施加高频功率，通过S参数法测量通孔和导体层之间的功率损耗。 结果，可以在从几千兆赫到20GHz的频率范围内以高精度测量该复合介电常数的复介电常数和频率依赖性，即使该谐振器是 安装在板上。

公开(公告)号：US20080224786A1

公开(公告)日：2008-09-18

申请号：US12075589

申请日：2008-03-12

Applicant: James L. Stolpman ,  Thomas A. Knecht ,  Jerry L. Shirar

Inventor： James L. Stolpman ,  Thomas A. Knecht ,  Jerry L. Shirar

IPC: H03B5/04 ,  H03L1/04

CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/403 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10651

Abstract: An oscillator assembly includes an oscillator circuit that is configured to generate a frequency signal. A temperature compensation circuit is in communication with the oscillator circuit and adapted to adjust the frequency signal in response to changes in temperature. The oscillator and temperature compensation circuits are located within an oven. A heater and a temperature sensor in communication with the heater are also both located in the oven. The temperature sensor is adapted to directly control the heater in response to changes in temperature. In one embodiment, the oscillator components are mounted to a ball grid array substrate which, in turn, is mounted on a printed circuit board. In this embodiment, a resonator overlies the ball grid array substrate and a lid covers and defines an oven and enclosure for the resonator and the ball grid array substrate. The oscillator and temperature compensation circuit are defined on the ball grid array substrate.

Abstract translation: 振荡器组件包括被配置为产生频率信号的振荡器电路。 温度补偿电路与振荡器电路通信，并且适于根据温度变化调整频率信号。 振荡器和温度补偿电路位于烤箱内。 与加热器连通的加热器和温度传感器也都位于烤箱中。 温度传感器适用于根据温度变化直接控制加热器。 在一个实施例中，振荡器部件被安装到球栅阵列基板，该栅格阵列基板又安装在印刷电路板上。 在该实施例中，谐振器覆盖在球栅阵列基板上，并且盖覆盖并限定用于谐振器和球栅阵列基板的烤箱和外壳。 振荡器和温度补偿电路定义在球栅阵列基板上。

公开(公告)号：US20060220636A1

公开(公告)日：2006-10-05

申请号：US11389076

申请日：2006-03-27

Applicant: Tomio Satoh

Inventor： Tomio Satoh

IPC: G01R31/28

CPC classification number: H05K1/141 ,  H03B5/32 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10515

Abstract: A highly stable piezoelectric oscillator includes a heat-generating component mounted on a base printed circuit board; an erected printed circuit board placed upright on the base printed circuit board by fitting a fitting end part in a fitting slit that is formed to penetrate the base printed circuit board; a piezoelectric resonator which is disposed horizontally and directly on the heat-generating component on the base printed circuit board and whose lead electrode part is connected and fixed on the erected printed circuit board; and an oscillation circuit component to obtain an oscillation output using the piezoelectric resonator as a frequency source. Further, connection pads are arranged opposite from each other on surfaces of the base printed circuit board along both opposing end edges of the fitting slit; arc-shaped side through holes are provided on the inner walls of the fitting slit that correspond to each of the connection pads; and lead pads are arranged so as to have positional relations to their respective connection pads on both surfaces of the fitting end part of the erected printed circuit board; and each connection pad having the side through hole is soldered to each lead pad of the fitting end part.

Abstract translation: 高度稳定的压电振荡器包括安装在基板印刷电路板上的发热元件; 通过将配合端部嵌合在形成为穿过基底印刷电路板的配合狭缝中而竖立在基板印刷电路板上的竖立印刷电路板; 压电谐振器，其水平地并且直接设置在基板印刷电路板上的发热部件上，其引线电极部分连接固定在竖立的印刷电路板上; 以及使用压电谐振器作为频率源获得振荡输出的振荡电路部件。 此外，连接焊盘沿着配合狭缝的两个相对的端部边缘彼此相对布置在基板印刷电路板的表面上; 弧形侧通孔设置在与每个连接垫对应的装配狭缝的内壁上; 并且引线焊盘被布置成与竖立的印刷电路板的装配端部的两个表面上的各自的连接焊盘具有位置关系; 并且具有侧通孔的每个连接垫焊接到配合端部的每个引线焊盘。

公开(公告)号：US06977339B2

公开(公告)日：2005-12-20

申请号：US10486849

申请日：2002-09-12

Applicant: Daisuke Fukushima

Inventor： Daisuke Fukushima

IPC: H01L23/04 ,  H01L23/045 ,  H01L23/06 ,  H01L23/10 ,  H03H9/02 ,  H03H9/10 ,  H05K1/02 ,  H05K3/34 ,  H01L23/02

CPC classification number: H03H9/1021 ,  H01L23/04 ,  H01L23/045 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material filling in an internal space defined by the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface on the internal space side of the metal lead. The internal space is held at an air-tight atmosphere. The metal base has a lower surface positioned on the same plane as a lower surface of the metal lead or the insulating material, the same plane forming a plane to be attached to a mounting board.

Abstract translation: 表面安装封装包括具有下表面的金属基底，具有通孔，布置成插入通孔中的金属引线，填充在由金属基底限定的内部空间中的绝缘材料，覆盖金属基座的帽作为 盖子和布置在金属引线的内部空间侧的表面上的电子部件部件。 内部空间保持在气密的气氛中。 金属基底具有位于与金属引线或绝缘材料的下表面相同的平面上的下表面，形成要附接到安装板的平面的同一平面。

公开(公告)号：US20050082377A1

公开(公告)日：2005-04-21

申请号：US10946890

申请日：2004-09-22

Applicant: Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

Inventor： Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

IPC: H03B5/32 ,  G05D23/19 ,  H03B5/04 ,  H03B5/36 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  G05D15/00 ,  F25D23/12 ,  G05D23/00

CPC classification number: H05K1/0201 ,  G05D23/19 ,  H03B5/04 ,  H03B5/36 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10606

Abstract: To provide a highly stable crystal oscillator having increased thermal efficiency. The highly stable crystal oscillator comprises; a thermostat mainframe which maintains the temperature of a crystal resonator including a resonator container for sealing a crystal piece constant, an oscillating element which constitutes an oscillation circuit together with said crystal resonator, a temperature control element which controls the temperature inside of said thermostat mainframe, and a circuit board mounted with said thermostat mainframe, said oscillating element, and said temperature control element. The construction is such that a heat generating chip resistor and a highly heat sensitive element having a higher temperature dependency, among said oscillating element and said temperature control element, are arranged on one principal plane of said circuit board, and said heat generating chip resistor, said highly heat sensitive element, and said thermostat mainframe are directly heat bonded by a thermo-conductive material.

Abstract translation: 提供具有增加的热效率的高度稳定的晶体振荡器。 高度稳定的晶体振荡器包括： 恒温器主机，其保持包括用于密封晶体片的谐振器容器的晶体谐振器的温度，与所述晶体谐振器一起构成振荡电路的振荡元件，控制所述恒温器主机内部的温度的温度控制元件， 以及安装有所述恒温器主机，所述振荡元件和所述温度控制元件的电路板。 该结构使得在所述振荡元件和所述温度控制元件之中具有较高温度依赖性的发热芯片电阻器和高热敏元件被布置在所述电路板的一个主平面上，并且所述发热芯片电阻器， 所述高热敏元件，并且所述恒温器主机通过热导材料直接热粘合。

公开(公告)号：US20040155717A1

公开(公告)日：2004-08-12

申请号：US10725131

申请日：2003-12-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akira Kato

IPC: H03B005/32

CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10068 ,  H05K2201/10515 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A crystal oscillator device includes a resonator having a plate-shaped resonator package and a plate-shaped circuit board having at least an oscillator circuit. The resonator package is supported above the circuit board such that the resonator package is substantially parallel to the circuit board, and supporting members which support the resonator package are arranged on a straight line on the bottom surface of the resonator package, the straight line being parallel to and near one of the sides of the bottom surface of the resonator package.

Abstract translation: 晶体振荡器装置包括具有板状谐振器封装的谐振器和至少具有振荡电路的板状电路板。 谐振器封装被支撑在电路板上方，使得谐振器封装基本上平行于电路板，并且支撑谐振器封装的支撑构件布置在谐振器封装的底表面上的直线上，该直线是平行的 到谐振器封装的底表面的一个侧面附近。