公开(公告)号：US5914861A

公开(公告)日：1999-06-22

申请号：US996356

申请日：1997-12-22

Applicant: Dietrich Richter ,  Peter Straub ,  Marian Lancki ,  Peter Diehm ,  Dieter Berchtold ,  Hans-Georg Wissmeier

Inventor： Dietrich Richter ,  Peter Straub ,  Marian Lancki ,  Peter Diehm ,  Dieter Berchtold ,  Hans-Georg Wissmeier

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K3/0061 ,  H05K3/341 ,  H05K1/0206 ,  H05K2201/10416 ,  H05K2203/0278 ,  H05K2203/1581 ,  Y02P70/613 ,  Y10S428/901

Abstract: A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8). The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).

Abstract translation: 电路板在两面上覆盖有铜材料，铜材上的铅锡层和板状散热片（6）。 为了在这种电路板上实现由电子部件产生的热量的期望散热，散热器（6）设置有铜表面，然后施加到其上的一层银（8）被焊接到电路板的一侧 （1）。 在制造电路板的方法中，具有铜表面的散热器（6）设置有银层（8），并且其电路板（1）被施加到其具有银层的侧面（7）（ 8）。 散热片（6）与电路板（1）和与散热片（6）紧密接触的加热压板（20）被按压。

公开(公告)号：US5835352A

公开(公告)日：1998-11-10

申请号：US669002

申请日：1996-06-21

Applicant: Ken-ichiro Matsuzaki ,  Gaku Ishii ,  Kenji Otobe ,  Tatsuya Hashinaga

Inventor： Ken-ichiro Matsuzaki ,  Gaku Ishii ,  Kenji Otobe ,  Tatsuya Hashinaga

IPC: H01L23/36 ,  H01L23/367 ,  H01L25/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K5/00 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/36 ,  H01L23/367 ,  H05K5/0091 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/141 ,  H05K1/182 ,  H05K2201/0919 ,  H05K2201/10386 ,  H05K2201/10416 ,  H05K2203/049 ,  H05K3/0061 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092

Abstract: A power amplifying module has a package formed by welding a package bottom plate being a package substrate of a generally flat plate shape with a cap being a metal package cap of a generally rectangular box shape. A wiring substrate of a generally flat plate shape is placed on the package bottom plate and this wiring substrate is covered by the cap. There are two through holes formed in the wiring substrate and two heat spreaders of a generally flat plate shape are positioned in portions exposed through the through holes on the package bottom plate. Semiconductor devices sealed with a resin or the like are set by soldering or the like on respective surfaces of these heat spreaders.

Abstract translation: 功率放大模块具有通过焊接作为大体上平板形状的封装衬底的封装底板而形成的封装，帽是大致矩形盒形的金属封装帽。 大体上平板状的布线基板被放置在封装底板上，并且该布线基板被盖覆盖。 在布线基板中形成有两个通孔，并且大体平板形状的两个散热器定位在通过封装底板上的通孔暴露的部分中。 用树脂等密封的半导体装置通过焊接等设置在这些散热器的各个表面上。

公开(公告)号：US5751063A

公开(公告)日：1998-05-12

申请号：US714675

申请日：1996-09-16

Applicant: Mikio Baba

Inventor： Mikio Baba

IPC: H01L23/12 ,  H01L23/36 ,  H01L25/04 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H01L23/34 ,  H01L23/02 ,  H01L23/10

CPC classification number: H01L23/36 ,  H05K1/0204 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/0201 ,  H05K1/141 ,  H05K1/182 ,  H05K2201/10416 ,  H05K2201/10734

Abstract: Disclosed is a multi-chip module. According to the present invention, the multi-chip module comprises: a first insulating board having a first surface and a second surface that is positioned opposite to the first surface; at least one semiconductor chip mounted on the first surface of the first insulating board; a plurality of metal connection members arranged on the second surface of the first insulating board; a second insulating board that is connected to the plurality of metal connection members; a metal plate that is securely attached to one part of the second surface of the first insulating board through an opening in the second insulating board; and electric components mounted on a surface of the second insulating board.

Abstract translation: 公开了一种多芯片模块。 根据本发明，多芯片模块包括：具有第一表面和与第一表面相对定位的第二表面的第一绝缘板; 安装在第一绝缘板的第一表面上的至少一个半导体芯片; 多个金属连接构件，布置在第一绝缘板的第二表面上; 连接到所述多个金属连接构件的第二绝缘板; 金属板，其通过第二绝缘板中的开口固定在第一绝缘板的第二表面的一部分上; 以及安装在所述第二绝缘板的表面上的电气部件。

公开(公告)号：US5463530A

公开(公告)日：1995-10-31

申请号：US203709

申请日：1994-02-28

Applicant: David C. DeGree

Inventor： David C. DeGree

IPC: H01L23/367 ,  H01L23/40 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L23/367 ,  H01L23/4006 ,  H01L2023/4062 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/1572

Abstract: An apparatus for carrying semiconductor mounting devices in back-to-back arrangement is disclosed in which a central substantially planar thermally conductive support member is provided with recesses in its top and bottom surfaces of an interlocking congruent shape with the semiconductor devices to be received such that each semiconductor mounting device assembled therein is positively positioned and locked in place and fixed in a manner such that the semiconductor elements mounted on the layered or laminar elements connect directly to circuitry carried on the surfaces of the support member.

Abstract translation: 公开了一种背对背布置半导体安装装置的装置，其中中央的基本平坦的导热支撑构件在其互锁全等形状的顶表面和底表面上设有凹槽，半导体装置将被接收，使得 组装在其中的每个半导体安装装置被正确地定位并锁定在适当位置并且以使得安装在分层或层状元件上的半导体元件直接连接到承载在支撑构件的表面上的电路的方式固定。

公开(公告)号：US5440169A

公开(公告)日：1995-08-08

申请号：US177380

申请日：1994-01-05

Applicant: Yoshihiro Tomita ,  Shunichi Abe

Inventor： Yoshihiro Tomita ,  Shunichi Abe

IPC: H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L23/49503 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H05K1/0204 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/07802 ,  H01L2924/1532 ,  H01L2924/1815 ,  H05K1/182 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/341

Abstract: A resin-packaged semiconductor device having a semiconductor element mounted on a first surface of a mounting pad. The mounting pad has an edge molded in a frame-shaped portion of a molding material. A second surface of the mounting pad has a central portion that is not included in the edge of the mounting pad and that is not covered with the molding material, the central portion of the second surface being exposed at the outside of the device. The thickness of the molding material in the frame-shaped portion and on the second surface of the mounting pad can be readily reduced to reduce the thickness of the device. Since the molding material does not cover the entire second surface, molding characteristics as well as heat radiation characteristics are improved.

Abstract translation: 一种树脂封装半导体器件，其具有安装在安装焊盘的第一表面上的半导体元件。 安装垫具有模制在模制材料的框形部分中的边缘。 安装垫的第二表面具有不包括在安装垫的边缘中并且不被模制材料覆盖的中心部分，第二表面的中心部分在设备的外部露出。 可以容易地减小框架部分和安装垫的第二表面上的成型材料的厚度，以减小装置的厚度。 由于成型材料不覆盖整个第二表面，因此改善了成型特性以及散热特性。

公开(公告)号：US5307519A

公开(公告)日：1994-04-26

申请号：US844035

申请日：1992-03-02

Applicant: Alay M. Mehta ,  Venus D. Desai

Inventor： Alay M. Mehta ,  Venus D. Desai

IPC: H01M6/50 ,  H01M10/42 ,  H01M10/50 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/40 ,  H05K7/20 ,  H04B1/16

CPC classification number: H05K1/0204 ,  H01M10/42 ,  H01M10/617 ,  H01M10/623 ,  H01M10/6554 ,  H01M2200/10 ,  H05K1/0393 ,  H05K1/16 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/10181 ,  H05K2201/10416 ,  H05K3/4046

Abstract: A circuit assembly (400) includes a flexible circuit (402) having first (504) and second layers (502). A current-limiting device such as a nichrome strip (316) is coupled to the flexible circuit (402) for limiting the amount of current during a short circuit condition. A heat sink (404) is selectively placed between the first and second layers of the flexible circuit in thermal proximity to the nichrome wire (316) in order to dissipate some of the heat generated by the nichrome strip (316).

Abstract translation: 电路组件（400）包括具有第一（504）和第二层（502）的柔性电路（402）。 诸如镍铬合金带（316）的限流装置耦合到柔性电路（402），用于限制短路状态下的电流量。 散热器（404）被选择性地放置在柔性电路的第一和第二层之间，靠近镍铬合金丝（316），以便消散由镍铬合金带（316）产生的一些热。

公开(公告)号：US5043845A

公开(公告)日：1991-08-27

申请号：US422183

申请日：1989-10-16

Applicant: Bruce C. McDermott ,  Leslie G. Moore, Jr. ,  John D. Meierdiercks ,  James R. Milch

Inventor： Bruce C. McDermott ,  Leslie G. Moore, Jr. ,  John D. Meierdiercks ,  James R. Milch

IPC: H01L23/467 ,  H01L23/40 ,  H01L27/14 ,  H01L31/024 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K3/3447 ,  H01L31/024 ,  H05K1/0204 ,  H01L2224/48091 ,  H05K1/182 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10916 ,  Y02P70/611

Abstract: The present image sensor mounting system is particularly adapted to the mounting of a linear sensor array, of the type having a transparent window on a front surface and a thermal and electrically conductive back surface. The system provides superior electrical and thermal transfer characteristics. A heat sink having at least one flat surface is positioned to make thermal contact with the back surface of the image sensor. A multilayer circuit board having layers of conductive material separated by layers of insulating material and having an opening therethrough sufficient in size to accept the heat sink provides the system support. A metal plating extends from one surface of the board through the opening in the board to the opposite surface of the board with selected ones of the layers of conductive material making electrical contact with the metal plating. The heat sink is mounted in the multilayer circuit board opening in thermal and electrical contact with the metal plating. A layer of thermal and electrically conductive grease is layered between the at least one surface of the heat sink and the conductive back surface of the linear sensor array.

Abstract translation: 本发明的图像传感器安装系统特别适用于在前表面上具有透明窗口的类型的线性传感器阵列的安装以及导热和导电的背面。 该系统提供卓越的电和热传递特性。 具有至少一个平坦表面的散热器被定位成与图像传感器的后表面进行热接触。 具有由绝缘材料层隔开并具有足够尺寸的开口以接纳散热器的导电材料层的多层电路板提供了系统支撑。 金属电镀从板的一个表面延伸穿过板中的开口到板的相对表面，其中选定的导电材料层与金属电镀电接触。 散热器安装在多层电路板开口中，与金属电镀层进行热电接触。 一层热导电润滑脂层叠在散热片的至少一个表面和线性传感器阵列的导电后表面之间。

公开(公告)号：US4711804A

公开(公告)日：1987-12-08

申请号：US881543

申请日：1986-07-02

Applicant: James F. Burgess

Inventor： James F. Burgess

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  B32B3/00 ,  H01B7/34 ,  H02B1/00 ,  H05K3/34

CPC classification number: H05K1/056 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/036 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2201/10727 ,  Y10S428/901 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A circuit board assembly for supporting a leadless ceramic chip carrier for surface mounting on a printed circuit board and for reducing the thermally induced stress on solder joint connections at the carrier-to-board contacts. The board includes an inner heat sink core comprising a highly conductive plate having openings provided therein in the areas which underlie the chip carrier. The openings have inserts therein of a material which closely matches the thermal coefficient of expansion of the ceramic to thereby reduce stress of the intermediate solder joints.

Abstract translation: 一种电路板组件，用于支撑用于表面安装在印刷电路板上的无引线陶瓷芯片载体，并用于减少载体到板触点处的焊点连接处的热诱导应力。 该板包括内部散热器芯，其包括在芯片载体下面的区域中设置有开口的高导电板。 这些开口在其中具有与陶瓷的热膨胀系数紧密匹配的材料，从而减少中间焊点的应力。

公开(公告)号：US4393438A

公开(公告)日：1983-07-12

申请号：US328435

申请日：1981-12-07

Applicant: Robert L. Schelhorn

Inventor： Robert L. Schelhorn

IPC: H05K1/05 ,  H05K3/40 ,  H05K3/44 ,  H05K1/18

CPC classification number: H05K3/445 ,  H05K1/053 ,  H05K2201/09636 ,  H05K2201/09881 ,  H05K2201/10416 ,  H05K3/4046

Abstract: In accordance with this invention a porcelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In accordance with a further aspect of this invention the boards of this invention are obtained by a method in which the connecting pins are sealed in a spaced relationship in apertures in the metal core of the board and insulated from the core prior to the application of the porcelain to the surfaces of the core.

Abstract translation: 根据本发明，提供了一种具有平坦表面并且在板的面和反面之间还具有电连接的瓷涂层金属板。 根据本发明的另一方面，本发明的板是通过一种方法获得的，其中连接销在板的金属芯中的孔中以间隔的关系密封，并在施加之前与芯绝缘 瓷器到核心的表面。

公开(公告)号：US3750278A

公开(公告)日：1973-08-07

申请号：US3750278D

申请日：1970-07-17

Applicant: SYLVANIA ELECTRIC PROD

Inventor： OBERG R ,  BAKER D ,  GARTNER S

IPC: H05K3/00 ,  H05K3/40

CPC classification number: H05K3/4046 ,  H05K3/005 ,  H05K2201/10416 ,  H05K2203/033 ,  Y10T29/49151

Abstract: A printed circuit board having a through connected between conductors on opposite sides of the board which is provided by a conductive element press-fitted in a hole extending through the conductors and insulating material of the circuit board and peened at both ends. The conductive element is inserted into the printed circuit board by punching a hole in the board at a predetermined receiving position, positioning conductive stock material between the retracted punch and the hole, positioning an anvil to enclose the hole on the side of the board opposite that facing the punch, and actuating the punch to remove the conductive element from the stock material, press the element into the hole and peen the element in one stroke. A machine for inserting the conductive element into the printed circuit board comprises a mechanism for holding and indexing the printed circuit board, a punch, a reel supported on one side of the punch and upon which a strip of the conductive stock material is wound, a punch head including a stripper and die assembly in registry with the punch and within which conductive strip material supplied by the reel is slidably retained, a mechanism for indexing the strip material, a female die in registry with the punch on the side of the circuit board opposite that facing the punch and adapted to be laterally shifted so as to function as an anvil with respect to said punch, and a cammed disk having three cam surfaces for actuating said punch, punch head and shiftable die through appropriate followers and linkages.

Abstract translation: 一种印刷电路板，其具有连接在板的相对侧的导体之​​间的导体，该导电元件由导电元件提供，该导电元件压配合在延伸穿过导体的孔中，并且电路板的绝缘材料和两端均喷丸化。 导电元件通过在预定的接收位置处冲压板中的孔而插入印刷电路板中，将导电原料定位在缩回的冲头和孔之间，定位砧以将孔围绕在板的相对侧上 面对冲头，并致动冲头以从原料中移除导电元件，将元件按压到孔中并一次冲压该元件。 用于将导电元件插入印刷电路板的机器包括用于保持和分度印刷电路板的机构，冲头，支撑在冲头的一侧上的卷轴，并且在其上缠绕导电材料的条带， 冲头，其包括与冲头对准的剥离器和模具组件，并且在其内可滑动地保持由卷轴供应的导电条材料，用于对条带材进行分度的机构，与模具侧面上的冲头对准的阴模 相对于面对冲头并适于横向移动以相对于所述冲头作为砧座的凸轮盘，以及具有三个凸轮表面的凸轮盘，用于通过适当的跟随器和连杆致动所述冲头，冲头和可移动模具。