公开(公告)号：US20050130463A1

公开(公告)日：2005-06-16

申请号：US10968066

申请日：2004-10-20

Applicant: Hiromichi Watanabe ,  Yoshifumi Fukatsu ,  Yasuo Nishioka

Inventor： Hiromichi Watanabe ,  Yoshifumi Fukatsu ,  Yasuo Nishioka

IPC: H01R4/18 ,  H01R12/00 ,  H01R43/16 ,  H05K3/30

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K2201/0979 ,  H05K2201/1059 ,  H05K2201/10787

Abstract: A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.

Abstract translation: 压接端子被插入到限定在基板中的通孔中，以与通孔电接触。 压配端子包括端子主体和至少三个突出部。 所述至少三个突起部从所述端子主体的表面向外突出。 突出部的至少一部分在与端子主体的插入方向相交的方向上间隔地配置。

公开(公告)号：US20050116354A1

公开(公告)日：2005-06-02

申请号：US10950400

申请日：2004-09-28

Applicant: Atsushi Kashiwazaki

Inventor： Atsushi Kashiwazaki

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01L29/40

CPC classification number: H01L24/85 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/78 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/1624 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/78 ,  H01L2224/81191 ,  H01L2224/81899 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01065 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A substrate for mounting a semiconductor chip is formed as a multilayer substrate by alternately laminating insulation layers and wiring layers. Wires of the wiring layers are electrically connected through a via-hole for interlayer continuity. A through-hole provided through the insulation layer of the outermost surface layer is formed. A bump is inserted in the through-hole to a bump allocating position of the semiconductor chip to be mounted in the insulation layer of the outermost surface layer. A portion of the wire in the wiring layer of the outermost surface layer is projected to the internal side of through-hole at the aperture of the through-hole.

Abstract translation: 通过交替层叠绝缘层和布线层，形成用于安装半导体芯片的基板作为多层基板。 布线层的导线通过用于层间连续性的通孔电连接。 形成穿过最表面层的绝缘层的通孔。 在通孔中插入凸块到要安装在最外表面层的绝缘层中的半导体芯片的凸点分配位置。 最外表面层的布线层中的线的一部分在通孔的孔径处突出到通孔的内侧。

公开(公告)号：US20040212972A1

公开(公告)日：2004-10-28

申请号：US10422515

申请日：2003-04-24

Inventor： Leon M. Khilchenko ,  Mark W. Gailus

IPC: H05K001/11 ,  H01R012/04 ,  H01R012/16

CPC classification number: H05K3/4038 ,  H05K1/0298 ,  H05K3/321 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4069 ,  H05K2201/0305 ,  H05K2201/0919 ,  H05K2201/10234 ,  H05K2201/1059 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/1446 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.

Abstract translation: 提供的是具有多个堆叠的电介质层的多层PCB，设置在多个电介质层中的至少一个介质层上的导体，以及延伸穿过多个电介质层的至少一部分的非导电通孔， 与导体相交。 处于激活状态的导电体被引入到非导电通孔中，并且在与导体接触时，活化状态导电体粘附到导体。 然后使激活状态的导电体进入去激活状态，其中导电体固​​定到导体以提供与其的电连接。

公开(公告)号：US06802120B2

公开(公告)日：2004-10-12

申请号：US10191986

申请日：2002-07-10

Applicant: Toshiki Uehara

Inventor： Toshiki Uehara

IPC: H05K310

CPC classification number: H05K1/112 ,  H05K1/18 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/035 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2203/1572 ,  Y10S29/016 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a printed wiring board, enabling insertion components to be mounted on both sides thereof, including: a) providing first and second copper-clad laminates, including plated through-holes thereon; b) hot-pressing the laminates with each other and a first prepreg bonding sheet therebetween, so that the through-holes are closed by the prepreg to form non-through holes; c) laminating a second prepreg on each of the surfaces of the composite laminate; d) covering the opening of respective non-through holes with a heat resistant resin film; e) laminating one-side copper-clad laminate on each of the surfaces of the product of (d), with the copper side out, followed by hot-pressing; f) etching the copper sides to form outer layer circuit patterns; g) removing the base material layers covering the openings of the non-through holes; and h) removing the heat resistant resin films of the openings of the non-through holes.

Abstract translation: 一种制造印刷电路板的方法，其能够在两侧安装插入部件，包括：a）提供第一和第二铜包覆层压板，其上包括镀覆的通孔; b）将层叠体彼此热压，并在其间进行第一预浸料接合片，使得通孔被预浸料坯封闭以形成非通孔; c）在复合层压板的每个表面上层压第二预浸料; d）用耐热树脂膜覆盖各个非通孔的开口; e）在（d）的产品的每个表面上层叠一面覆铜层压板，将铜侧排出，然后热压; f）蚀刻铜边以形成外层电路图案; g）去除覆盖非通孔的开口的基材层; 以及h）去除非通孔的开口的耐热树脂膜。

公开(公告)号：US20040185717A1

公开(公告)日：2004-09-23

申请号：US10391905

申请日：2003-03-19

Inventor： Mahesh K. Chengalva

IPC: H01R013/66

CPC classification number: H05K3/326 ,  H01R12/58 ,  H01R13/719 ,  H05K2201/0382 ,  H05K2201/1059

Abstract: A filter insert for a terminal connector includes a rigid substrate and low-cost interference fit connections between the filter insert circuitry and the connector terminals. In a first embodiment, the insert includes a flexible circuit bonded to the rigid substrate, and the substrate is provided with over-sized openings that the terminals pass through without interference. A second embodiment is like the first, except that the filter circuit traces are formed directly on the rigid substrate, and the substrate material backing the terminal connection sites is removed to form the over-sized openings.

Abstract translation: 用于端子连接器的过滤器插件包括刚性基板和过滤器插入电路与连接器端子之间的低成本干涉配合连接。 在第一实施例中，插入件包括结合到刚性基板的柔性电路，并且基板设置有超大尺寸的开口，端子通过而没有干涉。 第二实施例类似于第一实施例，除了滤波器电路迹线直接形成在刚性衬底上，并且去除衬底终端连接位置的衬底材料以形成超大尺寸的开口。

公开(公告)号：US20040145877A1

公开(公告)日：2004-07-29

申请号：US10695197

申请日：2003-10-29

Inventor： Terumi Fujiyama ,  Kazuo Fukunaga ,  Morihiro Fukuda ,  Yoshiaki Kuwada ,  Hiromasa Mori ,  Yoshio Hashimoto

IPC: H05K001/18

CPC classification number: H01G4/40 ,  H01L23/66 ,  H01L24/81 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19011 ,  H01L2924/19103 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/10704 ,  H01L2924/00

Abstract: A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, the capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.

Abstract translation: 本发明的片状电容器具有形成在通孔中的接触部分，该通孔需要与插入IC连接引脚的通孔中的IC连接引脚电连接，以及连接到接触部分的电容器元件。 本发明的另一种薄片电容器包括安装在绝缘板上的绝缘板和电容器元件。 绝缘板具有在上侧具有IC的连接平台，以及在下侧具有印刷电路板的连接平台。 绝缘板的上侧和下侧的电容器元件和连接区域彼此电连接。 在这些配置中的任一种中，大容量的电容器元件和低ESL的电容元件紧密连接到IC，并且可以增加IC的外围电路的安装面积。

公开(公告)号：US06747217B1

公开(公告)日：2004-06-08

申请号：US09989820

申请日：2001-11-20

Applicant: Daniel A. Jochym ,  Robert H. Fix

Inventor： Daniel A. Jochym ,  Robert H. Fix

IPC: H01R1204

CPC classification number: H01R12/58 ,  H05K1/0298 ,  H05K3/4046 ,  H05K3/4623 ,  H05K2201/10303 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/1081

Abstract: A printed circuit board (PCB) comprises a number of electrically conductive layers. Instead of coating, or plating, a PCB through-hole with an electrically conductive material to form a via (for the purpose of connecting together signal paths across the electrically conductive layers)—the via is formed by placing a conductive stake, or conductive pin, in the through-hole.

Abstract translation: 印刷电路板（PCB）包括多个导电层。 代替用导电材料涂覆或镀覆PCB通孔以形成通孔（为了将跨越导电层的信号​​路径连接在一起），通孔是通过放置导电块或导电引脚 ，在通孔中。

公开(公告)号：US06710440B2

公开(公告)日：2004-03-23

申请号：US10224892

申请日：2002-08-20

Applicant: Radha R. Kanaparthy ,  Raj Nair ,  Brent Stone

Inventor： Radha R. Kanaparthy ,  Raj Nair ,  Brent Stone

IPC: H01L2348

CPC classification number: H01L23/488 ,  H01L2924/0002 ,  H01R13/03 ,  H05K3/3447 ,  H05K2201/1059 ,  H01L2924/00

Abstract: An integrated circuit including a die, a first conductor electrically coupled to the die, a second conductor and a conductive liquid that electrically couples the first conductor (e.g., a pin) to the second conductor (e.g., a socket) to lower the resistance between the first conductor and the second conductor.

Abstract translation: 一种集成电路，包括管芯，电耦合到管芯的第一导体，第二导​​体和将第一导体（例如，引脚）电耦合到第二导体（例如，插座）的导电液体，以降低第二导体 第一导体和第二导体。

公开(公告)号：US20040033706A1

公开(公告)日：2004-02-19

申请号：US10222160

申请日：2002-08-16

Inventor： Brooks H. Danley

IPC: H01R012/00

CPC classification number: H01F5/04 ,  H01R12/59 ,  H05K1/189 ,  H05K3/306 ,  H05K2201/091 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/167

Abstract: Device and method including a generally flat and flexible circuit for electrically inter-connecting components therein are provided. The device includes a post including a recessed section configured to receive the flexible circuit through an opening in said circuit. The structures defining the opening in the flexible circuit may be configured to provide a snap-fit between the circuit and the recessed section of the post, and thus avoid undesirable movement of the flex circuit in the presence of vibration.

Abstract translation: 提供了一种包括用于电连接其中部件的大致扁平且柔性的电路的装置和方法。 该装置包括一个柱，该柱包括一个凹部，该凹部被构造成通过所述电路中的开口接收柔性电路。 限定柔性电路中的开口的结构可以被配置为在电路和柱的凹陷部分之间提供卡扣配合，并且因此避免在存在振动的情况下柔性电路的不期望的移动。

公开(公告)号：US06623306B2

公开(公告)日：2003-09-23

申请号：US10142209

申请日：2002-05-08

Applicant: Zhenghua Xu ,  Houg Jun Wang ,  Qisheng Zheng

Inventor： Zhenghua Xu ,  Houg Jun Wang ,  Qisheng Zheng

IPC: H01R2400

CPC classification number: H05K1/0256 ,  H01R12/585 ,  H01R12/7005 ,  H01R12/716 ,  H01R12/724 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H05K1/116 ,  H05K3/28 ,  H05K3/308 ,  H05K2201/099 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: A printed circuit board (23) used in a modular jack (1) includes a plurality of insertion holes (231, 232) defined through an upper side and a lower side thereof. A conductive layer coating (235) coats an inside of each insertion hole and a conductive base ring (236) forms a rim around each end of each hole. A solder mask (230) covers portions of a front and a rear surfaces of the printed circuit board around the insertion holes. The solder mask covers over the base rings and extends a short distance into each insertion hole, thereby increasing a creepage distance between conductive layer coatings of adjacent holes. This protects the printed circuit board from short circuiting.

Abstract translation: 在模块插座（1）中使用的印刷电路板（23）包括通过其上侧和下侧限定的多个插入孔（231,232）。 导电层涂层（235）涂覆在每个插入孔的内部，并且导电基环（236）在每个孔的每个端部周围形成边缘。 焊接掩模（230）覆盖插入孔周围的印刷电路板的前表面和后表面的部分。 焊接掩模覆盖在基座环上并且在每个插入孔中延伸很短的距离，从而增加相邻孔的导电层涂层之间的爬电距离。 这样可以保护印刷电路板免受短路。