公开(公告)号：US20180023214A1

公开(公告)日：2018-01-25

申请号：US15656457

申请日：2017-07-21

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Surajit KUMAR ,  Joseph M. RANISH ,  Zhiyuan YE ,  Kartik SHAH ,  Mehmet Tugrul SAMIR ,  Errol Antonio C. SANCHEZ

IPC: C30B33/02 ,  C23C16/44 ,  C30B25/10

CPC classification number: C30B33/02 ,  C23C16/44 ,  C23C16/46 ,  C30B25/10

Abstract: Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.

公开(公告)号：US20180005856A1

公开(公告)日：2018-01-04

申请号：US15707810

申请日：2017-09-18

Applicant: Applied Materials, Inc.

Inventor： Anzhong CHANG ,  Paul BRILLHART ,  Surajit KUMAR ,  Satheesh KUPPURAO ,  Mehmet Tugrul SAMIR ,  David K. CARLSON ,  Steve ABOAGYE ,  Anh N. NGUYEN ,  Kailash Kiran PATALAY ,  Joseph M. RANISH ,  Oleg V. SEREBRYANOV ,  Dongming IU ,  Shu-Kwan LAU ,  Zuoming ZHU ,  Herman DINIZ

IPC: H01L21/67 ,  C23C16/455

CPC classification number: H01L21/67115 ,  C23C16/45504

Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.

公开(公告)号：US20200040451A1

公开(公告)日：2020-02-06

申请号：US16521826

申请日：2019-07-25

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Schubert CHU ,  Nyi O. MYO ,  Kartik SHAH ,  Surajit KUMAR

IPC: C23C16/44 ,  C23C16/46 ,  C23C16/458 ,  C30B25/08

Abstract: Embodiments herein relate to chamber liners with a multi-piece design for use in processing chambers. The multi-piece design can have an inner portion and an outer portion. A portion of the inner surface of the outer portion may be designed to be in contact with the outer surface of the inner portion at a single junction point, creating a thermal barrier between the inner portion and outer portion, thus reducing heat transfer from the inner portion and outer portion. The thermal barrier creates higher temperatures at the chamber liner inner surface and therefore leads to shorter heat up times within the chamber. Additionally, the thermal barrier also creates lower temperatures near the base ring and outer surface of the outer ring, thereby protecting the chamber walls and requiring less thermal regulation/dissipation at the chamber walls.

公开(公告)号：US20160230276A1

公开(公告)日：2016-08-11

申请号：US15136119

申请日：2016-04-22

Applicant: Applied Materials, Inc.

Inventor： Steve ABOAGYE ,  Paul BRILLHART ,  Surajit KUMAR ,  Anzhong CHANG ,  Satheesh KUPPURAO ,  Mehmet Tugrul SAMIR ,  David K. CARLSON

IPC: C23C16/455 ,  C23C16/458

CPC classification number: C23C16/45502 ,  C23C16/4411 ,  C23C16/45504 ,  C23C16/45563 ,  C23C16/458 ,  C23C16/4584 ,  C23C16/481

Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.

Abstract translation: 本文所述的实施例涉及用于衬底处理室中的基座环组件。 在一个实施例中，基环组件包括尺寸适于容纳在基板处理室的内圆周内的环体，环体包括用于通过基板的装载口，气体入口和气体出口，其中， 气体入口和气体出口设置在环体的相对端，并且配置成设置在环体的顶表面上的上环和被配置为设置在环体的底表面上的下环，其中， 一旦组装，上环，下环和环体大致同心或同轴。

公开(公告)号：US20230167581A1

公开(公告)日：2023-06-01

申请号：US17919896

申请日：2021-07-16

Applicant: Applied Materials, Inc.

Inventor： Kartik Bhupendra SHAH ,  Schubert S. CHU ,  Adel George TANNOUS ,  Ala MORADIAN ,  Nyi Oo MYO ,  Surajit KUMAR ,  Zuoming ZHU ,  Brian Hayes BURROWS ,  Vishwas Kumar PANDEY ,  Shu-Kwan LAU ,  Srinivasa RANGAPPA

IPC: C30B25/10 ,  H01L21/687 ,  H01L21/67 ,  C30B25/18 ,  C30B25/08 ,  C23C16/02

CPC classification number: C30B25/105 ,  H01L21/68771 ,  H01L21/68764 ,  H01L21/67248 ,  H01L21/68757 ,  C30B25/186 ,  C30B25/08 ,  C23C16/0209 ,  C23C16/0227

Abstract: A process kit for use in a processing chamber includes an outer liner, an inner liner configured to be in fluid communication with a gas injection assembly and a gas exhaust assembly of a processing chamber, a first ring reflector disposed between the outer liner and the inner liner, a top plate and a bottom plate attached to an inner surface of the inner liner, the top plate and the bottom plate forming an enclosure together with the inner liner, a cassette disposed within the enclosure, the cassette comprising a plurality of shelves configured to retain a plurality of substrates thereon, and an edge temperature correcting element disposed between the inner liner and the first ring reflector.

公开(公告)号：US20150083046A1

公开(公告)日：2015-03-26

申请号：US14495654

申请日：2014-09-24

Applicant: Applied Materials, Inc.

Inventor： Joseph M. RANISH ,  Paul BRILLHART ,  Mehmet Tugrul SAMIR ,  Shu-Kwan LAU ,  Surajit KUMAR

IPC: C23C16/458 ,  C23C16/48 ,  C23C16/46

CPC classification number: C23C16/4581 ,  C23C16/4408 ,  C23C16/4584 ,  C23C16/4585 ,  C23C16/46 ,  C23C16/481

Abstract: Embodiments described herein generally relate to an apparatus for heating substrates. In one embodiment, a susceptor comprises a ring shaped body having a central opening and a lip extending from an edge of the body that circumscribes the central opening. The susceptor comprises carbon fiber or graphene. In another embodiment, a method for forming a susceptor comprises molding carbon fiber with an organic binder into a shape of a ring susceptor and firing the organic binder. In yet another embodiment, a method for forming a susceptor comprises layering graphene sheets into a shape of a ring susceptor.

Abstract translation: 本文描述的实施例通常涉及用于加热基板的装置。 在一个实施例中，感受器包括具有中心开口的环形主体和从该主体的边缘延伸以限制中心开口的唇缘。 感受体包括碳纤维或石墨烯。 在另一个实施例中，用于形成基座的方法包括将具有有机粘合剂的碳纤维模制成环形基座的形状并烧制有机粘合剂。 在另一个实施例中，形成基座的方法包括将石墨烯片层压成环形基座的形状。

公开(公告)号：US20140199056A1

公开(公告)日：2014-07-17

申请号：US14132215

申请日：2013-12-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Anzhong CHANG ,  Paul BRILLHART ,  Surajit KUMAR ,  Satheesh KUPPURAO ,  Mehmet Tugrul SAMIR ,  David K. CARLSON ,  Steve ABOAGYE ,  Anh N. NGUYEN ,  Kailash Kiran PATALAY ,  Joseph M. RANISH ,  Oleg SEREBRYANOV ,  Dongming IU ,  Shu-Kwan LAU ,  Zuoming ZHU ,  Herman DINIZ

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  C23C16/45504

Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.

Abstract translation: 本发明的实施例涉及一种圆顶组件。 圆顶组件包括上拱顶，其包括中心窗，以及在中心窗的圆周处接合中心窗的上周缘，其中中心窗的内表面上的切线穿过中心窗的交点 并且上周缘相对于周缘凸缘的平面上表面成大约8°至大约16°的​​角度，下圆顶包括下周边凸缘和将下周边凸缘连接到中心开口的底部， 其中穿过底部和下部周边凸缘的交叉点的底部外表面上的切线相对于下部周边凸缘的平坦底面成约8°至约16°的​​角度。

公开(公告)号：US20230230859A1

公开(公告)日：2023-07-20

申请号：US17919911

申请日：2021-07-12

Applicant: Applied Materials, Inc.

Inventor： Adel George TANNOUS ,  Schubert S. CHU ,  Shu-Kwan LAU ,  Kartik Bhupendra SHAH ,  Zuoming ZHU ,  Ala MORADIAN ,  Surajit KUMAR ,  Srinivasa RANGAPPA ,  Chia Cheng CHIN ,  Vishwas Kumar PANDEY

IPC: H01L21/67 ,  H01L21/687 ,  H05B3/00

CPC classification number: H01L21/67115 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/68771 ,  H05B3/0047

Abstract: A batch processing chamber and a process kit for use therein are provided. The process kit includes an outer liner having an upper outer liner and a lower outer liner, an inner liner, and a top plate and a bottom plate attached to an inner surface of the inner liner. The top plate and the bottom plate form an enclosure together with the inner liner, and a cassette is disposed within the enclosure. The cassette including shelves configured to retain a plurality of substrates thereon. The inner liner has inlet openings disposed on an injection side of the inner liner and configured to be in fluid communication with a gas injection assembly of a processing chamber, and outlet openings disposed on an exhaust side of the inner liner and configured to be in fluid communication with a gas exhaust assembly of the processing chamber. The inner surfaces of the enclosure comprise material configured to cause black-body radiation within the enclosure.

公开(公告)号：US20160348276A1

公开(公告)日：2016-12-01

申请号：US15167480

申请日：2016-05-27

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Surajit KUMAR ,  Kartik SHAH ,  Mehmet Tugrul SAMIR

IPC: C30B25/16 ,  C23C16/48

CPC classification number: C23C16/482 ,  C23C16/481 ,  C30B25/08 ,  C30B25/105

Abstract: A reflector for processing a semiconductor substrate is provided. The reflector includes an annular body having an outer edge, an inner edge, and a bottom side. The bottom side includes a plurality of first surfaces and a plurality of second surfaces. Each first surface and each second surface is positioned at a different angular location around the annular body. Each first surface is a curved surface having a radius of curvature from about 1.50 inches to about 2.20 inches.

Abstract translation: 提供了一种用于处理半导体衬底的反射器。 反射器包括具有外边缘，内边缘和底侧的环形体。 底侧包括多个第一表面和多个第二表面。 每个第一表面和每个第二表面位于围绕环形体的不同的角位置。 每个第一表面是具有约1.50英寸至约2.20英寸的曲率半径的曲面。