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公开(公告)号:US20210175115A1
公开(公告)日:2021-06-10
申请号:US17183146
申请日:2021-02-23
Applicant: Applied Materials, Inc.
Inventor: Anhthu NGO , Zuoming ZHU , Balasubramanian RAMACHANDRAN , Paul BRILLHART , Edric TONG , Anzhong CHANG , Kin Pong LO , Kartik SHAH , Schubert S. CHU , Zhepeng CONG , James Francis MACK , Nyi O. MYO , Kevin Joseph BAUTISTA , Xuebin LI , Yi-Chiau HUANG , Zhiyuan YE
IPC: H01L21/687 , C30B25/12 , B05C13/02 , B05C13/00 , H01L21/673
Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.
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公开(公告)号:US20210066039A1
公开(公告)日:2021-03-04
申请号:US16988466
申请日:2020-08-07
Applicant: Applied Materials, Inc.
Inventor: Jian LI , Viren KALSEKAR , Paul BRILLHART , Juan Carlos ROCHA-ALVAREZ , Vinay K. PRABHAKAR
IPC: H01J37/32 , H01L21/67 , H01L21/683 , C23C16/505 , C23C16/458 , C23C16/46
Abstract: One or more embodiments described herein generally relate to a semiconductor processing apparatus that utilizes high radio frequency (RF) power to improve uniformity. The semiconductor processing apparatus includes an RF powered primary mesh and an RF powered secondary mesh, which are disposed in a substrate supporting element. The secondary RF mesh is positioned underneath the primary RF mesh. A connection assembly is configured to electrically couple the secondary mesh to the primary mesh. RF current flowing out of the primary mesh is distributed into multiple connection junctions. As such, even at high total RF power/current, a hot spot on the primary mesh is prevented because the RF current is spread to the multiple connection junctions. Accordingly, there is less impact on substrate temperature and film non-uniformity, allowing much higher RF power to be used without causing a local hot spot on the substrate being processed.
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公开(公告)号:US20180366363A1
公开(公告)日:2018-12-20
申请号:US16109945
申请日:2018-08-23
Applicant: Applied Materials, Inc.
Inventor: Anhthu NGO , Zuoming ZHU , Balasubramanian RAMACHANDRAN , Paul BRILLHART , Edric TONG , Anzhong CHANG , Kin Pong LO , Kartik SHAH , Schubert S. CHU , Zhepeng CONG , James Francis MACK , Nyi O. MYO , Kevin Joseph BAUTISTA , Xuebin LI , Yi-Chiau HUANG , Zhiyuan YE
IPC: H01L21/687
Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.
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公开(公告)号:US20150368829A1
公开(公告)日:2015-12-24
申请号:US14745979
申请日:2015-06-22
Applicant: Applied Materials, Inc.
Inventor: Anhthu NGO , Schubert S. CHU , Nyi O. MYO , Paul BRILLHART , Yi-Chiau HUANG , Zuoming ZHU , Kevin Joseph BAUTISTA , Kartik SHAH , Edric TONG , Xuebin LI , Zhepeng CONG , Balasubramanian RAMACHANDRAN
IPC: C30B25/12
CPC classification number: C30B25/12 , C23C16/4586
Abstract: In one embodiment, a susceptor for a thermal processing chamber is provided. The susceptor includes a base having a front side and a back side made of a thermally conductive material opposite the front side, wherein the base includes a peripheral region surrounding a recessed area having a thickness that is less than a thickness of the peripheral region, and a plurality of raised features protruding from one or both of the front side and the back side.
Abstract translation: 在一个实施例中,提供了用于热处理室的基座。 感受体包括具有与前侧相反的导热材料制成的前侧和后侧的基部,其中,所述基部包括围绕具有小于周边区域的厚度的凹部的凹部的周边区域,以及 从前侧和后侧的一个或两个突出的多个凸起特征。
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公开(公告)号:US20140254150A1
公开(公告)日:2014-09-11
申请号:US14175459
申请日:2014-02-07
Applicant: Applied Materials, Inc.
Inventor: Joseph M. RANISH , Mehmet Tugrul SAMIR , Paul BRILLHART
IPC: F21V15/01
CPC classification number: H01L21/67115 , C23C16/4411 , C23C16/463
Abstract: Embodiments described herein generally relate to apparatus for processing substrates. The apparatus generally include a process chamber having a substrate support therein. A plurality of lamps are positioned to provide radiant energy through an optically transparent window to a substrate positioned on the substrate support. The plurality of lamps are positioned in a lamp housing. A cooling channel is formed in the lamp housing. A surface of the lamp housing is spaced a distance from the optically transparent window to form a gap therebetween. The gap functions as a fluid channel and is adapted to contain a fluid therein to facilitate cooling of the optically transparent window. Turbulence inducing features, such as openings, formed in the surface of the lamp housing induce a turbulent flow of the cooling fluid, thus improving heat transfer between the optically transparent window and the lamp housing.
Abstract translation: 本文描述的实施例一般涉及用于处理衬底的设备。 该设备通常包括其中具有衬底支撑件的处理室。 定位多个灯以通过光学透明的窗口将辐射能提供给位于基板支撑件上的基板。 多个灯被定位在灯壳体中。 在灯壳中形成冷却通道。 灯壳的表面与光学透明窗口间隔一段距离,以在它们之间形成间隙。 间隙用作流体通道并且适于在其中容纳流体以便于光学透明窗的冷却。 在灯壳表面形成的诸如开口的湍流诱发特征引起冷却流体的湍流,从而改善了光学透明窗和灯壳之间的热传递。
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公开(公告)号:US20170338135A1
公开(公告)日:2017-11-23
申请号:US15673801
申请日:2017-08-10
Applicant: Applied Materials, Inc.
Inventor: Joseph M. RANISH , Mehmet Tugrul SAMIR , Paul BRILLHART
CPC classification number: H01L21/67115 , C23C16/4411 , C23C16/463
Abstract: Embodiments described herein generally relate to apparatus for processing substrates. The apparatus generally include a process chamber having a substrate support therein. A plurality of lamps are positioned to provide radiant energy through an optically transparent window to a substrate positioned on the substrate support. The plurality of lamps are positioned in a lamp housing. A cooling channel is formed in the lamp housing. A surface of the lamp housing is spaced a distance from the optically transparent window to form a gap therebetween. The gap functions as a fluid channel and is adapted to contain a fluid therein to facilitate cooling of the optically transparent window. Turbulence inducing features, such as openings, formed in the surface of the lamp housing induce a turbulent flow of the cooling fluid, thus improving heat transfer between the optically transparent window and the lamp housing.
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公开(公告)号:US20170130359A1
公开(公告)日:2017-05-11
申请号:US15415982
申请日:2017-01-26
Applicant: Applied Materials, Inc.
Inventor: Joseph M. RANISH , Paul BRILLHART , Jose Antonio MARIN , Satheesh KUPPURAO , Balasubramanian RAMACHANDRAN , Swaminathan T. SRINIVASAN , Mehmet Tugrul SAMIR
IPC: C30B25/10 , C30B25/16 , C30B25/12 , H01L21/67 , C23C16/48 , C23C16/52 , G01J5/10 , G01J5/00 , C30B25/08 , C23C16/458
CPC classification number: C30B25/105 , C23C16/4583 , C23C16/481 , C23C16/52 , C30B25/08 , C30B25/12 , C30B25/14 , C30B25/16 , G01J5/0007 , G01J5/10 , G01J2005/106 , H01L21/0262 , H01L21/67115 , H01L21/67248 , H01L22/10 , H01L22/20
Abstract: A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.
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公开(公告)号:US20160033070A1
公开(公告)日:2016-02-04
申请号:US14550723
申请日:2014-11-21
Applicant: Applied Materials, Inc.
Inventor: Paul BRILLHART , Edric TONG , Anzhong CHANG , David K. CARLSON , Errol Antonio C. SANCHEZ , James Francis MACK , Kin Pong LO , Zhiyuan YE
IPC: F16L55/00
CPC classification number: H01L21/67115 , C23C16/4412 , C23C16/45565 , C23C16/45574 , C23C16/481
Abstract: Embodiments of the disclosure relate to a perimeter pumping member for a processing chamber. The perimeter pumping member comprises a ring-shaped body having a first curved channel along an arc within the ring-shaped body, a first inner channel connecting a first region of the first curved channel to a first region of an inner surface of the ring-shaped body, a plurality of second inner channels connecting a second region of the first curved channel to a second region of the inner surface, and a first outer channel connecting the first region of the first curved channel to an outer surface of the ring-shaped body, wherein the second inner channels are each sized such that, when a fluid is pumped out of the perimeter pumping member via the first outer channel, the fluid flows through the first inner channel and the second inner channels at a uniform flow rate.
Abstract translation: 本公开的实施例涉及用于处理室的周边泵送构件。 周边泵送构件包括环形体,其具有沿环形体内的弧形的第一弯曲通道,将第一弯曲通道的第一区域连接到环形体的内表面的第一区域的第一内部通道, 多个第二内部通道,将第一弯曲通道的第二区域连接到内表面的第二区域;以及第一外部通道,其将第一弯曲通道的第一区域连接到环形体的外表面 其中所述第二内部通道的尺寸设计成使得当流体经由所述第一外部通道从所述周边泵送构件泵出时,所述流体以均匀的流速流过所述第一内部通道和所述第二内部通道。
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公开(公告)号:US20150368830A1
公开(公告)日:2015-12-24
申请号:US14737974
申请日:2015-06-12
Applicant: Applied Materials, Inc.
Inventor: Paul BRILLHART , Kin Pong LO , Edric TONG , Satheesh KUPPURAO , Balasubramanian RAMACHANDRAN
CPC classification number: C30B25/14 , C23C16/4412 , C23C16/45504 , C23C16/45563 , C30B25/08 , Y10T428/218
Abstract: Embodiments of the disclosure relate to a one-piece injector assembly. The injector assembly includes a plurality of channels for introducing process gas into a processing chamber while keeping the gas flow of each channel separate from the gas flow in each other channel. In addition, embodiments of the disclosure relate to upper and lower liners accommodating the one-piece injector assembly, methods for installing the injector assembly, and a processing chamber utilizing the one-piece injector assembly.
Abstract translation: 本公开的实施例涉及一体式喷射器组件。 喷射器组件包括多个通道,用于将处理气体引入处理室,同时保持每个通道的气流与每个通道中的气流隔开。 此外,本公开的实施例涉及容纳一体式喷射器组件的上部衬垫和下部衬套,用于安装喷射器组件的方法以及利用一体式喷射器组件的处理室。
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公开(公告)号:US20150083046A1
公开(公告)日:2015-03-26
申请号:US14495654
申请日:2014-09-24
Applicant: Applied Materials, Inc.
Inventor: Joseph M. RANISH , Paul BRILLHART , Mehmet Tugrul SAMIR , Shu-Kwan LAU , Surajit KUMAR
IPC: C23C16/458 , C23C16/48 , C23C16/46
CPC classification number: C23C16/4581 , C23C16/4408 , C23C16/4584 , C23C16/4585 , C23C16/46 , C23C16/481
Abstract: Embodiments described herein generally relate to an apparatus for heating substrates. In one embodiment, a susceptor comprises a ring shaped body having a central opening and a lip extending from an edge of the body that circumscribes the central opening. The susceptor comprises carbon fiber or graphene. In another embodiment, a method for forming a susceptor comprises molding carbon fiber with an organic binder into a shape of a ring susceptor and firing the organic binder. In yet another embodiment, a method for forming a susceptor comprises layering graphene sheets into a shape of a ring susceptor.
Abstract translation: 本文描述的实施例通常涉及用于加热基板的装置。 在一个实施例中,感受器包括具有中心开口的环形主体和从该主体的边缘延伸以限制中心开口的唇缘。 感受体包括碳纤维或石墨烯。 在另一个实施例中,用于形成基座的方法包括将具有有机粘合剂的碳纤维模制成环形基座的形状并烧制有机粘合剂。 在另一个实施例中,形成基座的方法包括将石墨烯片层压成环形基座的形状。
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