公开(公告)号：JPS61252648A

公开(公告)日：1986-11-10

申请号：JP1598586

申请日：1986-01-29

Applicant: IBM

Inventor： CLODGO DONNA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  WALTON ERICK GREGORY

IPC: H01L21/3205 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/768 ,  H05K3/14

公开(公告)号：DE3787772D1

公开(公告)日：1993-11-18

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48

公开(公告)号：MY121455A

公开(公告)日：2006-01-28

申请号：MYPI20005562

申请日：2000-11-28

Applicant: IBM

Inventor： WALTON ERICK GREGORY ,  UZOH CYPRIAN EMEKA ,  CHUNG DEAN S ,  COLLINS LARA SANDRA ,  CORBIN WILLIAM E ,  DELIGIANNI HARIKLIA ,  EDELSTEIN DANIEL CHARLES ,  FLUEGEL JAMES E ,  KOREJWA JOSEF WARREN ,  LOCKE PETER S

IPC: C25D5/22 ,  C25D5/06 ,  C25D17/00 ,  C25D17/14

Abstract: AA METAL PLATING APPARATUS IS DESCRIBED WHICH INCLUDES A COMPRESSIBLE MEMBER HAVING A CONDUCTIVE SURFACE COVERING SUBSTANTIALLY ALL OF THE SURFACE OF THE SUBSTRATE TO BE PLATED. THE PLATING CURRENT IS THEREBY TRANSMITTED OVER A WIDE AREA OF THE SUBSTRATE, RATHER THAN A FEW LOCALIZED CONTACT POINTS. THE COMPRESSIBLE MEMBER IS POROUS SO AS TO ABSORB THE PLATING SOLUTION AND TRANSMIT THE PLATING SOLUTION TO THE SUBSTRATE. THE WAFER AND COMPRESSIBLE MEMBER MAY ROTATE WITH RESPECT TO EACH OTHER. THE COMPRESSIBLE MEMBER MAY BE AT CATHODE POTENTIAL OR MAY BE A PASSIVE CIRCUIT ELEMENT.

公开(公告)号：DE3685906T2

公开(公告)日：1993-02-04

申请号：DE3685906

申请日：1986-04-15

Applicant: IBM

Inventor： CLODGO DONNA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  WALTON ERICK GREGORY

IPC: H01L21/3205 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/768 ,  H05K3/14 ,  H01L21/90

公开(公告)号：DE3685906D1

公开(公告)日：1992-08-13

申请号：DE3685906

申请日：1986-04-15

Applicant: IBM

Inventor： CLODGO DONNA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  WALTON ERICK GREGORY

IPC: H01L21/3205 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/768 ,  H05K3/14 ,  H01L21/90

公开(公告)号：DE3787772T2

公开(公告)日：1994-05-05

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48

公开(公告)号：DE3683461D1

公开(公告)日：1992-02-27

申请号：DE3683461

申请日：1986-10-07

Applicant: IBM

Inventor： CLODGO DONNA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  WALTON ERICK GREGORY

IPC: B32B27/00 ,  C08G77/38 ,  C08J5/18 ,  C09D183/04 ,  H01L21/312

Abstract: By hydrolyzing an organoalkoysilane monomer at high concentration in solution to form a silanol, allowing the silanol to age to produce a low molecular weight oligomer, spin-applying the oligomer onto a substrate to form a discrete film of highly associated cyclic oligomer thereon, heat treating the oligomer film to form a modified ladder-type silsesquioxane condensation polymer, and then oxidizing the silsesquioxane in an 0₂ RIE, an organoglass is formed which presents novel etch properties. The organoglass can be used as an etch-stop layer in a passivation process.