Abstract:
In an input device (30), a control element (32) is operated by a user; a pressure sensor (1) is mechanically coupled to the control element (32) and is provided with a monolithic body (2) of semiconductor material housing a first sensitive element (4), which detects an actuation of the control element (32); a supporting element (34) is connected to the pressure sensor (1); and connection elements (38) electrically connect the monolithic body (2) to the supporting element (34) without interposition of a package. In particular, the monolithic body (2) has electrical-contact areas (6) carried by one main surface (2a) thereof, and the printed circuit board (34) has conductive regions (37) carried by a main face (34) thereof; the connection elements (38) are conductive bumps and electrically connect the electrical-contact areas (6) to the conductive regions (37).
Abstract:
Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises: - a substrate (2) provided with at least one passing opening (5), - a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at lesat one portion (11) sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11 a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises - a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).
Abstract:
Surface acoustic wave pressure sensor (1) comprising: - a substrate (3) and at least one flexible membrane (5), suspended over a cavity (4) defined in the thickness of the substrate, the membrane (5) being elastically deformable by a pressure (P) applied by a fluid (5) and being defined between a first surface (5a) facing the cavity (4) and a second opposite surface (5b); - a SAW device (6, 7 8) comprising a layer of piezoelectric material (6) arranged on said second surface (5b) of the membrane, the SAW device further comprising at least one SAW electro-acoustic transducer (7, 8) formed on one free surface of said piezoelectric layer (6). The piezoelectric layer (6) is formed by deposition of piezoelectric material on the membrane (5) and the substrate (3) is integrated in a wafer of semiconductor material (2), the membrane being a layer of said wafer (2) suspended over said cavity (4).
Abstract:
Two suspended masses (1, 3) are configured so as to be flowed by respective currents (I) flowing in the magnetometer plane in mutually transversal directions and are capacitively coupled to lower electrodes (18b). Mobile sensing electrodes (11) are carried by the first suspended mass (1) and are capacitively coupled to respective fixed sensing electrodes (12). The first suspended mass (1) is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a first horizontal direction (X). The second suspended mass (3) is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a second horizontal direction (Y), and the first suspended mass is configured so as to be mobile in a direction parallel to the plane and transversal to the current flowing in the first suspended mass in presence of a magnetic field having a component in a vertical direction (Z).
Abstract:
A manufacturing process of a semiconductor pressure-monitoring device (30) is disclosed, envisaging: providing a wafer (31) of semiconductor material; providing, in a first region (34a) of the wafer (31) a first buried cavity (22) and a first membrane (23), suspended over, and closing at the top, the first buried cavity (22); providing, in a second region (34b) of the wafer (31), a second buried cavity (40) and a second membrane (41), suspended over, and closing at the top, the second buried cavity (40); coupling an inertial mass (25) in a rigid way to the first membrane (23), by forming the inertial mass (25) on top of a surface of the first membrane (23) opposite to the first buried cavity (22); providing, in the first membrane (23), first piezoresistive transduction elements (24) sensitive to strains of the first membrane (23) due to movements of the inertial mass (25) in response to a sensed acceleration and generating corresponding electrical signals, so as to provide an acceleration sensor (35); and providing, in the second membrane (41), second piezoresistive transduction elements (42) sensitive to strains of the second membrane (41) in response to a sensed pressure and generating corresponding electrical signals, so as to provide a pressure sensor (36) integrated with the acceleration sensor (35) in the wafer (31). A semiconductor pressure-monitoring device (30) is also disclosed, made with the above manufacturing process.
Abstract:
A manufacturing process of a semiconductor piezoresistive accelerometer (35) includes the steps of: providing a wafer (11) of semiconductor material; providing a membrane (23) in the wafer (11) over a cavity (22); rigidly coupling an inertial mass (25) to the membrane (23); and providing, in the wafer (11), piezoresistive transduction elements (24), that are sensitive to strains of the membrane (23) and generate corresponding electrical signals. The step of coupling is carried out by forming the inertial mass (25) on top of a surface of the membrane (23) opposite to the cavity (22). The accelerometer (35) is advantageously used in a device for monitoring the pressure (30) of a tyre of a vehicle. The cavity may be formed as a buried cavity. The mass may be formed by silk-screen printing of a metal paste.
Abstract:
In a process for manufacturing an integrated differential pressure sensor, the steps of: forming, in a monolithic body (30) of semiconductor material having a first face (30a) and a second face (30b), a cavity (36) extending at a distance from the first face (30a) and delimiting therewith a flexible membrane (37); forming an access passage (42; 42, 44), in fluid communication with the cavity (36); and forming, in the flexible membrane (37), at least one transduction element (38, 72) configured so as to convert a deformation of the flexible membrane (37) into electrical signals. The cavity (36) is formed in a position set at a distance from the second face (30b) and delimits, together with the second face (30b), a portion of the monolithic body (30). In order to form the access passage (42; 42, 44), the monolithic body (30) is etched so as to form an access trench (42) extending through it.
Abstract:
A manufacturing process of a semiconductor piezoresistive accelerometer (35) includes the steps of: providing a wafer (11) of semiconductor material; providing a membrane (23) in the wafer (11) over a cavity (22); rigidly coupling an inertial mass (25) to the membrane (23); and providing, in the wafer (11), piezoresistive transduction elements (24), that are sensitive to strains of the membrane (23) and generate corresponding electrical signals. The step of coupling is carried out by forming the inertial mass (25) on top of a surface of the membrane (23) opposite to the cavity (22). The accelerometer (35) is advantageously used in a device for monitoring the pressure (30) of a tyre of a vehicle. The cavity may be formed as a buried cavity. The mass may be formed by silk-screen printing of a metal paste.
Abstract:
The semiconductor inertial sensor (30) is formed by a rotor element (38) and a stator element (39) electrostatically coupled together. The rotor element (38) is formed by a suspended mass (40) and by a plurality of mobile electrodes (41) extending from the suspended mass (40). The stator element (39) is formed by a plurality of fixed electrodes (42) facing respective mobile electrodes (41). The suspended mass (40) is supported by elastic suspension elements (45). The suspended mass (40) has a first, larger, thickness (t1 + t2), and the elastic suspension elements (45) have a second thickness (t1), smaller than the first thickness.