公开(公告)号：JP3641225B2

公开(公告)日：2005-04-20

申请号：JP2001270261

申请日：2001-09-06

Applicant: ビステオン グローバル テクノロジーズ インコーポレイテッド

Inventor： ジー． グロヴァツキー アンドリュー ,  ユー（ジョー） シー チョン ,  エヌ．ゴエンカ ラーキ

IPC: H05K1/05 ,  H05K1/11 ,  H05K3/06 ,  H05K3/28 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K3/062 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0373 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09581 ,  H05K2203/1438 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP1377145A4

公开(公告)日：2008-07-30

申请号：EP02707177

申请日：2002-03-27

Applicant: TESSERA INTERCONNECT MATERIALS

Inventor： IIJIMA TOMOO ,  KATO YOSHIRO ,  ODAIRA HIROSHI ,  OHSAWA MASAYUKI ,  KUROSAWA INETARO ,  SAKUMA KAZUO ,  ASANO TOSHIHIKO ,  ENDO KIMITAKA

IPC: B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4647 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/025 ,  H05K3/06 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1157

Abstract: A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring film-forming metal layer and bumps (2a) formed out of the bump-forming metal layer. The multilayer metal sheets are so stacked by repeating a stacking step in such a way that the bump-forming surface of one multilayer metal sheet faces to the wiring film of another multilayer metal sheet. A multilayer wiring board is polished by a polisher (11a) for a multilayer wiring board comprising a metal sheet holding means (13) for holding a metal sheet (1a), a blade holding means (25) for holding a blade (26) above the metal sheet, a height adjusting mechanism (20) for adjusting the height of the blade holding means, and a blade translating mechanism (15) for moving the blade holding means parallel to the surface of the metal sheet.

公开(公告)号：EP1248503A4

公开(公告)日：2006-08-09

申请号：EP00987672

申请日：2000-12-21

Applicant: TOYO KOHAN CO LTD

Inventor： SAIJO KINJI ,  OHSAWA SHINJI ,  OKAMOTO HIROAKI ,  YOSHIDA KAZUO

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/46

CPC classification number: H05K1/0221 ,  H05K3/062 ,  H05K3/4647 ,  H05K2201/0361 ,  H05K2201/09254 ,  H05K2203/0384 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A structure of a multilayer printed wiring board having a wiring lead-out port can be easily formed. A large number of products can be easily manufactured with good size reproducibility. A method of manufacturing the same is also are disclosed. The multilayer printed wiring board is characterized by having a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1 - 3% draft and forming a signal circuit conductor perfectly covered by an earth circuit and the wiring lead-out port.

公开(公告)号：EP1500137A1

公开(公告)日：2005-01-26

申请号：EP03715164.4

申请日：2003-04-10

Applicant: Koninklijke Philips Electronics N.V.

Inventor： GROENHUIS, Roelf, A., J. ,  DIJKSTRA, Paul ,  SCHRIKS, Cornelis, G. ,  VAN DE WATER, Peter, W., M.

IPC: H01L23/31 ,  H01L21/48

CPC classification number: H05K3/062 ,  A23G3/366 ,  A23G4/123 ,  A23L33/135 ,  A23Y2220/77 ,  A61K35/747 ,  C12R1/225 ,  H01L21/4828 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/185 ,  H05K2201/0361 ,  H05K2203/0384 ,  H05K2203/1469 ,  H05K2203/1476 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The carrier ( 30 ) comprises a first etch mask ( 14 ), a first metal layer ( 11 ), an intermediate layer ( 12 ), a second metal layer ( 13 ) and a second etch mask ( 17 ). Both the first and the second etch mask ( 14, 17 ) can be provided in one step by means of electrochemical plating. After the first metal layer ( 11 ) and the intermediate layer ( 12 ) have been patterned through the first etch mask ( 14 ), an electric element ( 20 ) can be suitably attached to the carrier ( 30 ) using conductive means. In this patterning operation, the intermediate layer ( 12 ) is etched further so as to create underetching below the first metal layer ( 11 ). After the provision of an encapsulation ( 40 ), the second metal layer ( 13 ) is patterned through the second etch mask ( 17 ). In this manner, a solderable device ( 10 ) is obtained without a photolithographic step during the assembly process.

公开(公告)号：EP1006765B1

公开(公告)日：2004-09-15

申请号：EP99309654.4

申请日：1999-12-01

Applicant: Ford Motor Company

Inventor： Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R.

IPC: H05K3/46

CPC classification number: H05K3/4685 ,  H05K3/062 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0369 ,  H05K2203/0376

公开(公告)号：EP1204307B1

公开(公告)日：2003-08-27

申请号：EP01125896.9

申请日：2001-10-30

Applicant: Visteon Global Technologies, Inc.

Inventor： Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R. ,  Krautheim, Thomas B.

IPC: H05K3/36

CPC classification number: H05K3/4007 ,  H05K3/062 ,  H05K3/363 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/209 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/1184 ,  Y10S439/943 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

公开(公告)号：EP1006764A3

公开(公告)日：2003-01-15

申请号：EP99309653.6

申请日：1999-12-01

Applicant: Ford Motor Company

Inventor： Li, Delin ,  Achari, Achyuta ,  Zitzmann, Alice Dawn ,  Belke, Robert Edward, Jr. ,  Nation, Brenda Joyce ,  McLeskey, Edward ,  Paruchuri, Mohan R. ,  Goenka, Lakhi Mandlal

IPC: H05K3/46

CPC classification number: H05K3/062 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: A multi-layer circuit board having air bridge crossover structures (90) and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers (52,54) to mechanically and/or electrically fortify the circuit.

公开(公告)号：EP1204303A3

公开(公告)日：2002-12-11

申请号：EP01125894.4

申请日：2001-10-30

Applicant: Visteon Global Technologies, Inc.

Inventor： Achari, Achyuta ,  Baker, Jay D. ,  Paruchuri, Mohan R. ,  Nation, Brenda Joyce ,  Goenka , Lakhi Nandlal ,  Stoica, Vladimir

IPC: H05K1/09 ,  H05K3/02 ,  B23K20/04

CPC classification number: H05K3/022 ,  B32B15/017 ,  B32B15/018 ,  H05K2201/0361 ,  Y10T29/49126

Abstract: A method for forming sets (10,12,14) of tri-metal material involving the use of cladding mills (16,18,20,22). When multiple sets (10,12,14) of tri-metal material are formed, the outside surfaces of each set (10,12,14) is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer (32) on the outside surface of the tri-metal material. Alternatively bonding materials (36) may be used on the intermediate surfaces; such bonding materials (36) can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

公开(公告)号：EP1204303A2

公开(公告)日：2002-05-08

申请号：EP01125894.4

申请日：2001-10-30

Applicant: Visteon Global Technologies, Inc.

Inventor： Achari, Achyuta ,  Baker, Jay D. ,  Paruchuri, Mohan R. ,  Nation, Brenda Joyce ,  Goenka , Lakhi Nandlal ,  Stoica, Vladimir

IPC: H05K3/02

CPC classification number: H05K3/022 ,  B32B15/017 ,  B32B15/018 ,  H05K2201/0361 ,  Y10T29/49126

Abstract: A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

Abstract translation: 涉及使用包壳磨的成套三金属材料的方法。 当形成多组三金属材料时，每组的外表面通过氧化制备以防止每组粘附在上面或下面的组。 氧化的替代方案是在三金属材料的外表面上提供可去除的层。 可选地，结合材料可以用在中间表面上; 这种粘合材料可以选自锡，镍，钛，铬，银和锌。

公开(公告)号：EP1187520A2

公开(公告)日：2002-03-13

申请号：EP01121380.8

申请日：2001-09-06

Applicant: Visteon Global Technologies, Inc.

Inventor： Jairazbhoy, Vivek Amir ,  Pham, Cuong Van ,  Glovatsky, Andrew Z. ,  Krautheim, Thomas Bernd ,  Belke, Robert Edward, Jr.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4084 ,  H05K1/056 ,  H05K3/062 ,  H05K3/4092 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2203/0195 ,  H05K2203/063 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49156

Abstract: The present invention discloses a multi-layer circuit board assembly having a first circuit portion having a top surface and a bottom surface a first pre-circuit assembly which is attached to the top surface of the first circuit portion and which includes a top conductive layer. A second pre-circuit assembly is attached to the bottom surface of the first circuit portion and includes a bottom conductive layer. An aperture is formed through the first circuit portion, the first pre-circuit assembly and the second pre-circuit assembly. A plurality of tab portions are integrally formed from the top conductive layer, which extend through the aperture and which are coupled to the bottom conductive layer.

Abstract translation: 本发明公开了一种多层电路板组件，其具有具有顶表面的第一电路部分和底部表面，其被附接到所述第一电路部分的顶表面，并包括一顶导电层的第一前置电路组合件。 第二预制电路组件附接到第一电路部分的底表面并且包括底部导电层。 通过第一电路部分，第一预电路组件和第二预电路组件形成孔。 多个接片部分由顶部导电层整体形成，其延伸穿过孔并耦合至底部导电层。