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    CIRCUIT BOARD
    91.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240314937A1

    公开(公告)日：2024-09-19

    申请号：US18263621

    申请日：2021-04-26

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Hee Jung LEE ,  Jin Seok LEE ,  Yong Han JEON

    IPC: H05K3/28 ,  H05K1/11

    CPC classification number: H05K3/282 ,  H05K1/113 ,  H05K2201/09218 ,  H05K2203/1377

    Abstract: A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.

    CIRCUIT STRUCTURE
    92.
    发明公开
    CIRCUIT STRUCTURE 审中-公开

    公开(公告)号：US20240306295A1

    公开(公告)日：2024-09-12

    申请号：US18119268

    申请日：2023-03-08

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Wen-Long LU

    IPC: H05K1/11 ,  H01L21/768 ,  H05K1/02 ,  H05K3/40

    CPC classification number: H05K1/115 ,  H01L21/76871 ,  H05K1/024 ,  H05K3/40 ,  H05K2201/09145 ,  H05K2201/09218 ,  H05K2201/095 ,  H05K2203/0502

    Abstract: A circuit structure includes a low-density conductive structure, a high-density conductive structure and a plurality of traces. The high-density conductive structure is disposed over the low-density conductive structure, and defines an opening extending from a top surface of the high-density conductive structure to a bottom surface of the high-density conductive structure. The opening exposes a first pad of the low-density conductive structure and a second pad of the low-density conductive structure. The second pad is spaced apart from the first pad. The traces extend from the top surface of the high-density conductive structure into the opening. The traces include a first trace connecting to the first pad of the low-density conductive structure and a second trace connecting to the second pad of the low-density conductive structure.

    STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL
    94.
    发明公开
    STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL 审中-公开

    公开(公告)号：US20240098886A1

    公开(公告)日：2024-03-21

    申请号：US17948893

    申请日：2022-09-20

    Applicant: DELL PRODUCTS L.P.

    Inventor： Sandor Farkas ,  Bhyrav Mutnury ,  Timothy M. Lambert

    IPC: H05K1/02 ,  H01P3/08 ,  H05K1/05

    CPC classification number: H05K1/0248 ,  H01P3/081 ,  H05K1/0245 ,  H05K1/05 ,  H05K2201/09218

    Abstract: A printed circuit board includes first and second insulating layers, first and second strip line circuit traces formed on a surface of the first insulating layer, and a patterned dielectric material. The first strip line circuit trace has a first length and carries a first signal. The second strip line circuit trace is adjacent to the first strip line circuit trace, has a second length longer than the first length, and carries a second signal. The patterned dielectric material is provided over a portion of the first length to delay the first signal relative to the second signal. The second insulating layer is affixed to the surface and covers the first and second strip line circuit traces and the patterned dielectric material.

    POSITION DETECTION SENSOR AND METHOD FOR MANUFACTURING POSITION DETECTION SENSOR
    96.
    发明申请
    POSITION DETECTION SENSOR AND METHOD FOR MANUFACTURING POSITION DETECTION SENSOR 审中-公开

    公开(公告)号：US20180059828A1

    公开(公告)日：2018-03-01

    申请号：US15804553

    申请日：2017-11-06

    Applicant: Wacom Co., Ltd.

    Inventor： Yoshiharu Matsumoto

    IPC: G06F3/046 ,  H05K1/02 ,  H05K3/10 ,  H05K3/28

    CPC classification number: G06F3/046 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/10 ,  H05K3/28 ,  H05K2201/09218

    Abstract: A terminal, in which terminal conductors are disposed, is preliminarily formed on one surface of a substrate. Electrode conductors including covered lead wires are disposed in a region on the one surface of the substrate that does not overlap the terminal, the electrode conductors being bonded to the substrate by an adhesive material to form a predetermined conductor pattern, whereby a sensor pattern is disposed on the substrate. The lead wires of the electrode conductors are exposed due to the covering being removed at ends of the covered lead wires, the exposed lead wires are disposed while being aligned with and connectable to the corresponding terminal conductors of the terminal. The terminal conductors of the terminal and respective exposed lead wires of the electrode conductors of the sensor pattern are then electrically connected.

    PRINTED CIRCUIT BOARD FOR REDUCING COMMON MODE CURRENT AND A METHOD THEREOF
    97.
    发明申请
    PRINTED CIRCUIT BOARD FOR REDUCING COMMON MODE CURRENT AND A METHOD THEREOF 审中-公开

    公开(公告)号：US20170347445A1

    公开(公告)日：2017-11-30

    申请号：US15603554

    申请日：2017-05-24

    Applicant: Hitachi, Ltd.

    Inventor： Rohan BAROT ,  K. Ramachandra SEKHAR

    IPC: H05K1/02

    CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/09218 ,  H05K2201/09672

    Abstract: The present disclosure relates to a PCB and a method in the PCB for reducing common-mode current. The PCB comprises two differential lines and each of the differential lines is on one or more planes of the PCB. The two differential lines carry a differential mode current and the common mode current. The differential mode current and the common mode current may be at least one of a forward current and a backward current. Further, a predefined configuration is formed using each of the two differential lines to generate impedance at the predefined configuration. Here, the predefined configuration is placed close to each other to generate a dielectric capacitance. The flow of the forward current and the backward current in adjacent tracks of each of the two differential lines in the predefined configuration are in opposite direction.

    OPTICALLY TRANSPARENT CONDUCTIVE MATERIAL
    98.
    发明申请
    OPTICALLY TRANSPARENT CONDUCTIVE MATERIAL 有权

    公开(公告)号：US20170344151A1

    公开(公告)日：2017-11-30

    申请号：US15533416

    申请日：2015-12-10

    Applicant: MITSUBISHI PAPER MILLS LIMITED

    Inventor： Takenobu Yoshiki ,  Kazuhiko Sunada

    IPC: G06F3/044 ,  H05K1/02

    CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04111 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0289 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/09218 ,  H05K2201/09781

    Abstract: Provided is an optically transparent conductive material which is suitable as an optically transparent electrode for capacitive touchscreens, the optically transparent conductive material not causing moire even when placed over a liquid crystal display, having a favorably low pattern conspicuousness (non-conspicuousness), and having a high reliability. The optically transparent conductive material has, on an optically transparent support, an optically transparent conductive layer having optically transparent sensor parts electrically connected to terminal parts and optically transparent dummy parts not electrically connected to terminal parts, and in this optically transparent conductive material, the sensor parts and the dummy parts are formed of a metal thin line pattern having a mesh shape, and in the plane of the optically transparent conductive layer, the contour shape of each of the sensor parts extends in a first direction, the dummy parts are arranged alternately with the sensor parts in a second direction perpendicular to the first direction, the sensor parts are arranged at a cycle of L in the second direction, at least part of the metal thin line pattern in the sensor parts has a cycle of 2L/N in the second direction (wherein N is any natural number), and the metal thin line pattern in the dummy parts has a cycle longer than 2L/N or does not have a cycle in the second direction.

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