公开(公告)号：US3426426A

公开(公告)日：1969-02-11

申请号：US3426426D

申请日：1967-02-27

Applicant: DAVID E BORN

Inventor： BORN DAVID E

IPC: H05K3/00 ,  H05K3/10 ,  H01B13/00 ,  H05K13/00

CPC classification number: H05K3/10 ,  H05K3/00 ,  H05K2201/09963 ,  H05K2203/0235 ,  Y10T29/49126 ,  Y10T29/49798 ,  Y10T29/4981

公开(公告)号：US3180798A

公开(公告)日：1965-04-27

申请号：US9137061

申请日：1961-02-24

Applicant: SULZER AG

Inventor： ALFRED BRUNNER

IPC: F22B1/14 ,  G21C1/08 ,  G21D3/14 ,  G21D5/06 ,  H05K1/00

CPC classification number: G21D5/06 ,  F22B1/143 ,  G21C1/082 ,  G21D3/14 ,  H05K1/0289 ,  H05K2201/09963 ,  Y02E30/40

公开(公告)号：US20160360618A1

公开(公告)日：2016-12-08

申请号：US14778027

申请日：2014-12-26

Applicant: INTEL CORPORATION

Inventor： Adel A. ELSHERBINI ,  Aleksandar ALEKSOV ,  Sasha N. Oster ,  Shawna M. LIFF

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/115 ,  H01L23/58 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/0286 ,  H05K1/144 ,  H05K1/181 ,  H05K3/303 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/09609 ,  H05K2201/09636 ,  H05K2201/09963 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10583 ,  H01L2924/00

Abstract: An apparatus including a substrate including a first side and an opposite second side; at least one first circuit device on the first side of the substrate, at least one second device on the second side of the substrate; and a support on the second side of the substrate, the support including interconnections connected to the at least one first and second circuit device, the support having a thickness dimension operable to define a dimension from the substrate greater than a thickness dimension of the at least one second circuit device. A method including disposing at least one first circuit component on a first side of a substrate; disposing at least one second circuit component on a second side of the substrate; and coupling a support to the substrate, the substrate defining a dimension from the substrate greater than a thickness dimension of the at least one second circuit component.

Abstract translation: 一种装置，包括：基板，包括第一侧和相对的第二侧; 在衬底的第一侧上的至少一个第一电路器件，在衬底的第二侧上的至少一个第二器件; 以及在所述基板的第二侧上的支撑件，所述支撑件包括连接到所述至少一个第一和第二电路装置的互连件，所述支撑件具有可操作以从所述基板限定大于所述至少一个第一和第二电路装置的厚度尺寸的尺寸的厚度尺寸 一秒电路装置。 一种方法，包括在衬底的第一侧上布置至少一个第一电路部件; 在所述基板的第二侧上布置至少一个第二电路部件; 以及将支撑件耦合到所述衬底，所述衬底限定来自所述衬底的尺寸大于所述至少一个第二电路部件的厚度尺寸。

公开(公告)号：US20150043188A1

公开(公告)日：2015-02-12

申请号：US14452640

申请日：2014-08-06

Applicant: SMR Patents S.A.R.L.

Inventor： Andreas Herrmann

IPC: H05K1/14 ,  H05K3/10 ,  B60R1/12

CPC classification number: H05K1/142 ,  B60R1/12 ,  H05K1/0286 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/105 ,  H05K2201/0187 ,  H05K2201/09027 ,  H05K2201/09118 ,  H05K2201/09963 ,  H05K2201/09972 ,  H05K2201/209 ,  H05K2203/107 ,  H05K2203/1453 ,  H05K2203/1461 ,  H05K2203/168 ,  Y10T29/49126

Abstract: The invention relates to a method for manufacturing a printed circuit board (10) having a substrate (2) and an electric circuit (8), in particular for a rear view device of a motor vehicle, the method comprising the following steps: manufacturing a plurality of substrate parts (2a, 2b); and selecting at least two of the substrate parts (2a, 2b), and connecting the selected substrate parts (2a, 2b) and providing the connected substrate parts (2a, 2b) with the circuit (8).

Abstract translation: 本发明涉及一种用于制造具有基板（2）和电路（8）的印刷电路板（10）的方法，特别是用于机动车辆的后视装置，该方法包括以下步骤： 多个基板部件（2a，2b）; 以及选择所述基板部分（2a，2b）中的至少两个，并且连接所选择的基板部分（2a，2b）并且将所连接的基板部分（2a，2b）提供给所述电路（8）。

公开(公告)号：US08342717B1

公开(公告)日：2013-01-01

申请号：US13200873

申请日：2011-10-03

Applicant: William R. Livesay ,  Scott M. Zimmerman ,  Richard L. Ross

Inventor： William R. Livesay ,  Scott M. Zimmerman ,  Richard L. Ross

IPC: F21V7/00

CPC classification number: H05K1/141 ,  F21K9/00 ,  F21Y2115/10 ,  H01L25/075 ,  H01L33/483 ,  H01L2924/0002 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0286 ,  H05K1/148 ,  H05K2201/047 ,  H05K2201/048 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2203/302 ,  H01L2924/00

Abstract: Direct attach or surface mount LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs. The direct attach or surface mount LEDs are mounted on the substrate. The substrate is then scribed on the backside to form cut channels which form the folds. The direct attach or surface mount LEDs are then attached onto the metal layer on the substrate. The substrate is then folded into a light recycling cavity where the direct attach or surface mount LEDs are facing the inside of the cavity.

Abstract translation: 直接连接或表面贴装LED安装在平坦的导热基板上，该基板被折叠以形成光循环腔。 首先将平面基板涂覆有金属层，其被图案化以电连接LED。 直接连接或表面贴装LED安装在基板上。 然后在背面刻划基材以形成形成折痕的切割通道。 然后将直接连接或表面贴装LED附着在基板上的金属层上。 然后将衬底折叠成光循环腔，其中直接附接或表面安装的LED面向空腔的内部。

公开(公告)号：US08159809B2

公开(公告)日：2012-04-17

申请号：US11952995

申请日：2007-12-07

Applicant: Thaddeus John Gabara

Inventor： Thaddeus John Gabara

IPC: H01G7/02

CPC classification number: H05K3/303 ,  B01L3/5027 ,  B01L3/502707 ,  B01L3/502715 ,  B01L9/527 ,  B01L2200/028 ,  B01L2200/04 ,  B01L2200/0647 ,  B01L2200/10 ,  B01L2300/0816 ,  B81B7/02 ,  B81C3/008 ,  H01L23/48 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/95145 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01Q9/0407 ,  H01Q9/14 ,  H01Q9/16 ,  H05K3/225 ,  H05K2201/09781 ,  H05K2201/09963 ,  H05K2203/105 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T279/23 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A reconfigurable system is described that can optimize the performance of the system. Substrates can be detached, levitated, moved, dropped and reattached as desired by the use of Coulomb forces generate between Coulomb islands. Thus, a system using a first set of substrates for a given frequency range can be exchanged with a second set of substrates operable at a different frequency range by the use of Coulomb forces. Making this exchange in an RF system can improve the selectivity and decrease the power dissipation of the system. One of the exchanges can involve inductor to shift the frequency of oscillation, for example. A control unit can be used to control the movement and replacement of all substrates. The formation of minimal energy potentials of Coulomb forces are determined to move a substrate over an underlying substrate.

Abstract translation: 描述了可以优化系统性能的可重构系统。 根据库仑力在库仑群岛之间产生的库仑力，底物可根据需要分离，悬浮，移动，掉落并重新附着。 因此，对于给定的频率范围，使用第一组基板的系统可以与通过使用库仑力在不同频率范围内操作的第二组基板交换。 在RF系统中进行这种交换可以提高系统的选择性并降低功耗。 例如，其中一个交换机可以涉及电感器来移动振荡频率。 控制单元可用于控制所有基板的移动和更换。 确定库仑力的最小能量势的形成以使衬底移动到下面的衬底上。

公开(公告)号：US07758349B2

公开(公告)日：2010-07-20

申请号：US12611015

申请日：2009-11-02

Applicant: In Suk Han ,  Dong-Kyun Lim ,  Iisun Park

Inventor： In Suk Han ,  Dong-Kyun Lim ,  Iisun Park

IPC: G09B19/00 ,  H01R11/00

CPC classification number: H01R11/30 ,  H01R13/6205 ,  H05K1/0286 ,  H05K1/09 ,  H05K1/141 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/09963 ,  H05K2201/10325

Abstract: Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.

Abstract translation: 印刷电路板和面包板装置具有接触焊盘和磁性部件连接器，其中接触焊盘和磁性部件连接器之间的连接由磁力制成。 接触焊盘或磁性部件连接器都将是磁性的，另一个将由将被吸收的磁体的材料制成。 例如，通常具有铜迹线的印刷电路板包括由吸收磁体的材料制成的接触垫。 电路部件连接到具有磁性腿的磁性部件连接器，然后将这些部件连接到电路板或面包板装置的接触垫上。 这使得组件与印刷电路板或面包板设备的连接快速简单，并且可以方便地拆卸和更换部件。 磁性部件连接器也可以被配置为彼此磁性地连接。

公开(公告)号：US20100156196A1

公开(公告)日：2010-06-24

申请号：US12552487

申请日：2009-09-02

Applicant: Daniel Boss ,  Scott Qualls ,  David McDonald ,  Terrance Z. Kaiserman ,  Keith J. Margolin ,  Michael Wassief ,  Liang Chai

Inventor： Daniel Boss ,  Scott Qualls ,  David McDonald ,  Terrance Z. Kaiserman ,  Keith J. Margolin ,  Michael Wassief ,  Liang Chai

IPC: B23K11/24 ,  H05K1/09 ,  H05K1/00 ,  H01R43/00 ,  H05K3/10

CPC classification number: H01H59/00 ,  H01B5/02 ,  H01B13/165 ,  H01H49/00 ,  H01R4/2404 ,  H01R25/147 ,  H05K3/103 ,  H05K2201/09672 ,  H05K2201/09963 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T307/74

Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.

Abstract translation: 提供了包括绝缘体和第一导体的导电元件，其可以固定到由导电结构元件组成的第二导体，其中绝缘体位于第一和第二导体之间以将它们电隔离。 电源可以连接在第一和第二导体之间以向其提供电力，并且电气设备可以跨越第一和第二导体连接。

公开(公告)号：US20100048038A1

公开(公告)日：2010-02-25

申请号：US12611015

申请日：2009-11-02

Applicant: In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

Inventor： In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

IPC: H01R11/30 ,  H05K7/00 ,  G09B19/00 ,  H01R13/24

CPC classification number: H01R11/30 ,  H01R13/6205 ,  H05K1/0286 ,  H05K1/09 ,  H05K1/141 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/09963 ,  H05K2201/10325

Abstract: Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.

Abstract translation: 印刷电路板和面包板装置具有接触焊盘和磁性部件连接器，其中接触焊盘和磁性部件连接器之间的连接由磁力制成。 接触焊盘或磁性部件连接器都将是磁性的，另一个将由将被吸收的磁体的材料制成。 例如，通常具有铜迹线的印刷电路板包括由吸收磁体的材料制成的接触垫。 电路部件连接到具有磁性腿的磁性部件连接器，然后将这些部件连接到电路板或面包板装置的接触垫上。 这使得组件与印刷电路板或面包板设备的连接快速简单，并且可以方便地拆卸和更换部件。 磁性部件连接器也可以被配置为彼此磁性地连接。

公开(公告)号：US20100033936A1

公开(公告)日：2010-02-11

申请号：US12228130

申请日：2008-08-11

Applicant: Jenny Jiayan Shen ,  Yong Su ,  Zhunming Du ,  Ying Shen

Inventor： Jenny Jiayan Shen ,  Yong Su ,  Zhunming Du ,  Ying Shen

IPC: H05K7/00 ,  H05K1/14

CPC classification number: H05K1/0287 ,  G01R31/2822 ,  H05K1/0237 ,  H05K1/142 ,  H05K3/0058 ,  H05K2201/09963 ,  H05K2203/162

Abstract: A method and apparatus for rapid and dynamic RF and Microwave circuit prototyping and integration provides a standard test fixture for testing any single device from any device vendors, provides a rapid dynamic tool for sub-system and system integration and prototyping, provides a flexibility to make any single function or multi-function assembled module quickly and economically. This prototyping approach can help RF/microwave companies share development times and costs. The combination of standard PCB function cells and dynamic standard mechanical cells helps build a prototype design quickly and reduce R&D costs.

Abstract translation: 用于快速和动态的RF和微波电路原型设计和集成的方法和设备提供了一种用于测试任何设备供应商的任何单个设备的标准测试夹具，为子系统和系统集成和原型设计提供了快速动态工具，提供了灵活性 任何单个功能或多功能组装模块快速，经济。 这种原型方法可以帮助RF /微波公司共享开发时间和成本。 标准PCB功能单元和动态标准机械单元的组合有助于快速构建原型设计，降低研发成本。