公开(公告)号：WO1996008841A1

公开(公告)日：1996-03-21

申请号：PCT/US1995011691

申请日：1995-09-15

Applicant: NATIONAL SEMICONDUCTOR CORPORATION

Inventor： NATIONAL SEMICONDUCTOR CORPORATION ,  CHILLARA, Satya ,  MOSTAFAZADEH, Shahram

IPC: H01L23/31

CPC classification number: H05K3/341 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit assembly (30) is disclosed herein. The assembly (30) includes a dielectric substrate (32) defining a predetermined array of electrically conductive traces (40) and an array of solder balls (42) electrically connected to the traces (40). An integrated circuit chip (44) having a series of input/output pads is supported on the substrate (32). In one embodiment, a plurality of leadframe leads (48) are supported by the substrate (32) in electrical isolation from and over the conductive traces (40). First and second series of bonding wires (56, 58) electrically connect certain ones of the input/output pads on the IC chip to the leadframe leads (48) and conductive traces (40). In other embodiments, one or more electrically isolated conductive layers are supported by the dielectric substrate (32) over the traces (40) and leadframe leads (48). The integrated circuit assembly (30), in accordance with any of these embodiments, provides a very high density electrical interconnection arrangement for the IC chip while retaining a small package footprint.

Abstract translation: 本文公开了集成电路组件（30）。 组件（30）包括限定导电迹线（40）的预定阵列的电介质基板（32）和电连接到迹线（40）的焊球阵列（42）。 具有一系列输入/输出焊盘的集成电路芯片（44）被支撑在基板（32）上。 在一个实施例中，多个引线框引线（48）由导电迹线（40）与导电迹线（40）电隔离地由衬底（32）支撑。 第一和第二系列接合线（56,58）将IC芯片上的某些输入/输出焊盘电连接到引线框引线（48）和导电迹线（40）。 在其它实施例中，一个或多个电绝缘导电层由电介质基板（32）支撑在迹线（40）和引线框引线（48）上。 根据这些实施例中的任何一个的集成电路组件（30）为IC芯片提供非常高密度的电互连布置，同时保持小的封装封装。

公开(公告)号：WO1992003901A1

公开(公告)日：1992-03-05

申请号：PCT/DE1991000648

申请日：1991-08-15

Applicant: HILLER, Peter

IPC: H05K01/18

CPC classification number: H05K1/184 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10659

Abstract: The invention concerns a circuit board with electrical components which are inserted, together with their insulating elements (3), in throughbores (10) in the circuit board (9). The components project out slightly beyond the upper and lower surfaces of the circuit board. The projecting ends have contact surfaces which are soldered to conductions tracks on the circuit board. The lower ends of the components have hemispherically domed or rounded conical tips with contact surfaces which fit into conductor tracks designed as soldering eyes (7) on the circuit board (9) and are soldered to these soldering eyes . The upper ends of the components have several contact surfaces (1.1, 1.2) which are insulated from each other and which are joined to contact elements (2.1, 2.2) projecting out away from the insulating elements (3), the contact elements (2.1, 2.2) being joined by solder (5) at intervals round the bores (10) to conductor tracks (6) on the upper surface of the circuit board.

公开(公告)号：WO1988009058A1

公开(公告)日：1988-11-17

申请号：PCT/DE1988000128

申请日：1988-03-09

Applicant: ROBERT BOSCH GMBH ,  HAUBNER, Georg ,  ZÖBL, Hartmut

Inventor： ROBERT BOSCH GMBH

IPC: H01L25/16

CPC classification number: H05K5/0082 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/10189 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10659 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The electronic components of an electrical switching and control apparatus (10) are arranged on a hybrid board (11) which is connected with plug contacts (14). To achieve a compact, extremely simple design in which the heat losses at the output components (13) of the hybrid circuit (11) are dissipated, the flat areas (14b) of the plug contacts (14) inside the housing of the device lie against the rear face of the hybrid board (11) to which the output components (13) are contiguously secured. The ends (14c) of the contact parts (14) are in direct contact with the connectors (12) of the hybrid board (11). An apparatus of this type is suitable for switching and control applications and is particularly advantageous when used in motor vehicles.

Abstract translation: 电气开关控制装置（10）的电子部件布置在与插头触点（14）连接的混合板（11）上。 为了实现在混合电路（11）的输出部件（13）处的热损失消散的紧凑的，非常简单的设计，设备壳体内的插头触头（14）的平坦区域（14b）位于 抵靠输出部件（13）连接到其上的混合板（11）的后表面。 接触部分（14）的端部（14c）与混合板（11）的连接器（12）直接接触。 这种类型的装置适用于切换和控制应用，并且在用于机动车辆时是特别有利的。

公开(公告)号：EP2849549B1

公开(公告)日：2016-06-22

申请号：EP14184427.4

申请日：2014-09-11

Applicant: Kolektor Micro-Motor d.o.o.

Inventor： Riehl, Christoph

IPC: H05K3/34 ,  H02M7/00 ,  H02K29/08 ,  H02K11/00 ,  H05K1/05 ,  H05K1/02 ,  H02J7/34

CPC classification number: H05K3/3447 ,  H02K11/33 ,  H02M7/003 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10015 ,  H05K2201/1009 ,  H05K2201/10469 ,  H05K2201/10659

公开(公告)号：EP2369683A1

公开(公告)日：2011-09-28

申请号：EP11158733.3

申请日：2011-03-17

Applicant: Tyco Electronics Corporation

Inventor： Morgan, Chad William ,  Helster, David Wayne ,  Woodford, Michael William

IPC: H01R12/52 ,  H01R12/58 ,  H01R12/72 ,  H01R13/6474

CPC classification number: H01R13/6474 ,  H01R12/52 ,  H01R12/585 ,  H01R12/722 ,  H01R12/724 ,  H01R13/514 ,  H01R13/6477 ,  H01R13/6587 ,  H05K1/0245 ,  H05K3/308 ,  H05K3/429 ,  H05K2201/094 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2203/0242 ,  Y10S439/941

Abstract: An electrical connector assembly comprises a circuit board (12) having vias (54) each extending at least partially through the circuit board (12) along parallel via axes (106). An electrical connector is mounted on the circuit board (12). The electrical connector comprises a plurality of variable depth signal terminals (26) configured to extend different depths into respective ones of the vias (54). The signal terminals (26) each have a terminal axis (134). The signal terminals (26) are arranged in pairs carrying differential pair signals, with the signal terminals (26) of each pair extending to the same depth in the respective vias (54). The terminal axes (134) of the signal terminals (26) of each pair are offset with respect to the corresponding via axes (106) along a majority of the depth of the signal terminals (26) within the vias (54).

Abstract translation: 电连接器组件包括具有通孔（54）的电路板（12），每个通孔（54）至少部分地沿着平行于轴线（106）延伸穿过电路板（12）。 电连接器安装在电路板（12）上。 电连接器包括多个可变深度信号端子（26），其被配置为将不同深度延伸到相应的通路（54）中。 信号端子（26）各自具有端子轴（134）。 信号端子（26）成对地布置成携带差分对信号，每对信号端子（26）在相应的通孔（54）中延伸到相同的深度。 每对信号端子（26）的端子轴（134）相对于通孔（54）内的信号端子（26）的深度的大部分相对于相应的通孔轴线（106）偏移。

公开(公告)号：EP1722611A2

公开(公告)日：2006-11-15

申请号：EP06007437.4

申请日：2006-04-07

Applicant: Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH

Inventor： Busse, Olaf ,  Heckmann, Markus ,  Lecheler, Reinhard ,  Lechner, Alfons ,  Mayer, Siegfried ,  Pollischansky, Thomas ,  Rudolph, Bernd ,  Schemmel, Bernhard ,  Schmidtmann, Kay, Dr. ,  Schmitt, Harald ,  Siegmund, Thomas, Dr. ,  Storm, Arwed ,  Werni, Horst

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01F27/027 ,  H01F27/085 ,  H01F27/22 ,  H01F2027/065 ,  H05K1/18 ,  H05K2201/10659

Abstract: Elektronisches Gerät mit einer elektrischen Spule, welche auf einem Bauteilereservoir (2) angeordnet ist, wobei das elektronische Gerät Mittel (4, 5; 7; 8; 9, 91, 92) aufweist, welche derart ausgebildet sind, dass eine von der elektrischen Spule erzeugte Wärme von der elektrischen Spule über das Bauteilereservoir ableitbar ist.

Abstract translation: 电子装置具有布置在部件储存器（2）上的电线圈和用于通过部件储存器传送由电线圈产生的热量的装置（4-9）。 该装置被设计成使得在操作时线圈的温度降低至少三摄氏度，特别是降低5至10摄氏度。

公开(公告)号：EP1641035A1

公开(公告)日：2006-03-29

申请号：EP04425716.0

申请日：2004-09-27

Applicant: STMicroelectronics S.r.l.

Inventor： Minotti, Agatino

IPC: H01L21/60

CPC classification number: H01L24/40 ,  H01L21/50 ,  H01L23/10 ,  H01L23/492 ,  H01L23/49827 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/10659 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/37099

Abstract: The present invention relates to a mounting method, on printed circuit boards, electronic components integrated on semiconductor dies wherein an insulating and protecting layer is provided between die and board with passage openings of electric contacts which allow the welding of contact pads of the die with ends of the printed circuit board.

Abstract translation: 本发明涉及一种安装方法，在印刷电路板上，集成在半导体绝缘和保护层的本worin电子元件在与基板之间设置有电接触，其允许与端部的管芯的接触焊盘的焊接的通道开口 的印刷电路板。

公开(公告)号：EP1478215A3

公开(公告)日：2006-02-08

申请号：EP04394023.8

申请日：2004-05-07

Applicant: Nortel Networks Limited

Inventor： Difilippo, Luigi ,  Wyrzykowska, Aneta ,  Kwong, Herman

IPC: H05K3/30 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method for implementing a circuit component (160) on a surface of a multilayer circuit board (110) is provided. The circuit component includes a plurality of pins (162,164,166,168,170,172,174,176) and the circuit board (110) includes a plurality of electrically conductive vias (142,148,150,152,156) penetrating at least one layer of the circuit board (110) and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board (110). The method comprises the step of forming at least one pin (162,168A,170A,172,176A) of the plurality of pins (162,164,166,168,170,172,174,176) of the circuit component (160) to have a length compatible with a depth of a corresponding via (142,148,150,152,156) of the circuit board (110).

Abstract translation: 提供一种在多层电路板（110）的表面上实现电路部件（160）的方法。 电路部件包括多个引脚（162,164,166,168,170,172,174,176），并且电路板（110）包括穿透电路板（110）的至少一个层的多个导电通孔（142,148,150,152,156），并布置成形成至少一个 通道，用于在电路板（110）的一个或多个信号层处布线一个或多个迹线。 该方法包括形成电路部件（160）的多个引脚（162,164,166,168,170,172,174,176）的至少一个引脚（162,168A，170A，172,176A）以使其长度与对应的通孔（142,148,150,152,156）的深度相兼容的步骤， 的电路板（110）。

公开(公告)号：EP1487060A2

公开(公告)日：2004-12-15

申请号：EP04394034.5

申请日：2004-06-11

Applicant: Nortel Networks Limited

Inventor： Kwong, Herman ,  Difilippo, Luigi ,  Wyrzykowska, Aneta

IPC: H01R12/06

CPC classification number: H01R12/523 ,  H01R12/57 ,  H01R13/642 ,  H01R13/665 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/368 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/10659 ,  H05K2203/061 ,  Y10T409/300112 ,  Y10T409/300616

Abstract: A circuit device for interconnecting first and second multilayer circuit boards is described herein. The first multilayer circuit board may include a first plurality of electrically conductive vias of varying depths and the second multilayer circuit board may include a second plurality of electrically conductive vias. The circuit device comprises a first plurality of pins located on a first side of the circuit device corresponding to the first plurality of electrically conductive vias of the first multilayer circuit board, each pin having a length compatible with a depth of a respective one of the first plurality of electrically conductive vias of the first multilayer circuit board. The circuit device further comprises a second plurality of pins located on a second side of the circuit device corresponding to the second plurality of electrically conductive vias of the second multilayer circuit board.

Abstract translation: 本文描述了用于互连第一和第二多层电路板的电路装置。 第一多层电路板可以包括具有不同深度的第一多个导电通孔，并且第二多层电路板可以包括第二多个导电通孔。 所述电路装置包括位于所述电路装置的与所述第一多层电路板的所述第一多个导电通孔相对应的第一侧​​上的第一多个销，每个销的长度与所述第一多层电路板的相应一个的深度相兼容 多个第一多层电路板的导电通孔。 电路装置还包括位于电路装置的第二侧上的第二多个针，其对应于第二多层电路板的第二多个导电通路。

公开(公告)号：EP1430543A2

公开(公告)日：2004-06-23

申请号：EP02752850.4

申请日：2002-08-19

Applicant: Shih, Kelvin

Inventor： Shih, Kelvin

IPC: H01L33/00 ,  H05K3/30

CPC classification number: H01L33/647 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10659 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A light emitting diode (LED) has an integrated heat sink structure for removing heat from an LED junction and for dissipating heat from the junction to the ambient air. The anode and the cathode both either act as or are coupled to a thermally conductive material which acts as the heat sink. In one embodiment, the heat sink forms a mounting configuration that allows air to circulate around multiple surfaces to maximize heat dissipation. As a result, the LED junction temperature remains low, allowing the LED to be driven with higher currents and generate a higher light output without adverse temperature-related effects.