公开(公告)号：EP2414725A1

公开(公告)日：2012-02-08

申请号：EP10715747.1

申请日：2010-03-26

Applicant: Siemens AG

Inventor： GERHARD, Detlef

IPC: F21K99/00 ,  F21Y101/02

CPC classification number: H05K1/183 ,  F21K9/00 ,  H01L24/32 ,  H01L25/0756 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48464 ,  H05K1/181 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/1053 ,  Y02P70/611 ,  H01L2924/00014

Abstract: The invention relates to an LED light source on which a plurality of LED chips (11) is fixed and is electrically connected in series via e.g. soldered joints (25, 18). The invention also relates to LED chips (11) which are suitable to be mounted on the respective substrate (19). The contacting of adjacent LED chips (11) is ensured by their overlap in a region (15), thereby eliminating the need for providing interspaced between the adjacent LED chips for the purpose of their electrical connection as is the case for conventional LED chips. The advantage of the overlapping arrangement is that a high packing density of LED chips can be achieved, thereby making it possible for the LED light source to emit a comparatively homogeneous light field having a comparatively high intensity.

公开(公告)号：EP2392200A1

公开(公告)日：2011-12-07

申请号：EP10704613.8

申请日：2010-02-01

Applicant: Tyco Electronics Corporation

Inventor： SMEJTEK, Dalibor, J.

IPC: H05K3/36

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10484

Abstract: A printed circuit assembly (10) includes a base printed circuit (12) having a printed circuit receiving area (29) and a plurality of electrical contacts provided on the printed circuit receiving area (30). The printed circuit assembly also includes a secondary printed circuit (14) having a secondary substrate (54) including a mating edge (46) and a plurality of secondary contacts (70) provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.

公开(公告)号：EP2280594A1

公开(公告)日：2011-02-02

申请号：EP08874395.0

申请日：2008-12-22

Applicant: Ibiden Co., Ltd.

Inventor： TAKAHASHI, Michimasa

IPC: H05K3/46

CPC classification number: H05K1/0298 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/10484 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board has a first substrate (10) with multiple wiring layers, and a second substrate (20) with wiring layers whose conductor density is set higher than that of the first substrate (10). The first substrate (10) and the second substrate (20) are electrically connected through each wiring layer, and the second substrate (20) is embedded in an accommodation section (100a).

Abstract translation: 印刷线路板具有具有多个布线层的第一基板（10）和具有导体密度被设定为高于第一基板（10）的布线层的第二基板（20）。 第一基板（10）和第二基板（20）通过各布线层电连接，并且第二基板（20）嵌入容纳部（100a）中。

公开(公告)号：EP1943888B1

公开(公告)日：2009-07-29

申请号：EP06809589.2

申请日：2006-10-13

Applicant: Koninklijke Philips Electronics N.V.

Inventor： DONNERS, Maurice, A., H.

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.

公开(公告)号：EP1864743B1

公开(公告)日：2009-04-08

申请号：EP07301051.4

申请日：2007-05-21

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： Kopp, Christophe ,  Baleras, François ,  Martinez, Christophe

IPC: B23K1/00 ,  G02B6/42 ,  H01L21/60 ,  H01S5/022

CPC classification number: G02B6/423 ,  B23K1/0016 ,  H01L23/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16105 ,  H01L2224/1703 ,  H01L2224/81192 ,  H01L2224/81194 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15151 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/10454 ,  H05K2201/10484 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP1968365A1

公开(公告)日：2008-09-10

申请号：EP07004735.2

申请日：2007-03-08

Applicant: Delphi Technologies, Inc.

Inventor： Groben, Manfred ,  Leng, Peter

IPC: H05K3/30

CPC classification number: H05K3/143 ,  H05K1/0284 ,  H05K3/202 ,  H05K3/301 ,  H05K2201/049 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10484

Abstract: Bei einer Leiterplatte zur Bestückung mit einem dreidimensional ausgeformten Stanzgitter (6), das mehrere teilweise mit Kunststoff (7) umspritzte Strompfade (5) umfasst, und mindestens einem elektrischen oder elektronischen Bauteil (2) ist das Stanzgitter (6) winkelförmig ausgebildet. Hierbei kontaktieren freie Stirnseiten der sich über die Schenkel (4, 9) erstreckenden Strompfade (5) des Stanzgitters (6) die Leiterplatte (1) und zwischen den Strompfaden (5) ist das Bauteil (2) in einer definierten Ausrichtung angeordnet.

Abstract translation: 板（1）具有三维形状的冲压网格（6），其包括由塑料部分地封装的多个电流路径（5）和电或电子部件。 冲压网格是角度结构的，其中穿过网格的网格的电流路径的自由端面与印刷电路板和部件接触，以限定的方向布置在电流路径之间。

公开(公告)号：EP0575806B1

公开(公告)日：1997-03-05

申请号：EP93109124.3

申请日：1993-06-07

Applicant: International Business Machines Corporation

Inventor： Cipolla, Thomas Mario ,  Coteus, Paul William ,  Damianakis, Ioannis ,  Johnson, Glen Walden ,  Matthew, Linda Carolyn ,  Mok, Lawrence Shungwei ,  Ledermann, Peter Gerard

IPC: H01L25/065

CPC classification number: H05K3/363 ,  H01L24/01 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06596 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/366 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10484 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2201/10984 ,  H01L2924/00

公开(公告)号：EP0531724A1

公开(公告)日：1993-03-17

申请号：EP92113576.0

申请日：1992-08-10

Applicant: International Business Machines Corporation

Inventor： Coteus, Paul William ,  Moskowitz, Paul Andrew ,  Murphy, Philip ,  Ritter Mark B. ,  Walker, George Frederick

IPC: H01L25/065

CPC classification number: H05K3/366 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H05K3/325 ,  H05K3/3442 ,  H05K2201/0314 ,  H05K2201/10484 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/2075

Abstract: An electronic device packaging structure is described wherein an electronic device (40) is electrically connected to a substrate (44) wherein the electronic device subtends a non-normal angle with respect to the substrate. In a more specific embodiment, a plurality of electronic devices (40) are stacked at offset with respect to each other to expose contact locations on the surface of each electronic device at an edge of each electronic device to form a stepped surface exposing a plurality of electronic device contact locations. This surface is disposed against a substrate having a plurality of contact locations (46) thereon. The electronic device contact locations can be electrically interconnected to the substrate contact locations by solder mounds (48) or alternatively by a cylindrical shaped elastomeric body having metallization bands with a spacing corresponding to the electronic device contact locations. The elastomeric body is pressed between the edge of the stacked electronic devices having the contact locations thereon and substrate surface to form electrical interconnections between electronic device contact locations and substrate contact locations through the electrically conducting bands. The stacked electronic devices can be thermally connected to a heat dissipation means. The stacked electronic devices can have a stepped surface (34) embodying an enhanced area for transfer of heat from the electronic device stack to the heat dissipation means (50).

Abstract translation: 描述了一种电子器件封装结构，其中电子器件（40）电连接到衬底（44），其中电子器件相对于衬底对着非法线角度。 在更具体的实施例中，多个电子设备（40）相对于彼此偏移堆叠，以暴露每个电子设备的边缘处的每个电子设备的表面上的接触位置，以形成暴露多个 电子设备联系位置。 该表面设置在其上具有多个接触位置（46​​）的基板上。 电子器件接触位置可以通过焊料堆（48）或替代地通过具有对应于电子器件接触位置的间隔的金属化带的圆柱形弹性体电连接到衬底接触位置。 弹性体被压在其上具有接触位置的层叠电子器件的边缘和衬底表面之间，以在电子器件接触位置和通过导电带的衬底接触位置之间形成电互连。 堆叠的电子设备可以热连接到散热装置。 层叠的电子设备可以具有体现用于将热量从电子设备堆叠传递到散热装置（50）的增强区域的台阶表面（34）。

公开(公告)号：EP0413639A1

公开(公告)日：1991-02-20

申请号：EP90402304.1

申请日：1990-08-16

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： Marion, François ,  Ravetto, Michel ,  Tissot, Jean-Luc

IPC: G02B7/00 ,  G02B7/182

CPC classification number: H01L24/81 ,  G02B7/00 ,  G02B7/182 ,  H01L2224/81801 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/094 ,  H05K2201/10484 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T403/479

Abstract: Les pièces (2, 4) sont munies de plots (6, 8, 10, 12) destinés à être reliés au moyen d'éléments de soudure faits d'un matériau métallique à bas point de fusion, soudable aux plots, la surface de chaque plot étant mouillable par le matériau à l'état fondu alors que son environnement ne l'est pas. Les plots de l'une des pièces sont recouverts de galettes (10, 12) du matériau, de même épaisseur mais de volumes différents ; les plots de l'autre pièce sont placés sur les galettes correspondantes les galettes sont portées à l'état fondu, leur épaisseur, leurs volumes, leur écartement et les surfaces des plots étant choisis pour que les pièces fassent alors entre elles un angle déterminé.
Application à la fabrication de miroirs.

Abstract translation: 部件（2,4）配备有螺柱（6，8，10，12），用于通过由具有低熔点，并且能够被焊接到柱的金属材料制成焊料元件的方式连接， 每个支柱是由在而其环境中的熔融状态的材料的可湿性的表面是没有的。 的部件中的一个的螺柱覆盖有盘（10，12）的材料的，如厚度，但不同体积的的; 另一部分的螺栓被放置在对应的盘，盘被带到熔融状态，并且它们的厚度，它们的体积，其间距和螺栓的表面被选择，以便DASS模具部分然后将它们以预定间形成 角。 ... 应用到反射镜的制造。 ... ...

公开(公告)号：KR20070099441A

公开(公告)日：2007-10-09

申请号：KR20070031303

申请日：2007-03-30

Applicant: NICHIA CORP

Inventor： SUMITANI NAOFUMI

IPC: G03G15/04 ,  H01L33/62 ,  G03G15/00 ,  H01L23/50 ,  H01L33/48 ,  H04N1/028 ,  H04N1/04

CPC classification number: H05K1/18 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H04N1/0083 ,  H04N1/02815 ,  H04N1/0282 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A light emitting unit and an illumination apparatus are provided to acquire a minimized space requested for an operation by extending an end point of at least lead terminal along an inclined direction, thereby limiting dead space and reducing a size and weight of a product. A light emitting unit comprises the followings: a light emitting element(15a,15b,15c); multiple lead frames(11,12a,12b,12c) to which the light emitting element is electrically connected; and a package(13), in which the lead frame is projected in an end point, having a light emitting window for outputting light from the light emitting element. The end point of the lead frame is inclined from the light emitting window. The other part of the lead frame is projected. A surface size of the other part of the lead frame is bigger than that of the end point of the lead frame.

Abstract translation: 提供一种发光单元和照明装置，用于通过沿着倾斜方向延伸至少引线端子的端点来获得操作所需的最小化空间，从而限制死区并减小产品的尺寸和重量。 发光单元包括：发光元件（15a，15b，15c）; 发光元件电连接到的多个引线框架（11,12a，12b，12c） 以及其中引线框架突出在端点的封装（13），具有用于输出来自发光元件的光的发光窗口。 引线框架的端点从发光窗倾斜。 引线框架的另一部分投影。 引线框架的另一部分的表面尺寸大于引线框架端点的表面尺寸。