中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

148 records (took 0.025 seconds)

    뒤틀림이 개선된 기판 및 기판형성방법
    112.
    发明授权
    뒤틀림이 개선된 기판 및 기판형성방법 失效
    뒤틀림이개선된기판및기판형성방법

    公开(公告)号：KR100687557B1

    公开(公告)日：2007-02-27

    申请号：KR1020050118751

    申请日：2005-12-07

    Applicant: 삼성전기주식회사

    Inventor： 윤일성 ,  김한 ,  조승현 ,  이재준 ,  구자부

    IPC: H01L23/12 ,  H01L23/15

    Abstract: A substrate with improved warpage and its fabricating method are provided to easily improve the warpage by sacking reinforcing members contained in a core layer at different stack angle. A substrate includes an insulation core layer(110) contained in a center portion of the substrate, in which at least two reinforcing members contained in the core layer are disposed at different stack angle. At least one prepreg layer(130) is provided to insulate the conductive layers. The reinforcing member contained in the core layer and a reinforcing member contained in the prepreg layer are disposed at an different stack angle. The reinforcing member contained in the core layer is at least one selected from a group consisting of glass fiber, glass web, aramid, and paper.

    Abstract translation: 提供具有改进的翘曲的衬底及其制造方法，以通过以不同的堆叠角度对包含在芯层中的增强构件进行装袋来容易地改善翘曲。 基板包括包含在基板的中心部分中的绝缘核心层（110），其中包含在核心层中的至少两个加强构件以不同的堆叠角度设置。 提供至少一个半固化片层（130）以绝缘导电层。 包含在芯层中的加强部件和包含在预浸层中的加强部件以不同的堆叠角度设置。 包含在芯层中的加强件是选自玻璃纤维，玻璃纤维网，芳族聚酰胺和纸中的至少一种。

    임베디드 인쇄회로기판 제작방법
    113.
    发明授权
    임베디드 인쇄회로기판 제작방법 失效
    印刷电路板制作方法

    公开(公告)号：KR100673860B1

    公开(公告)日：2007-01-25

    申请号：KR1020050110166

    申请日：2005-11-17

    Applicant: 삼성전기주식회사

    Inventor： 조석현 ,  류창섭 ,  조한서 ,  김한

    IPC: H05K1/16

    CPC classification number: H05K1/162 ,  H01F17/0033 ,  H01F41/046 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/0355 ,  H05K2201/086 ,  H05K2201/09509 ,  H05K2201/09881 ,  H05K2203/0361

    Abstract: A method for fabricating an embedded printed circuit board is provided to implement a capacitor and a resistor at the same time and an inductor by using a capacitor manufacturing method. A method for fabricating an embedded printed circuit board includes the steps of: sequentially stacking a first conductive layer(13) and a second conductive layer(15) on a base(11); after forming a hole in the second conductive layer(15), filling the hole with a dielectric material(27); after stacking a third conductive layer(17) on the second conductive layer(15), forming a top electrode(18) placed on a top of the dielectric material(27) and a pad(19) to be electrically connected to the first conductive layer(13) by removing a portion of the third conductive layer(17); and after an insulating layer(21) is stacked on the third conductive layer(17), forming a via hole(23) and an external layer circuit(25) electrically connected to the top electrode(18) and the pad(19), respectively.

    Abstract translation: 提供一种制造嵌入式印刷电路板的方法，以通过使用电容器制造方法同时实现电容器和电阻器以及电感器。 一种用于制造嵌入式印刷电路板的方法包括以下步骤：在基底（11）上顺序堆叠第一导电层（13）和第二导电层（15）; 在所述第二导电层（15）中形成孔之后，用电介质材料（27）填充所述孔; 在第二导电层（15）上堆叠第三导电层（17）之后，形成放置在电介质材料（27）顶部上的顶电极（18）和与第一导电层 通过去除第三导电层（17）的一部分来形成层（13）。 并且在第三导电层（17）上堆叠绝缘层（21）之后，形成与顶部电极（18）和焊盘（19）电连接的通孔（23）和外部层电路（25） 分别。

    경연성 인쇄회로기판 및 그 제조방법
    114.
    发明授权
    경연성 인쇄회로기판 및 그 제조방법 失效
    刚性柔性印刷电路板及其制造方法

    公开(公告)号：KR100632564B1

    公开(公告)日：2006-10-11

    申请号：KR1020050016031

    申请日：2005-02-25

    Applicant: 삼성전기주식회사

    Inventor： 류창명 ,  김한 ,  윤일성 ,  손범구

    IPC: H05K3/46

    Abstract: 본 발명은 경연성 인쇄회로기판의 플렉시블(flexible) 기판의 접지층을 두 개의 리지드(rigid) 기판에 모두 연결되도록 형성함으로써, 전기적 특성 및 기계적인 신뢰성을 확보하기 위한 경연성 인쇄회로기판 및 그 제조방법에 관한 것이다.
    경연성 인쇄회로기판, 리지드 플렉시블 인쇄회로기판, 리지드 기판, 플렉시블 기판, 접지, EMI, 굴곡 신뢰서, RF-PCB

Patent Agency Ranking