公开(公告)号：EP0797378A2

公开(公告)日：1997-09-24

申请号：EP96306670.9

申请日：1996-09-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Okano, Norio ,  Kobayashi, Kazuhito ,  Nakaso, Akishi

IPC: H05K1/03 ,  H05K3/46 ,  B32B15/08 ,  B32B27/20

CPC classification number: B32B15/14 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/0373 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0358

Abstract: A copper-clad laminate comprising an electrically insulating layer comprising a thermosetting resin and electrically insulating whiskers, and a copper foil formed on at least one side of the insulating layer, the insulating layer and copper foil being integrated by thermal press molding, and a multilayer copper-clad laminate having an interlayer circuit therein, which laminate comprises an interlayer circuit plate, a copper foil for an outer circuit, and an electrically insulating layer interposed therebetween, the circuit plate, copper foil and insulating layer being integrated by thermal press molding, and the insulating layer comprising electrically insulating whiskers dispersed in a thermosetting resin, are effective for producing multilayer printed circuit boards with a very reduced thickness and high wiring density.

公开(公告)号：EP0763562A2

公开(公告)日：1997-03-19

申请号：EP96306669.1

申请日：1996-09-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Okano, Norio ,  Kobayashi, Kazuhito ,  Nakaso, Akishi

IPC: C08K7/02 ,  C08J5/04 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08K7/02 ,  C08J5/24 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249995 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/269 ,  Y10T428/2949 ,  Y10T428/31529

Abstract: A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or electrically insulating short fibers dispersed in the semi-cured thermosetting resin and, if necessary, the prepreg being provided on a carrier film is suitable for producing multi-layer printed circuit boards of reduced thickness, high wiring density and high connection reliability with high productivity and low production cost.

Abstract translation: 包含半固化热固性树脂和分散在半固化热固性树脂中的电绝缘晶须或电绝缘短纤维以及必要时在载体膜上提供预浸料坯的预浸料坯适用于制造多层印刷电路板 厚度减少，布线密度高，连接可靠性高，生产率高，生产成本低。

公开(公告)号：EP0416518A2

公开(公告)日：1991-03-13

申请号：EP90116931.8

申请日：1990-09-04

Applicant: IDEMITSU KOSAN COMPANY LIMITED

Inventor： Nakano, Akikazu

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10T29/4916

Abstract: A process for producing a printed circuit board is disclosed, in which the following steps are sequentially conducted:

(1) a step for dispersing in at least one of the mediums of water and an organic solvent

(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure,
(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and
(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of said components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l,

(2) a sedimentation step of the dispersed solids in said slurry,
(3) a step for removing at least one of the mediums of water and an organic solvent in the slurry by filtration and drying and molding the residue,
(4) a step for melting with heating and pressure forming the molded product, and
(5) a step for providing a metal layer on the molded article.

The printed circuit board obtained by the process is excellent in impact resistance, heat resistance, mechanical strength and size stability as well as dielectric properties.

Abstract translation: 公开了一种制造印刷电路板的方法，其中依次进行以下步骤：（1）将水和有机溶剂（A）的至少一种介质分散在95〜20重量％的 具有间同立构结构的苯乙烯聚合物，（B）5-80重量％的纤维长度为1-50毫米的纤维填料，和（C）0.1-30重量份至少一种粘合剂和 与所述组分（A）和（B）的总量的100重量份成比例的粘合纤维，以制备浓度为0.5-100g / l的浆料，（2）分散固体的沉降步骤 所述浆料，（3）通过过滤并干燥和成型残渣来除去浆料中的至少一种水和有机溶剂的步骤，（4）通过加热和加压成型模制物进行熔融的步骤， 和（5）在模制品上提供金属层的步骤。 通过该方法获得的印刷电路板具有优异的耐冲击性，耐热性，机械强度和尺寸稳定性以及介电性能。

公开(公告)号：KR1020100053628A

公开(公告)日：2010-05-20

申请号：KR1020107005155

申请日：2008-08-19

Applicant: 쇼킹 테크놀로지스 인코포레이티드

Inventor： 코소우스키렉스 ,  플레밍로버트 ,  우준준

IPC: H01B3/10 ,  G06F19/00

CPC classification number: H01C7/1013 ,  B82Y10/00 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0218 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Embodiments described herein provide for a composition of voltage switchable dielectric (VSD) material that includes a concentration of modified high-aspect ratio (HAR) particles. In an embodiment, at least a portion of the concentration includes HAR particles are surface-modified to provide core-shell HAR particles. As an alternative or addition, a portion of the concentration includes HAR particles that are surface-modified to have activated surfaces.

Abstract translation: 本文所描述的实施例提供了包括经修改的高纵横比（HAR）颗粒的浓度的可变压电介质（VSD）材料的组成。 在一个实施方案中，浓度的至少一部分包括HAR颗粒被表面改性以提供核 - 壳HAR颗粒。 作为替代或添加，浓度的一部分包括被表面改性以具有活化表面的HAR颗粒。

公开(公告)号：KR1020090084835A

公开(公告)日：2009-08-05

申请号：KR1020097008762

申请日：2007-08-17

Applicant: 지멘스 에너지, 인코포레이티드

Inventor： 스티븐스,게리 ,  스미쓰,제임스,디.,비. ,  우드,존,더블유.

IPC: C08K7/00 ,  C08K3/28 ,  C08K3/22 ,  C08K3/38

CPC classification number: C09K5/14 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/249959 ,  Y10T428/252 ,  Y10T428/26 ,  Y10T428/2916

Abstract: A high thermal conductivity resin that has a host resin matrix, and a high thermal conductivity filler. The high thermal conductivity filler (30) forms a continuous organic-inorganic composite with the host resin matrix. The fillers are from 1-1000 nm in length, and have average aspect ratios of between 3-100. At least a portion of the high thermal conductivity fillers comprise morphologies (31) chosen from one or more of hexagonal, cubic, orthorhombic, rhombohedral, tetragonal, whiskers and tubes. In particular, some of the fillers will aggregate into secondary structures. ® KIPO & WIPO 2009

Abstract translation: 具有主体树脂基体和高导热性填料的高导热性树脂。 高导热性填料（30）与主体树脂基体形成连续的有机 - 无机复合材料。 填料的长度为1-1000nm，平均纵横比在3-100之间。 高导热性填料的至少一部分包含选自六方晶系，立方晶型，正交型，菱方晶型，四方晶系，晶须和管中的一种或多种的形态（31）。 特别地，一些填料将聚集成二级结构。 ®KIPO＆WIPO 2009

公开(公告)号：KR1020060115326A

公开(公告)日：2006-11-08

申请号：KR1020057023996

申请日：2004-10-06

Applicant: 가부시키가이샤 히타치 긴조쿠 네오마테리아루

Inventor： 키쿠에후미아키 ,  모리시타아키오 ,  야스오카마사토

IPC: H05K1/02

CPC classification number: H05K1/056 ,  H05K1/053 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: Disclosed is a substrate which comprises a metal plate and an insulating film which is formed on the surface of the metal plate and contains acicular alumina particles and granular particles. Such a substrate is excellent in insulating properties and can be produced at a commercially practical efficiency.

Abstract translation: 公开了一种基板，其包括金属板和形成在金属板的表面上并且包含针状氧化铝颗粒和颗粒的绝缘膜。 这种基材的绝缘性能优异，可以商业上实用的效率制造。

公开(公告)号：NO20081107A

公开(公告)日：2008-04-07

申请号：NO20081107

申请日：2008-03-04

Applicant: BASF SE

Inventor： LOCHTMAN RENE ,  WAGNER NORBERT ,  PFISTER JUERGEN ,  LIPPERT GERALD ,  MAAS HEIKO ,  SCHNEIDER NORBERT ,  SOBOTKA BETTINA

IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

公开(公告)号：US09941420B2

公开(公告)日：2018-04-10

申请号：US14402006

申请日：2013-05-08

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Hoang Tri Hai

IPC: H01L31/00 ,  H01L31/02 ,  C22C9/00 ,  H01B1/22 ,  H01L31/0224 ,  B22F1/00 ,  H05K1/09 ,  H01B1/02 ,  H05K3/12 ,  C22C1/04

CPC classification number: H01L31/02013 ,  B22F1/0011 ,  B22F1/0059 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/22 ,  H01L31/022425 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2203/1131 ,  Y02E10/50 ,  Y10T428/2982

Abstract: This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2.

公开(公告)号：US09530745B2

公开(公告)日：2016-12-27

申请号：US15142690

申请日：2016-04-29

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/488 ,  H01L23/498 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US09490232B2

公开(公告)日：2016-11-08

申请号：US14532032

申请日：2014-11-04

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L25/065 ,  H01L23/367 ,  H01L23/00 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/488 ,  H01L23/498 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Abstract translation: 电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。 接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。 接合部分包含杆状化合物，从而提高接合部分的强度。 当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。 在该状态下将接合材料冷却并固化。 通过这样做，形成极点状化合物。