公开(公告)号：US20090183364A1

公开(公告)日：2009-07-23

申请号：US12016261

申请日：2008-01-18

Applicant: Gerald K. Bartley ,  Darryl J. Becker ,  Paul E. Dahlen ,  Philip R. Germann ,  Andrew B. Maki ,  Mark O. Maxson

Inventor： Gerald K. Bartley ,  Darryl J. Becker ,  Paul E. Dahlen ,  Philip R. Germann ,  Andrew B. Maki ,  Mark O. Maxson

IPC: H05K3/30

CPC classification number: H05K1/147 ,  H01L2224/16227 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K1/141 ,  H05K2201/046 ,  H05K2201/10159 ,  H05K2201/10484 ,  H05K2201/10515 ,  Y10T29/4913

Abstract: A method of serially connecting devices utilizing flexible circuits in a semi-stacking configuration includes positioning a first flexible circuit on a carrier, the first flexible circuit includes a bottom surface and a top surface, a portion of the bottom surface is mounted to the carrier while another portion of the bottom surface is elevated at a first angle with respect to the carrier; coupling a first device on a portion of the top surface of the first flexible circuit, the first device being elevated at the first angle; positioning a second flexible circuit on the carrier, the second flexible circuit having an upper surface and a lower surface, a portion of the lower surface is mounted to the carrier while another portion of the lower surface is elevated at a second angle with respect to the carrier and overlapped over a top surface portion of the first device; and coupling a second device on a portion of the upper surface of the second flexible circuit, the second device being elevated at the second angle.

Abstract translation: 使用半堆叠配置中的柔性电路串联连接装置的方法包括将第一柔性电路定位在载体上，第一柔性电路包括底表面和顶表面，底表面的一部分安装到载体上， 底表面的另一部分相对于载体以第一角度升高; 将第一装置联接在第一柔性电路的顶表面的一部分上，第一装置以第一角度升高; 将第二柔性电路定位在所述载体上，所述第二柔性电路具有上表面和下表面，所述下表面的一部分安装到所述载体上，而所述下表面的另一部分相对于所述下表面以第二角度升高 载体并重叠在第一装置的顶表面部分上; 以及将所述第二装置联接在所述第二柔性电路的所述上表面的一部分上，所述第二装置以第二角度升高。

公开(公告)号：US5220488A

公开(公告)日：1993-06-15

申请号：US875561

申请日：1992-04-27

Applicant: Oscar L. Denes

Inventor： Oscar L. Denes

IPC: B29C70/78 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00

CPC classification number: B29C70/78 ,  H05K1/162 ,  H05K1/165 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/007 ,  H05K1/0284 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/086 ,  H05K2201/09018 ,  H05K2201/097 ,  H05K2201/09763 ,  H05K2201/09809 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/0156 ,  H05K2203/1327 ,  H05K3/4691 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916

Abstract: An electrical circuit package wherein a flexible support member having conductive materials and electronic components thereon is fused with a substrate which acts as a support for the film. This results in a unitary packaged circuit. In one embodiment the film is a decal on which certain portions have a substrate fused thereto. In other embodiments, various layers of conductive materials are applied and molded into the substrate to form a variety of electronic functions. The circuit package lends itself to high production and reliability as well as cost savings.

Abstract translation: 一种电路封装，其中在其上具有导电材料和电子部件的柔性支撑构件与用作薄膜支撑体的基底熔合。 这导致整体封装电路。 在一个实施例中，膜是其上某些部分具有与其融合的基底的贴花。 在其它实施例中，各种导电材料层被施加并模制到衬底中以形成各种电子功能。 电路封装本身具有高生产和可靠性以及成本节约。

公开(公告)号：US4958260A

公开(公告)日：1990-09-18

申请号：US311462

申请日：1989-02-15

Applicant: Kenzo Kobayashi ,  Hirokazu Shiroishi

Inventor： Kenzo Kobayashi ,  Hirokazu Shiroishi

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/189 ,  H05K1/0284 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2203/1327 ,  H05K3/0058

Abstract: A molded circuit board is constructed by forming a plurality of resin moldings integrally with a circuit film including an insulating film and circuit pattern on the insulating film, spaced specified distances therebetween, on one side of the circuit film. The plurality of moldings can be assembled into an electronic device box by bending the intermediate portion, between the moldings, of the circuit film.

公开(公告)号：EP3366091A1

公开(公告)日：2018-08-29

申请号：EP16787798.4

申请日：2016-10-24

Applicant: Universität des Saarlandes

Inventor： OLBERDING, Simon ,  STEIMLE, Jürgen

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H01G4/33 ,  G09F9/30 ,  G06F3/044 ,  H05K3/00 ,  G06T17/00 ,  H05K1/03 ,  H05K3/12

CPC classification number: H05K1/028 ,  G06F3/044 ,  G06F3/0488 ,  G06F2203/0339 ,  G06F2203/04102 ,  G06T19/00 ,  G06T2219/021 ,  G09F9/301 ,  H03K17/962 ,  H03K2217/960775 ,  H05K1/0326 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/162 ,  H05K3/0005 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10053 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: The invention is directed to an object (2) with a three-dimensional shape made of a folded sheet (4) so as to form at least one face (6), at least one corner (10) and/or at least one edge (8), the object comprising electrically conductive traces (14) printed on the sheet (4); and at least one functional area (12) printed on one of the at least one face (6), adjacent to one of the at least one edge (8), or adjacent to one of the at least one corner (10), the at least one functional area (12) being electrically connected to the conductive traces (14) and forming at least one control for a touch input, for a display output, and/or for sensing a change of shape of the object.

公开(公告)号：EP3275022A1

公开(公告)日：2018-01-31

申请号：EP16712011.2

申请日：2016-03-21

Applicant: LEDVANCE GmbH

Inventor： ROSENBAUER, Georg

IPC: H01L33/64 ,  B23K26/22 ,  B23K26/24 ,  H01L23/36 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0203 ,  B23K26/14 ,  B23K26/16 ,  B23K26/21 ,  B23K26/703 ,  B23K2101/42 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/028 ,  H05K1/05 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/22 ,  H05K3/303 ,  H05K2201/046 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2203/082 ,  H05K2203/107 ,  H05K2203/1581

Abstract: An optoelectronic assembly (10) is provided in different embodiments. The optoelectronic assembly (10) has the following; a printed circuit board (12); at least one optoelectronic first component (20) which is arranged on a first face (14) of the printed circuit board (12); a heat sink (24) which has a first surface (26) that is arranged on a second printed circuit board (12) face (16) facing away from the first component (20), wherein a boundary surface (34) extends between the second face (16) and the first surface (26); and at least one first welding connection (30), by means of which the heat sink (24) is directly connected to the printed circuit board (12) in a bonded manner and which together with the boundary surface (34) forms a first cut surface (36), the first component (20) at least partly overlapping the cut surface.

公开(公告)号：EP3010060A4

公开(公告)日：2017-03-22

申请号：EP14829789

申请日：2014-07-24

Applicant: LG DISPLAY CO LTD

Inventor： OH DUCKSU ,  PARK SUNG SOO ,  KANG MINSOO

IPC: H05K1/14 ,  H01L51/52 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：EP2843913A1

公开(公告)日：2015-03-04

申请号：EP14182647.9

申请日：2014-08-28

Applicant: Samsung Electronics Co., Ltd

Inventor： Park, Sung-Wu ,  Kim, Min-Suk ,  Park, Soon-Sang

IPC: H04M1/02 ,  H01Q1/24 ,  H05K1/18

CPC classification number: H04M1/0277 ,  H01Q1/085 ,  H01Q1/12 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/147 ,  H05K1/16 ,  H05K3/0064 ,  H05K2201/041 ,  H05K2201/046 ,  H05K2201/09063 ,  H05K2201/10098 ,  H05K2201/2009 ,  H05K2203/167

Abstract: According to one exemplary embodiment, a mounting structure 100 may include a flexible member 110, at least one reinforcement member 120-1, 120-2 attached to the flexible member, and preventing the deformation of at least one portion of the flexible member, and a mounting member 130 for mounting the flexible member attaching the at least one reinforcement member. Various other exemplary embodiments are possible.

Abstract translation: 根据一个示例性实施例，安装结构100可以包括柔性构件110，附接到柔性构件的至少一个加强构件120-1,120-2，并且防止柔性构件的至少一部分的变形，以及 安装构件130，用于安装附接至少一个加强构件的柔性构件。 各种其它示例性实施例是可能的。

公开(公告)号：EP2529409A1

公开(公告)日：2012-12-05

申请号：EP11704487.5

申请日：2011-01-31

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

Inventor： DE KOK, Margaretha Maria ,  VAN DEN BRAND, Jeroen ,  VAN HECK, Gerardus Titus

IPC: H01L31/042 ,  H05K1/02

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

公开(公告)号：EP2165579A1

公开(公告)日：2010-03-24

申请号：EP08734341.4

申请日：2008-03-01

Applicant: Conti Temic Microelectronic GmbH

Inventor： KATHEDER, Gerhard ,  RIESE, Dirk

IPC: H05K1/00 ,  H05K5/00

CPC classification number: H05K1/0278 ,  B60R16/0239 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/325 ,  H05K5/003 ,  H05K5/0039 ,  H05K2201/0191 ,  H05K2201/046 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/0228 ,  H05K2203/302

Abstract: The present invention relates to a circuit board (300) comprising a bendable electric plug connection for a flexible plug design. The invention further discloses a method for the production of the circuit board according to the invention with freely bendable plug connections. The invention further relates to a method for assembling the circuit board according to the invention with the housing or housing parts. According to the invention, the circuit board (300) comprises a region, known as a bendable region (320), provided with a bended edge (303) and being bendable along said bended edge relative to the main region of the circuit board. The contact pins (301) are pressed onto the bendable region in a perpendicular fashion. By bending said bendable region together with the contact pins perpendicularly disposed thereon, a plug connection disposed laterally or at any given angle transversely to the main plane of the circuit board can be produced. Such circuit boards can be integrated into a housing in a very simple and cost-effective manner.

公开(公告)号：EP0651598B1

公开(公告)日：1999-06-30

申请号：EP94203095.8

申请日：1994-10-25

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Frisch, Wilhelm ,  Kaiser, Werner, Dipl.-Ing. (TU) ,  Ott, Gerhard, Dipl.-Ing. (FH) ,  Kettschau, Hans-Jürgen, Dipl.-Ing. ,  Ludwig, Uwe, Dipl.-Ing. (FH) ,  Ziegler, Bernhard, Dipl.-Ing. (FH)

IPC: H05K1/14 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0278 ,  H05K1/05 ,  H05K1/141 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2203/1572 ,  H05K2203/302