公开(公告)号：WO2017049185A1

公开(公告)日：2017-03-23

申请号：PCT/US2016/052284

申请日：2016-09-16

Applicant: AHMAD, Syed, Taymur ,  ACTON, Bruce

Inventor： AHMAD, Syed, Taymur ,  ACTON, Bruce

IPC: H05K3/28 ,  B05D5/12

CPC classification number: H04B1/3888 ,  G06F1/1616 ,  G06F1/1626 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed, in one embodiment, the method comprises applying an electrically insulating polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed, such as smart phones, computers, and gaming devices.

Abstract translation: 在一个实施方案中，公开了通过将不同的聚合物材料施加到装置的不同重要组分来保护电子装置免受污染物的方法，所述方法包括将诸如丙烯酸类聚合物的电绝缘聚合物施加到一个或多个连接器上，以及 位于设备印刷电路板上的部件。 该方法还包括将能够携带电荷的聚合物（例如硅氧烷基聚合物）施加到印刷电路板上的不同连接器和部件上。 该方法导致不同的组分被不同的聚合物涂覆。 还公开了由这种聚合物，疏水涂层保护的电子器件，例如智能电话，计算机和游戏设备。

公开(公告)号：WO2015134588A1

公开(公告)日：2015-09-11

申请号：PCT/US2015/018704

申请日：2015-03-04

Applicant: MC10, INC.

Inventor： GARLOCK, Dave ,  GAUDETTE, Harry ,  FASTERT, Steven ,  STANDLEY, Adam ,  ELOLAMPI, Brian ,  HSU, Yung-Yu

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K5/0034 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/32 ,  H05K5/0056 ,  H05K5/006 ,  H05K5/065 ,  H05K2201/09063 ,  H05K2201/09872 ,  H05K2201/10151 ,  H05K2203/1311 ,  H05K2203/1316

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

Abstract translation: 封装的适形电子器件，封装的适形集成电路（IC）系统以及制造和使用封装的适形电子器件的方法在本文中呈现。 公开了一种保形IC装置，其包括柔性基板，连接到柔性基板的电子电路以及包含电子电路和柔性基板的柔性多部分封装壳体。 多部分壳体包括第一和第二封装壳体部件。 第一封装壳体部件具有用于将电子电路放置在其中的凹陷区域，而第二封装壳体部件具有用于将柔性基板置于其中的凹陷区域。 第一封装壳体部件任选地包括用于在其中安置柔性基板的凹陷区域。 壳体部件可以包括一个或多个穿过基板中的孔的突起，以接合另一壳体部件中的互补的凹陷，从而使密封壳体部件与柔性基板和电子电路对准和互锁。

公开(公告)号：WO2015086682A1

公开(公告)日：2015-06-18

申请号：PCT/EP2014/077233

申请日：2014-12-10

Applicant: EUROPLASMA NV

Inventor： LEGEIN, Filip ,  ROGGE, Eva ,  MARTENS, Peter

IPC: H05K3/28 ,  B05D1/00

CPC classification number: H05K3/285 ,  B05D1/62 ,  B05D5/08 ,  C09D183/04 ,  C09D183/16 ,  H05K3/282 ,  H05K2201/015 ,  H05K2201/09872 ,  H05K2203/095

Abstract: The present invention concerns a process for the deposition of a solder-through polymer coating on an uncoated printed circuit board which comprises the use of an average low power and low pressure plasma polymerisation in a polymerisation chamber of an organosilane precursor monomer which is introduced into said polymerisation chamber by means of a carrier gas, said organosilane being of the Formula Y1-X-Y2 (I) or -[Si(CH3)2-X-]n- (II), wherein : X is O or NH; Y1 is - Si(Y3)(Y4)Y5; Y2 is Si(Y3')(Y4')Y5'; Y3, Y4, Y5, Υ3', Υ4', and Y5' are each independently H or an alkyl group of up to 10 carbon atoms; the monomer of formula (II) is cyclic wherein n is 2 to 10, and wherein at most one of Y3, Y4 and Y5 is hydrogen, at most one of Υ3', Y4' and Y5' is hydrogen and the total number of carbon atoms is not more than 20.

Abstract translation: 本发明涉及一种用于在未涂覆的印刷电路板上沉积焊料穿透聚合物涂层的方法，其包括在有机硅烷前体单体的聚合室中使用平均低功率和低压等离子体聚合，所述聚合室被引入所述 所述有机硅烷为式Y1-X-Y2（I）或 - [Si（CH3）2-X-n-（Ⅱ）），其中：X为O或NH; Y1是-Si（Y3）（Y4）Y5; Y2是Si（Y3'）（Y4'）Y5'; Y 3，Y 4，Y 5，Y 3，Y 4，Y 5，Y 3'，Y 4'和Y 5'各自独立地为H或至多10个碳原子的烷基; 式（II）的单体是环状的，其中n是2至10，并且其中Y 3，Y 4和Y 5中的至多一个是氢，Y 3'，Y 4'和Y 5'中的至多一个是氢，并且碳的总数 原子不超过20。

公开(公告)号：WO2014137749A1

公开(公告)日：2014-09-12

申请号：PCT/US2014/019067

申请日：2014-02-27

Applicant: QUALCOM INCORPORATED

Inventor： CARTER, Mark Anthony ,  ZHANG, Yang ,  PENG Yongsheng ,  STEENSTRA, Jack Brian ,  BARRETT, Michael Gerard

IPC: H05K1/18 ,  H05K3/46 ,  H01L25/00 ,  H01L23/31 ,  H01L23/373 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K1/14

CPC classification number: H05K7/205 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/5389 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/284 ,  H05K3/30 ,  H05K3/4608 ,  H05K9/00 ,  H05K2201/068 ,  H05K2201/09872 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Method and apparatuses for making a smart phone on a chip (SPOC) are described. Active components (210) are embedded into a copper core (212). In an aspect, and optionally, passive components may also be embedded into the copper core. Printed circuit board (PCB) laminate (224, 225) is layered above and below the copper core. A copper ground plane (214) is fixed underneath the layer of PCB laminate (225) below, and furthest from, the copper core. One or more additional components (218, 220) are surface mounted on top of the PCB laminate layers (224) above the copper core. A conformal coating is applied to completely and thinly encase the one or more surface mounted additional components. The conformal coating includes trenching and a copper sputter coating finish.

Abstract translation: 描述用于制造芯片上的智能手机（SPOC）的方法和装置。 活性组分（210）嵌入铜芯（212）中。 在一方面，并​​且可选地，无源部件也可以嵌入到铜芯中。 印刷电路板（PCB）层压板（224,225）层叠在铜芯的上方和下方。 铜接地平面（214）固定在PCB层压板（225）的下方，最远离铜芯的下方。 一个或多个附加部件（218,220）被表面安装在铜芯上方的PCB层叠层（224）的顶部上。 施加保形涂层以完全和薄地包住一个或多个表面安装的附加部件。 保形涂层包括开沟和铜溅射涂层。

公开(公告)号：WO2014111311A1

公开(公告)日：2014-07-24

申请号：PCT/EP2014/050379

申请日：2014-01-10

Applicant: ALLNEX IP S.À.R.L.

Inventor： EKIN, Abdullah ,  DVORCHAK, Michael J.

IPC: C08G18/72 ,  C08G18/79 ,  C08G18/81 ,  C09D175/16 ,  C08G18/30 ,  H05K3/28

CPC classification number: C09D175/14 ,  B05D3/067 ,  C08G18/307 ,  C08G18/4277 ,  C08G18/672 ,  C08G18/725 ,  C08G18/7837 ,  C08G18/798 ,  C08G18/81 ,  C08G63/08 ,  C09D4/00 ,  C09D175/16 ,  H05K3/284 ,  H05K3/287 ,  H05K2201/09872

Abstract: Disclosed are one-component compositions that include: (1) an isocyanate-functional urethane acrylate and (2) a polyisocyanate containing allophanate and/or uretdione groups, wherein the one-component composition has a viscosity of less than or equal to about 800mPa.s and an isocyanate content of greater than about 5% by weight, based on the weight of the one-component composition. Also disclosed are circuit boards and electronic components that are coated with such compositions.

Abstract translation: 公开了单组分组合物，其包括：（1）异氰酸酯官能的氨基甲酸酯丙烯酸酯和（2）含有脲基甲酸酯和/或脲二酮基团的多异氰酸酯，其中所述单组分组合物具有小于或等于约800mPa的粘度。 并且基于单组分组合物的重量，异氰酸酯含量大于约5重量％。 还公开了涂覆有这种组合物的电路板和电子部件。

公开(公告)号：WO2013066751A1

公开(公告)日：2013-05-10

申请号：PCT/US2012/062139

申请日：2012-10-26

Applicant: APPLE INC. ,  MERZ, Nicholas, G. ,  WANG, Hong ,  NIKKHOO, Michael, M. ,  PYPER, Dennis, R. ,  WERNER, Christopher, Matthew

Inventor： MERZ, Nicholas, G. ,  WANG, Hong ,  NIKKHOO, Michael, M. ,  PYPER, Dennis, R. ,  WERNER, Christopher, Matthew

IPC: H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。

公开(公告)号：WO2012066273A1

公开(公告)日：2012-05-24

申请号：PCT/GB2011/001579

申请日：2011-11-09

Applicant: SEMBLANT GLOBAL LIMITED ,  VON WERNE, Timothy

Inventor： VON WERNE, Timothy

IPC: H05K3/28

CPC classification number: H05K3/282 ,  H05K1/032 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2201/09872 ,  H05K2203/095

Abstract: A method for reducing creep corrosion on a printed circuit board, the printed circuit board comprising a substrate, a plurality of electrically conductive tracks located on at least one surface of the substrate, a solder mask coating at least a first area of the plurality of electrically conductive tracks and a surface finish coating at least a second area of the plurality of electrically conductive tracks, the method comprising depositing by plasma-polymerization a fluorohydrocarbon onto at least part of the solder mask and at least part of the surface finish.

Abstract translation: 一种用于减少印刷电路板上的蠕变腐蚀的方法，所述印刷电路板包括基板，位于所述基板的至少一个表面上的多个导电轨道，焊接掩模涂覆所述多个电气的至少第一区域 导电轨道和表面光洁度涂层，所述方法包括通过将氟代烃等离子体聚合到至少部分焊料掩模和至少部分表面光洁度上进行沉积。

公开(公告)号：WO2011018709A8

公开(公告)日：2012-04-12

申请号：PCT/IB2010002197

申请日：2010-08-12

Applicant: MEDOS INT SARL ,  HOGG ANDREAS ,  KEPPNER HERBERT ,  BURGER JUERGEN ,  AELLEN THIERRY

Inventor： HOGG ANDREAS ,  KEPPNER HERBERT ,  BURGER JUERGEN ,  AELLEN THIERRY

IPC: A61N1/375 ,  A61B5/00 ,  H05K5/00

CPC classification number: A61N1/375 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/09872 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapour deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.

Abstract translation: 一种可植入医疗装置，其包括在基底上的多个部件，以及通过气相沉积施加的生物相容性多层涂层以符合和密封地覆盖部件和/或基底的至少一部分。 涂层涂覆至少两组，每组具有第一层，第二层和第三层。 第一层，第二层和第三层中的至少一层基本上由聚合物如聚对二甲苯组成，并且该组的另外两层中的至少一层基本上由无机材料组成，使得每个层的至少一个扩散阻挡性质与 该组中的其它层并且增加了涂层的整体屏障效应。

公开(公告)号：WO2011089009A1

公开(公告)日：2011-07-28

申请号：PCT/EP2011/000242

申请日：2011-01-21

Applicant: EUROPLASMA NV ,  LEGEIN, Filip ,  VANLANDEGHEM, Anthony ,  MARTENS, Peter

Inventor： LEGEIN, Filip ,  VANLANDEGHEM, Anthony ,  MARTENS, Peter

IPC: B05D7/24 ,  H05K3/28 ,  H01J37/32 ,  H01L23/29

CPC classification number: H05K3/284 ,  B05D1/62 ,  B05D3/0493 ,  B05D3/142 ,  B05D5/083 ,  B05D2506/10 ,  H01J37/32541 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K3/282 ,  H05K2201/015 ,  H05K2201/09872 ,  H05K2203/095 ,  Y10T428/239 ,  H01L2924/00

Abstract: The invention relates to a conformal nanocoating applied by a low pressure plasma process. The invention also relates to a method for making such a conformal nanocoating on a three-dimensional nanostructure, in particular a three- dimensional structure containing electrically conductive and non-conductive elements.

Abstract translation: 本发明涉及通过低压等离子体工艺应用的共形纳米涂层。 本发明还涉及在三维纳米结构上制造这种共形纳米涂层的方法，特别是包含导电和非导电元件的三维结构。

公开(公告)号：WO2009151492A2

公开(公告)日：2009-12-17

申请号：PCT/US2009001410

申请日：2009-03-05

Applicant: NORTHEAST MARITIME INST INC ,  MARTIN SIDNEY EDWARD ,  DAWICKI ERIC ROGER ,  DAWICKI ANGELA MICHELE

Inventor： MARTIN SIDNEY EDWARD ,  DAWICKI ERIC ROGER ,  DAWICKI ANGELA MICHELE

IPC: B05D7/24 ,  C08K3/22 ,  C08K3/28 ,  C08L65/04 ,  C09D5/00 ,  C23C16/455 ,  H01L51/52 ,  H05K3/28

CPC classification number: H05K3/284 ,  B05D1/60 ,  B05D3/142 ,  B05D2601/20 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08L65/04 ,  C09D5/1662 ,  C09D7/61 ,  C09D7/69 ,  C09D165/04 ,  H05K1/0203 ,  H05K1/021 ,  H05K3/285 ,  H05K2201/0179 ,  H05K2201/0209 ,  H05K2201/09872

Abstract: The present disclosure relates, in part, to Parylene based conformal coating compositions having improved properties, e.g., improved heat transfer and durability characteristics, as well as a methods and apparatus to coat objects with these compositions, and objects coated with these compositions. In some aspects, coating compositions comprising Parylene and boron nitride are disclosed. The disclosure also includes objects (e.g., electronic equipment, textiles, etc.) having a conformal coating comprising a Parylene compound and boron nitride.

Abstract translation: 本公开部分涉及具有改进的性能例如改进的热传递和耐久性特征的聚对二甲苯基保形涂料组合物，以及用这些组合物涂覆物体的方法和装置以及涂覆有这些组合物的物体。 在一些方面，公开了包含聚对二甲苯和氮化硼的涂料组合物。 本公开还包括具有包括Parylene化合物和氮化硼的保形涂层的物体（例如，电子设备，纺织品等）。