公开(公告)号：EP0245677B1

公开(公告)日：1992-07-29

申请号：EP87105988.7

申请日：1987-04-24

Applicant: International Business Machines Corporation

Inventor： Seaman, Ronald Joseph ,  Vanderlee, Keith Allan

IPC: H05K3/34

CPC classification number: H05K3/3447 ,  H05K3/3421 ,  H05K3/3478 ,  H05K2201/0305 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/0405 ,  Y02P70/613

公开(公告)号：EP0337686A3

公开(公告)日：1991-05-22

申请号：EP89303483.5

申请日：1989-04-10

Applicant: HITACHI, LTD.

Inventor： Ogihara, Satoru ,  Numata, Shunichi ,  Miyazaki, Kunio ,  Yokoyama, Takashi ,  Takahashi, Ken ,  Soga, Tasao ,  Yamada, Kazuji ,  Shinohara, Hiroichi ,  Suzuki, Hideo

IPC: H01L23/52 ,  H01L23/50 ,  H01L23/64

CPC classification number: H01L23/642 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10318 ,  H05K2201/10704

Abstract: A semiconductor chip module has semiconductor chips (12) each having contacts on its entire front face, and a multi-layered organic circuit board (15) having a small dielectric constant intermediate ceramic substrates (11) having the same thermal expansion coefficient as that of the semiconductor chip (12), each having contacts on its front and back faces corresponding to those of the semiconductor chip (12) and being electrically connected directly in a one to one relationship. The contacts on the semiconductor chip (12) and the corresponding contacts on the substrates (11) are connected by a solder, the contacts on the other of the substrate (11) and the corresponding contacts on the multi-layered ceramic circuit board (15) are connected by respective conductive pins (14) having a predetermined flexibility and rigidity through a predetermined gap therebetween. In this way there is the possibility of the relative displacement due to theremal expansion difference between the intermediate ceramic substrate (11) and the multi-layered organic circuit board (15).

公开(公告)号：EP0232837A2

公开(公告)日：1987-08-19

申请号：EP87101455.1

申请日：1987-02-03

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： Hirata, Atsuomi ,  Mamiya, Hirokuni

IPC: H01L23/48 ,  H01L23/31

CPC classification number: H05K3/306 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/181 ,  H05K2201/10568 ,  H05K2201/10704 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A novel plastic molded chip carrier package for an integrated circuit chip has a carrier member 10 molded of a plastic material to which are integrally embeded a plurality of I/O pins 20 and a conductor member 30 for interconnection between the terminals of the chip 5 and the corresponding I/O pins 20 to provide a unitary construction obtained at a single molding process. This plastic molded chip carrier package is preferred to have integral positioning studs 12 which project in the same direction of the I/O pins 20 for abutment against a printed circuit board 1 for mounting the package in a spaced relation thereto with the I/O pins 20 plugged into metallized through holes 2 provided in the board 1. A method of fabricating the plastic chip carrier package is also disclosed to comprise the steps of placing a plurality of I/O pins 20 into corresponding vertical slots 52 formed in a molding die 51 with the top portion of the I/O pins 20 projecting above the molding die surface; supporting a conductor member 30 on the I/O pins 20 with the distal top ends of the I/O pins 20 extending into correspondingly through holes 33 formed in the conductor member 30, the conductor member 30 including a plurality of conductor lines 31 for electrical interconnection between the individual I/O pins 20 and the terminals of the chip 5 ; and filling a molten plastic material at least between the conductor member 30 and the molding die surface and solidifying the same so as to form thereat a plastic carrier member 10 to which the conductor member 30 is integrally embeded together with the top portions of the I/O pins 20.

公开(公告)号：EP2777372A1

公开(公告)日：2014-09-17

申请号：EP12778645.7

申请日：2012-10-01

Applicant: Robert Bosch GmbH

Inventor： ERBE, Christian

IPC: H05K7/10 ,  H05K1/02 ,  H01R12/70

CPC classification number: H05K5/0078 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K5/0069 ,  H05K7/1061 ,  H05K7/1092 ,  H05K2201/10151 ,  H05K2201/10704

Abstract: The invention relates to an apparatus (20) for making contact with a direction-dependent electrical and/or electronic component (10) comprising a predefined first number of functions with which contact is to be made, having a main body (21) and a predefined first number of first contact elements (23) which are each assigned to a function with which contact is to be made according to a predefined connection assignment and are arranged on the main body (21) with predefined positioning, and to an associated component arrangement having such a contact-making apparatus (20). According to the invention, the first contact elements (23) are positioned on the main body (21) in a rotationally symmetrical manner through an angle of 90°, with the result that no different component-based functions lie on one another when the direction-dependent electrical and/or electronic component (10) is rotated through 90°.

公开(公告)号：EP1984981B1

公开(公告)日：2012-01-18

申请号：EP06851995.8

申请日：2006-11-29

Applicant: Amphenol Corporation

Inventor： GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP1795058B1

公开(公告)日：2010-06-02

申请号：EP05799822.1

申请日：2005-09-21

Applicant: Intel Corporation

Inventor： MEIER, Pascal ,  DABRAL, Sanjay

IPC: H05K3/36 ,  H05K1/14

CPC classification number: G06F1/189 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  H01R12/79 ,  H05K1/14 ,  H05K1/147 ,  H05K3/222 ,  H05K3/305 ,  H05K2201/044 ,  H05K2201/10356 ,  H05K2201/10492 ,  H05K2201/10704 ,  H05K2201/2027 ,  Y10T29/49117

Abstract: A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.

公开(公告)号：EP1478215A3

公开(公告)日：2006-02-08

申请号：EP04394023.8

申请日：2004-05-07

Applicant: Nortel Networks Limited

Inventor： Difilippo, Luigi ,  Wyrzykowska, Aneta ,  Kwong, Herman

IPC: H05K3/30 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method for implementing a circuit component (160) on a surface of a multilayer circuit board (110) is provided. The circuit component includes a plurality of pins (162,164,166,168,170,172,174,176) and the circuit board (110) includes a plurality of electrically conductive vias (142,148,150,152,156) penetrating at least one layer of the circuit board (110) and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board (110). The method comprises the step of forming at least one pin (162,168A,170A,172,176A) of the plurality of pins (162,164,166,168,170,172,174,176) of the circuit component (160) to have a length compatible with a depth of a corresponding via (142,148,150,152,156) of the circuit board (110).

Abstract translation: 提供一种在多层电路板（110）的表面上实现电路部件（160）的方法。 电路部件包括多个引脚（162,164,166,168,170,172,174,176），并且电路板（110）包括穿透电路板（110）的至少一个层的多个导电通孔（142,148,150,152,156），并布置成形成至少一个 通道，用于在电路板（110）的一个或多个信号层处布线一个或多个迹线。 该方法包括形成电路部件（160）的多个引脚（162,164,166,168,170,172,174,176）的至少一个引脚（162,168A，170A，172,176A）以使其长度与对应的通孔（142,148,150,152,156）的深度相兼容的步骤， 的电路板（110）。

公开(公告)号：EP1463984A2

公开(公告)日：2004-10-06

申请号：EP03703735.5

申请日：2003-01-07

Applicant: INTEL CORPORATION

Inventor： HUANG, Lilly ,  KUMAR, Pavan

IPC: G06F1/26

CPC classification number: H05K1/0262 ,  G06F1/26 ,  H05K1/0231 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10325 ,  H05K2201/10704

Abstract: A power delivery device includes a socket to couple and deliver power to an electronic component. A voltage control sensor is coupled to the socket to sense an output voltage at the socket and to provide negative feedback control. An impedance of the socket and an associated baseboard is incorporated into the negative feedback control and may help compensate for voltage droop in the output voltage.

公开(公告)号：EP1049162A3

公开(公告)日：2001-06-27

申请号：EP00108979.6

申请日：2000-04-27

Applicant: NEC CORPORATION

Inventor： Sakurai, Junya, c/o NEC Corporation

IPC: H01L23/498 ,  H05K1/11 ,  H01L23/538

CPC classification number: H05K1/112 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0603 ,  H01L2224/13023 ,  H01L2224/1403 ,  H01L2224/14135 ,  H01L2224/16111 ,  H01L2224/16113 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/17104 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed circuit board (10) of a multilayer structure has a plurality of pads (12B, 12C) embedded together with a wiring pattern (11) in an inner layer thereof. An insulating material on the pads (12B, 12C) is removed from the printed circuit board (10) to form recesses (14B, 14C) through which the pads (12B, 12C) are exposed. A semiconductor package (22) is placed on the printed circuit board (11), and solder balls (20B, 20C) of the semiconductor package (22) are directly connected to the pads (12B, 12C) through the recesses (14B, 14C).

公开(公告)号：EP0668636A1

公开(公告)日：1995-08-23

申请号：EP94119847.5

申请日：1994-12-15

Applicant: Aries Electronics, Inc

Inventor： Sinclair, William Y. ,  Walter, James P.

IPC: H01R23/72 ,  H01R9/09 ,  H01R43/20

CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/1081 ,  H05K2201/10871 ,  Y10T29/4914 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.

Abstract translation: 印刷电路板装置包括在一侧具有用于电气部件的表面安装的印刷电路图案的平面PCB和在相对侧上的印刷电路，两个印刷电路都是电互连的。 PCB具有设置在相对侧的多个孔，其深度小于平面PCB的厚度。 每个孔位于印刷电路引线的远端。 在电路板的每个孔中设置细长的导电适配销，并且每个销具有与其相邻的一个扩大部分，用于在电路板的孔中实现过盈配合。 在扩大部分和另一端之间形成扩大的横截面焊接部分，并且限制销穿入PCB的孔的程度，并且销通过焊接电连接到引线的远端 扩大的横截面焊接部分。