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公开(公告)号:DE69331052D1
公开(公告)日:2001-12-06
申请号:DE69331052
申请日:1993-07-01
Applicant: CONS RIC MICROELETTRONICA
Inventor: ZAMBRANO RAFFAELE , LEONARDI SALVATORE , CACCIOLA GIOVANNA
IPC: H01L29/73 , H01L21/331 , H01L21/76 , H01L29/06 , H01L29/10 , H01L29/732 , H01L29/78 , H01L21/329 , H01L21/336 , H01L21/761
Abstract: An integrated edge structure for a high voltage semiconductor device comprising a PN junction represented by a diffused region (3,7) of a first conductivity type extending from a semiconductor device top surface is described. The edge structure comprises a first lightly doped ring (4) of the first conductivity type obtained in a first lightly doped epitaxial layer (2) of a second conductivity type and surrounding said diffused region (3,7), and a second lightly doped ring (8) of the first conductivity type, superimposed on and merged with said first ring (4), obtained in a second lightly doped epitaxial layer (6) of the second conductivity type grown over the first epitaxial layer (2).
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公开(公告)号:DE69521210T2
公开(公告)日:2001-11-22
申请号:DE69521210
申请日:1995-12-29
Applicant: CONS RIC MICROELETTRONICA
Inventor: AIELLO NATALE , GRAZIANO VITO
IPC: H01L27/02 , H01L27/082 , H01L29/00
Abstract: The present invention relates to an electronic device integrated monolithically on a semiconductor material comprising a substrate (1) having a first conductivity type in which are formed a first (2) and second diffusion regions (3) of a second conductivity type with said substrate (1) and said first (2) and second (3) diffusion regions including respectively a base region, a collector region and an emitter region of a transistor (Tp1) and characterized in that in the second diffusion region (3) is formed a third diffusion region (8) having conductivity of the first type to provide in said second diffusion region (3) a resistive path (R) placed in series with the emitter region of the transistor (Tp1) while backfeeding it negatively and taking it to saturation with a resulting reduction of its current gain and limitation of the maximum current due thereto.
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公开(公告)号:DE69330603D1
公开(公告)日:2001-09-20
申请号:DE69330603
申请日:1993-09-30
Applicant: CONS RIC MICROELETTRONICA
Inventor: ZAMBRANO RAFFAELE
IPC: H01L23/52 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/485 , H01L29/417 , H01L29/78 , H01L23/482
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公开(公告)号:DE69329999T2
公开(公告)日:2001-09-13
申请号:DE69329999
申请日:1993-12-29
Applicant: CONS RIC MICROELETTRONICA
Inventor: RONSISVALLE CESARE
IPC: H01L21/762 , H01L21/822 , H01L21/84 , H01L27/06 , H01L27/12 , H01L21/76 , H01L21/82
Abstract: A process for the manufacturing of integrated ciruits comprises the steps of: forming an oxide layer (5,6) on at least one surface of two respective semiconductor material wafers (1,2); obtaining a single semiconductor material wafer with a first layer (3,9) and a second layer (2) of semiconductor material and a buried oxide layer (8) interposed therebetween starting from said two semiconductor material wafers (1,2) by direct bonding of the oxide layers (5,6) previously grown; submitting the single wafer to a controlled reduction of the thickness of the first layer (3,9) of semiconductor material; lapping a top surface of the first layer (3,9) of semiconductor material; selectively introducing dopant impurities into selected regions (12,13,14) of the first layer (3,9) of semiconductor material to form the desired integrated components; forming trenches (18) laterally delimiting respective portions of the first layer (3,9) of semiconductor material wherein integrated components are present which are to be electrically isolated from other integrated components; filling the trenches (18) with an insulating material (20).
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公开(公告)号:DE69614248D1
公开(公告)日:2001-09-06
申请号:DE69614248
申请日:1996-05-31
Applicant: ST MICROELECTRONICS SRL , CONS RIC MICROELETTRONICA
Inventor: PISATI VALERIO , ALINI ROBERTO , COSENTINO GAETANO , VAI GIANFRANCO
Abstract: A BiCMOS Transconductor differential stage (10) for high frequency filters comprises an input circuit portion having signal inputs (IN+,IN-) and comprising a pair of MOS transistors (M1,M2) having their respective gate terminals (G1,G2) corresponding to the signal inputs as well as an output circuit portion having signal outputs (OUT-,OUT+) and comprising a pair of two-pole transistors (Q1,Q2) connected together with a common base in a circuit node (B) and inserted between inputs (IN+,IN-) and outputs (OUT-,OUT+) in cascode configuration. The stage (10) in accordance with the present invention calls for a switching device (3) associated with at least one of said added two-pole transistors (Q1,Q2) to change the connections between the parasite capacitors present in the transconductor stage. The switching device (3) also comprises at least one added two-pole transistor (Q1x, Q2x) connected in a removable manner in parallel with the corresponding two-pole cascode transistor (Q1,Q2). In a variant embodiment there are also provided respective added MOS transistors (M1x,M2x) connected in parallel with the MOS transistors (M1,M2) of the input portion to change the ratio W:L of each of the input transistors (M1,M2).
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公开(公告)号:DE69613956D1
公开(公告)日:2001-08-23
申请号:DE69613956
申请日:1996-02-29
Applicant: CONS RIC MICROELETTRONICA
Inventor: PULVIRENTI FRANCESCO
IPC: H03K17/082
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公开(公告)号:DE69520281T2
公开(公告)日:2001-08-09
申请号:DE69520281
申请日:1995-12-22
Applicant: CONS RIC MICROELETTRONICA
Inventor: GRIMALDI ANTONIO , SCHILLACI ANTONIO
IPC: H01L23/482 , H01L29/06 , H01L29/08 , H01L29/10 , H01L29/417 , H01L29/423 , H01L29/78 , H01L29/739
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公开(公告)号:DE69521287D1
公开(公告)日:2001-07-19
申请号:DE69521287
申请日:1995-03-24
Applicant: SGS THOMSON MICROELECTRONICS , CONS RIC MICROELETTRONICA
Inventor: GARIBOLDI ROBERTO , PULVIRENTI FRANCESCO
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公开(公告)号:DE69520281D1
公开(公告)日:2001-04-12
申请号:DE69520281
申请日:1995-12-22
Applicant: CONS RIC MICROELETTRONICA
Inventor: GRIMALDI ANTONIO , SCHILLACI ANTONIO
IPC: H01L23/482 , H01L29/06 , H01L29/08 , H01L29/10 , H01L29/417 , H01L29/423 , H01L29/78 , H01L29/739
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公开(公告)号:DE69426565D1
公开(公告)日:2001-02-15
申请号:DE69426565
申请日:1994-09-21
Applicant: ST MICROELECTRONICS SRL , CONS RIC MICROELETTRONICA
Inventor: PALARA SERGIO , ZAMBRANO RAFFAELE
IPC: H01L27/04 , H01L27/02 , H01L29/78 , H03K17/08 , H03K17/687
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