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    PRINTED WIRING BOARD
    121.
    发明申请
    PRINTED WIRING BOARD 有权
    印刷线路板

    公开(公告)号：US20160050754A1

    公开(公告)日：2016-02-18

    申请号：US14823519

    申请日：2015-08-11

    Applicant: FANUC Corporation

    Inventor： Makoto BEKKE

    IPC: H05K1/11

    CPC classification number: H05K1/115 ,  H05K3/3447 ,  H05K2201/09545 ,  H05K2201/09609 ,  H05K2201/09636 ,  H05K2203/044

    Abstract: A printed wiring board includes three or more than three through holes. An inner wall of the through hole is covered by conductive coating. Same size leads of an electronic component are inserted into the through holes. The through holes are soldered by dip soldering the printed wiring board in melting solder. The through holes have two or more diameters. The diameter of the through hole having more adjacent through holes is not larger than the diameter of the through hole having less adjacent through holes.

    Abstract translation: 印刷电路板包括三个或三个以上的通孔。 通孔的内壁被导电涂层覆盖。 将电子部件的相同尺寸的引线插入到通孔中。 通孔通过浸焊焊接印刷线路板而熔化焊料来焊接通孔。 通孔具有两个或更多个直径。 具有更多相邻通孔的通孔的直径不大于具有较少相邻通孔的通孔的直径。

    Via structure in multi-layer substrate
    122.
    发明授权
    Via structure in multi-layer substrate 有权
    多层基板中的通孔结构

    公开(公告)号：US09107315B2

    公开(公告)日：2015-08-11

    申请号：US12582647

    申请日：2009-10-20

    Applicant: Chih-kuang Yang

    Inventor： Chih-kuang Yang

    IPC: H05K1/11 ,  H05K3/40 ,  H05K1/03 ,  H05K3/04

    CPC classification number: H05K1/116 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/048 ,  H05K3/4076 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09645 ,  H05K2201/09827 ,  Y10T29/49204

    Abstract: Disclosed is a via structure in a multi-layer substrate, comprising a first metal layer, a dielectric layer and a second metal layer. The first metal layer has an upper surface. The dielectric layer covers the first metal layer in which a via is opened to expose the upper surface. The second metal layer is formed in the via and contacts an upper surface and an inclined wall of the via. A contacting surface of the second metal layer has a top line lower than the upper edge of the inclined wall. Alternatively, the second metal layer can be formed on the dielectric layer as being a metal line simultaneously as formed in the via as being a pad. The metal line and the pad are connected electronically. The aforesaid metal second layer can be formed in the via and on the dielectric layer by a metal lift-off process.

    Abstract translation: 公开了一种多层基板中的通孔结构，包括第一金属层，电介质层和第二金属层。 第一金属层具有上表面。 电介质层覆盖第一金属层，其中通孔被打开以暴露上表面。 第二金属层形成在通孔中并与通孔的上表面和倾斜壁接触。 第二金属层的接触表面具有比倾斜壁的上边缘低的顶线。 或者，第二金属层可以作为金属线形成在电介质层上，同时形成在通孔中作为焊盘。 金属线和焊盘以电子方式连接。 上述金属第二层可以通过金属剥离工艺在通孔和电介质层上形成。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    125.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    接线板及其制造方法

    公开(公告)号：US20150075848A1

    公开(公告)日：2015-03-19

    申请号：US14552771

    申请日：2014-11-25

    Applicant: IBIDEN CO., LTD.

    Inventor： Nobuyuki NAGANUMA ,  Michimasa Takahashi ,  Masakazu Aoyama

    IPC: H05K1/11 ,  H05K3/46 ,  H05K1/18 ,  H05K3/00 ,  H05K1/09 ,  H05K1/02

    CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/116 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09854 ,  Y10T156/1056

    Abstract: A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other.

    Abstract translation: 布线板包括多个绝缘层，包括以第一，第二，第三，第四和第五绝缘层的顺序层叠的第一，第二，第三，第四和第五绝缘层。 所述第一绝缘层具有包括电镀的第一导体，所述第二绝缘层具有包括电镀的第二导体，所述第三绝缘层具有包括导电糊的第三导体，所述第四绝缘层具有包括电镀的第四导体，所述第五绝缘层具有 包括电镀的第五导体，并且第一导体，第二导​​体，第三导体，第四导体和第五导体沿着相同的轴线形成并且彼此电连接。

    CIRCUIT BOARD WITH INTEGRATED PASSIVE DEVICES
    126.
    发明申请
    CIRCUIT BOARD WITH INTEGRATED PASSIVE DEVICES 有权
    具有集成无源器件的电路板

    公开(公告)号：US20140116765A1

    公开(公告)日：2014-05-01

    申请号：US13664264

    申请日：2012-10-30

    Applicant: MD Altaf Hossain ,  Jin Zhao ,  John T. Vu

    Inventor： MD Altaf Hossain ,  Jin Zhao ,  John T. Vu

    IPC: H05K1/16 ,  H05K3/30

    CPC classification number: H05K1/183 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0326 ,  H05K1/113 ,  H05K1/115 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/32 ,  H05K3/42 ,  H05K2201/09545 ,  H05K2201/09709 ,  H05K2201/0989 ,  H05K2201/10734 ,  Y10T29/4913

    Abstract: Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations. In one embodiment, an apparatus includes a circuit board having a first surface and a second surface opposite to the first surface and a passive device integral to the circuit board, the passive device having an input terminal configured to couple with electrical power of a die, an output terminal electrically coupled with the input terminal, and electrical routing features disposed between the first surface and the second surface of the circuit board and coupled with the input terminal and the output terminal to route the electrical power between the input terminal and the output terminal, wherein the input terminal includes a surface configured to receive a solder ball connection of a package assembly including the die. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及具有诸如电感器，电容器，电阻器和相关技术和配置的集成无源器件的电路板。 在一个实施例中，一种装置包括具有与第一表面相对的第一表面和第二表面的电路板，以及与电路板成一体的无源器件，该无源器件具有被配置为与管芯的电力耦合的输入端子， 与输入端子电耦合的输出端子以及设置在电路板的第一表面和第二表面之间的电气路由特征，并且与输入端子和输出端子耦合以在输入端子和输出端子之间布置电力 ，其中所述输入端子包括被配置为接收包括所述管芯的封装组件的焊球连接的表面。 可以描述和/或要求保护其他实施例。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    129.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    接线板及其制造方法

    公开(公告)号：US20110180908A1

    公开(公告)日：2011-07-28

    申请号：US12895126

    申请日：2010-09-30

    Applicant: Nobuyuki NAGANUMA ,  Michimasa Takahashi ,  Masakazu Aoyama

    Inventor： Nobuyuki NAGANUMA ,  Michimasa Takahashi ,  Masakazu Aoyama

    IPC: H01L29/41 ,  H01L21/36

    CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/116 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09854 ,  Y10T156/1056

    Abstract: A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.

    Abstract translation: 布线板包括具有第一表面和第二表面并且包括第一，第二和第三绝缘层从第一表面朝向第二表面的顺序的层叠体。 第一绝缘层具有穿过第一绝缘层的第一孔，并且包括在第一孔中由电镀制成的第一导体。 第二绝缘层具有穿过第二绝缘层的第二孔，并且包括在第二孔中由导电膏制成的第二导体。 第三绝缘层具有穿过第三绝缘层的第三孔，并且包括在第三孔中由电镀制成的第三导体。 第一，第二和第三导体沿着相同的轴定位并且彼此电连续。

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