公开(公告)号：DE102006020529A1

公开(公告)日：2007-03-01

申请号：DE102006020529

申请日：2006-05-03

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： STRAUS JOERG ,  BRAUNE BERT ,  BRUNNER HERBERT ,  PETERSEN KIRSTIN

IPC: H01L33/50 ,  H01L33/58

Abstract: An optoelectronic component comprises a semiconductor body (3) emitting electromagnetic radiation on operation of the component and a separate optical element (9) spaced from the semiconductor body in the radiating direction and comprising at least one wavelength conversion material (10) that changes the emitted wavelength into a different wavelength. Preferably the converting material comprises particles embedded in the optical element matrix.

公开(公告)号：DE102005040558A1

公开(公告)日：2007-03-01

申请号：DE102005040558

申请日：2005-08-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  BRUNNER HERBERT ,  FISCHER HELMUT ,  EISSLER DIETER ,  HEINDL ALEXANDER

IPC: H01L33/50 ,  H01L51/50

Abstract: A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.

公开(公告)号：DE102005061828A1

公开(公告)日：2007-01-04

申请号：DE102005061828

申请日：2005-12-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEHN KLAUS ,  BRUNNER HERBERT

IPC: C09D5/33 ,  C08K3/34 ,  C09B63/00 ,  C09K9/00 ,  C09K19/60 ,  H01L33/50

Abstract: Disclosed is a wavelength-converting converter material comprising at least one wavelength-converting phosphor comprising phosphor particles, wherein a portion of said phosphor or all of said phosphor is present in the form of nanoparticles. Also disclosed is a light-emitting optical component comprising such a converter material and a method for producing such components.

公开(公告)号：DE102005009066A1

公开(公告)日：2006-09-07

申请号：DE102005009066

申请日：2005-02-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SORG JOERG ERICH ,  JAEGER HARALD ,  BRAUNE BERT ,  BRUNNER HERBERT

IPC: H01L33/54 ,  H01S5/028

Abstract: The invention relates to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity.

公开(公告)号：DE10351397A1

公开(公告)日：2005-06-16

申请号：DE10351397

申请日：2003-10-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  GROETSCH STEFAN ,  OTT HUBERT

IPC: H01L33/50 ,  H01L33/58 ,  H01L33/00

公开(公告)号：DE10310844A1

公开(公告)日：2004-09-30

申请号：DE10310844

申请日：2003-03-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  ZEILER MARKUS ,  HOEFER THOMAS ,  KRAEUTER GERTRUD

IPC: H01L23/00 ,  H01L23/057 ,  H01L31/0203 ,  H01L33/00

公开(公告)号：DE10250911A1

公开(公告)日：2004-06-03

申请号：DE10250911

申请日：2002-10-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRAUNE BERT ,  BRUNNER HERBERT ,  JAEGER HARALD

IPC: H01L21/56 ,  H01L21/68 ,  H01L31/0203 ,  H01L33/52

Abstract: An encapsulation process for an optoelectronic component, especially a surface-mounted miniature luminescent or photo diode involves forming a semiconductor chip (1) on a carrier (2) with connections (3), mounting a template (4) with each gap aligned to the chip, pressure filling the gaps with encapsulant (8) and removing the template.

公开(公告)号：DE10250877A1

公开(公告)日：2004-05-19

申请号：DE10250877

申请日：2002-10-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOFMANN MARKUS ,  BRUNNER HERBERT

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01S5/022

Abstract: A light-emitting element comprises a radiating semiconductor chip on a lead frame and a housing. The chip is so mounted on the frame that the principal radiating direction (a) lies at an angle of between 0 and 90degrees to the mounting plane. The housing emission surface is at an angle (b) to the plane perpendicular to the radiating direction. Independent claims are also included for the following: (a) a module as above comprising many light-emitting elements; and (b) a production process for the above.

公开(公告)号：DE10214121C1

公开(公告)日：2003-12-24

申请号：DE10214121

申请日：2002-03-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEFER THOMAS ,  ZEILER MARKUS ,  BRUNNER HERBERT

IPC: G02B6/42 ,  H01L23/498 ,  H01L25/075 ,  H01L25/16 ,  H01L33/48 ,  H01L31/12 ,  G02B6/43 ,  H01L23/34 ,  H04B10/02

公开(公告)号：DE10214208A1

公开(公告)日：2003-10-23

申请号：DE10214208

申请日：2002-03-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  JAEGER HARALD ,  SCHMID JOSEF

IPC: H01L21/56 ,  H01L33/54 ,  H01L33/00

Abstract: Casting mold comprises first partial mold (2a) having first and second separating surfaces (5a, 6a) and second partial mold (2b) having first and second separating surfaces (5b, 6b). First separating surface of first partial mold lies next to hollow chamber wall (9) which forms bearing surface and second separating surface (6b) of second partial mold lies next to hollow chamber wall (10) which forms covering surface. Independent claims are also included for the following: (1) Multiple compartment casting mold consisting of a number of the above casting molds; and (2) Electronic component made from a molded body produced by the above casting mold.