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    SEMICONDUCTOR DEVICE WITH A DISTRIBUTED PLATING PATTERN
    131.
    发明申请
    SEMICONDUCTOR DEVICE WITH A DISTRIBUTED PLATING PATTERN 审中-公开
    具有分布式电镀图案的半导体器件

    公开(公告)号：WO2007136651A2

    公开(公告)日：2007-11-29

    申请号：PCT/US2007/011728

    申请日：2007-05-16

    Applicant: SANDISK CORPORATION ,  LIAO, Chih-chin ,  CHEN, Han-shiao ,  CHIU, Chin-tien ,  YU, Cheemen ,  TAKIAR, Hem

    Inventor： LIAO, Chih-chin ,  CHEN, Han-shiao ,  CHIU, Chin-tien ,  YU, Cheemen ,  TAKIAR, Hem

    IPC: H01L23/498

    CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/1433 ,  H05K1/0271 ,  H05K3/108 ,  H05K3/28 ,  H05K2201/0373 ,  H05K2201/09736 ,  H01L2924/00

    Abstract: A substrate, and a semiconductor die package formed therefrom, are disclosed which include a distributed plating pattern for reducing mechanical stress on the semiconductor die. The substrate according to embodiments of the invention may include traces and contact pads plated in a double image plating process. Additionally, the substrate may include dummy plating areas including plating material. The plated vias and/or traces and the plating material within the dummy plating areas provide a plating pattern which is evenly distributed across the surface of the substrate. The even distribution of the plating pattern prevents peaks and valleys in the finished substrate.

    Abstract translation: 公开了一种基板和由其形成的半导体管芯封装，其包括用于减小半导体管芯上的机械应力的分布电镀图案。 根据本发明的实施例的衬底可以包括以双映像电镀工艺电镀的迹线和接触焊盘。 此外，基板可以包括包括电镀材料的虚拟电镀区域。 电镀通孔和/或迹线以及虚拟电镀区域内的电镀材料提供均匀分布在基板表面上的电镀图案。 电镀图案的均匀分布防止成品基板中的峰和谷。

    SURFACE MOUNTED DEVICE WITH GROOVES ON A TERMINATION LEAD
    138.
    发明申请
    SURFACE MOUNTED DEVICE WITH GROOVES ON A TERMINATION LEAD 审中-公开
    表面安装设备在终止引线上带有孔

    公开(公告)号：WO00033420A1

    公开(公告)日：2000-06-08

    申请号：PCT/US1999/028254

    申请日：1999-11-30

    IPC: H01R4/04 ,  H05K3/32 ,  H05K3/34 ,  H01R4/02

    CPC classification number: H01R4/04 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

    Abstract: Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or "dam" over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packaging density of devices on the circuit board.

    Abstract translation: 具有更高安装强度的表面贴装器件封装及其方法。 在一个实施例中，电子设备由设备封装和一个或多个导电端子组成。 对于表面安装，器件端子各自设置有使用导电粘合剂粘合到电路板上的相应接触焊盘的安装表面。 端子还设置有跨过安装表面的至少一个凹槽。 当使用导电粘合剂将装置安装在电路板上时，该槽用于将导电粘合剂形成在接触垫上的脊或“阻挡”。 这提供了增加的安装强度，这可以消除对额外的粘合剂材料的需要来提供装置的侧面加强，从而允许电路板上的装置的包装密度增加。

    AN ELECTRICAL COMPONENT AND AN ELECTRICAL CIRCUIT MODULE HAVING CONNECTED GROUND PLANES
    139.
    发明申请
    AN ELECTRICAL COMPONENT AND AN ELECTRICAL CIRCUIT MODULE HAVING CONNECTED GROUND PLANES 审中-公开
    具有连接接地平面的电气元件和电路模块

    公开(公告)号：WO00027174A1

    公开(公告)日：2000-05-11

    申请号：PCT/EP1999/008199

    申请日：1999-10-28

    IPC: H05K1/18 ,  H01L23/12 ,  H01P1/203 ,  H01Q9/04 ,  H01Q13/08 ,  H01Q19/10 ,  H03F3/60 ,  H05K1/02 ,  H05K3/34 ,  H05K3/46

    CPC classification number: H01Q9/0407 ,  H01Q19/10 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10568 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: The invention relates to an electrical component (CO) as well as a device (DEV) comprising such an electrical component (CO) and an electric circuit module (MO). A ground plane (4) of the component (CO) and a ground plane (2) of the circuit module (MO) are bought into contact via projections (4'') provided on the ground plane (4) of the component (CO) and/or on the ground plane of the circuit module (MO). The provision of the projections (4'') and the recesses (4') therebetween provide heat sinks between the projections (4'') when they are soldered to the ground plane (2) of the circuit module (MO). Through-holes (8') and additional non-ground conductors (2') can be provided between pads (14) of the ground plane (2) of the circuit module (MO) allowing an efficient use of the available space. The invention is particularly useful when a patch antenna needing a large ground plane is connected to a multilayer circuit board. Another embodiment of the invention comprises a plurality of spacer elements which are arranged between the ground planes (2, 4) of the circuit module (MO) and of the component (CO), such that the ground planes (2, 4) can be kept flat. This allows a design of the configuration of the ground plane of the circuit module (MO) independently from a configuration of the component (CO).

    Abstract translation: 本发明涉及电气部件（CO）以及包括这种电气部件（CO）和电路模块（MO））的装置（DEV）。 通过设置在部件（CO）的接地平面（4）上的突起（4“），将元件（CO）的接地平面（4）和电路模块（MO）的接地平面（2） ）和/或在电路模块（MO）的接地平面上。 当它们被焊接到电路模块（MO）的接地平面（2）时，其间提供突起（4“）和凹部（4'）在突起（4”）之间提供散热器。 可以在电路模块（MO）的接地平面（2）的焊盘（14）之间提供通孔（8'）和附加的非接地导体（2'），从而有效地利用可用空间。 当将需要大的接地层的贴片天线连接到多层电路板时，本发明特别有用。 本发明的另一实施例包括布置在电路模块（MO）的接地平面（2,4）和部件（CO）之间的多个间隔元件，使得接地平面（2,4）可以是 保持平坦 这允许独立于组件（CO）的配置来设计电路模块（MO）的接地平面的配置。

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