Abstract:
Das Verfahren zur Herstellung von verfluchteten Durchführungen durch Substratmaterialien, bei denen die Projektion der Ein- und Ausmündungen sich nicht decken, wird einerseits durch versetztes Anlegen von Ätzfenstern auf beiden Seiten und durch entsprechend starkes Unterätzen dieser Fenster charakterisiert. Durch Anlegen von zueinander verschobenen Ätzfenstern auf beiden Seiten des Substrates und Durchätzen des Substrates durch die angelegten Fenster ergeben sich im Substrat "schräge" Durchführungen. Man kann, allein durch entsprechende Anlage der Fenster auch verzweigte Durchführungen mit mehr als einer Ausmündung herstellen.
Abstract:
A circuit board in which the patterns of electrically conductive strips and/or pads can be of either standard or non-standard form and which can be designed and assembled by a user comprises a rigid electrically insulating board 1 having a multiplicity of holes 2 through the board arranged in a pattern of rows and columns and, secured to one major surface of the board, a separately formed flexible sheet 4 of electrically insulating material carrying on the surface of the sheet remote from the board a pattern of electrically conductive strips and/or pads 8 which overlies holes in the board. The strips and/or pads 8 are of such an electrically conductive material and of such a thickness that, when a pin C is urged through an electrically conductive strip or pad and the underlying flexible sheet 4 into an underlying hole 2 in the board, electrically conductive material pierced by the pin will effect an electrical contact with the pin passing through the material.
Abstract:
A printed circuit board (20) for electric circuits is formed of plural layers of electrical conductors (22, 24, 26) and includes through holes (36) and vias (38) arranged in a regular pattern along points of a grid laid out along othorgonal axes of a Cartesian coordinate system. Conductors (32, 34) of a layer (22, 24) are grouped together as multiple-conductor channels (44, 46) which are routed among the through holes (36) and the vias (38) to make electrical connections among the electrical components. An additional via (48) can be entered in a central portion of a grid cell by rerouting conductors of channels in the cell through arcuate segments, thereby permitting connection between conductors of channels on different layers while preserving the original grid pattern of through holes and vias.
Abstract:
The wiring nets on a module are divided into two groups of planes, i.e., an upper group (5) in which wiring is placed along "north-south" and "east-west" directions and a lower group (6) in which wiring is placed along diagonal directions. All vias (R-vias) for connecting to the wiring pass through the upper group of planes but only half of the vias (D-vias) pass through the lower group of planes. Thus the spacing between the vias of the lower group of planes is greater than the spacing between the upper vias, allowing more lines per wiring channel in the lower group of planes.
Abstract:
Resistors (4; 4a, 4b) are formed on one surface of a board (1; 1a, 1b, 1c) having through hole conductors (2; 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, 2h', 7aa) arranged like a lattice, an electrode (6) is further formed on the surface of these resistors, and the electrodes over the through hole conductors are coaxially removed, thereby forming substantially disk-like resistors (4a, 4b).
Abstract:
A system for harnessing and conditioning wirelessly transmitted electrical energy by near field magnetic induction configured with various magnetic field shielding embodiments is disclosed. The shielding embodiments are designed to minimize electromagnetic interference and induced electrical current. The system comprises an electrical energy capture circuit (14) and a RF communication circuit (16). The electrical energy capture circuit (14) conditions and modifies the wirelessly received electrical energy. The RF communication circuit (16) enables the system to wirelessly communicate with its sub-circuits and other energy capture systems. The system comprises a tunable band stop filter (62) that is electrically connected to the RF communication sub-circuit (58). In addition, the RF communication sub-circuit (58) is configured with opposing electrically conductive plates that isolate and shield the circuit from an oscillating magnetic field.
Abstract:
In accordance with one embodiment, an electrical connector can be mounted to a first printed circuit board to obtain a first current capacity, and the electrical connector can be mounted to a second printed circuit board to obtain a second current capacity that is lower than the first current capacity.
Abstract:
The present invention provides a resin-sealed type semiconductor device capable of keeping the adhesive properties of sealing resin and improving the reliability and the like of the module. This resin-sealed type semiconductor device is a semiconductor device including: a conductive-patterned insulating substrate 1; conductive blocks 3a, 3b fixed to conductive patterns 2a, 2b of the conductive-patterned insulating substrate 1; a semiconductor chip 6 fixed to each conductive block; a printed circuit board 9 that has a conductive post 8 fixed to the semiconductor chip; and a resin 11 for sealing these constituents. The semiconductor device is configured such that the average volume of a conductive film per unit area of each conductive pattern around a section thereof, to which the corresponding conductive block is fixed, is reduced from the conductive block toward the outside.