公开(公告)号：US20090219101A1

公开(公告)日：2009-09-03

申请号：US12380313

申请日：2009-02-26

Applicant: James L. Stolpman ,  Jeffrey A. McCracken

Inventor： James L. Stolpman ,  Jeffrey A. McCracken

IPC: H03L1/04

CPC classification number: H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2203/165

Abstract: An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.

Abstract translation: 一种振荡器组件，包括位于印刷电路板的表面上形成并由限定用于振荡器的烘箱的盖子覆盖的导热材料垫上的振荡器。 在一个实施例中，多个加热器位于振荡器的不同侧，并且至少部分地位于该垫上，以将热量均匀地传递到该垫和该振荡器。 在一个实施例中，振荡器是温度补偿晶体振荡器，并且印刷电路板上的集成放大器控制器电路集成了至少一个用于控制加热器的运算放大器和用于向烘箱提供热量的一个或多个晶体管。 位于垫上并覆盖振荡器的顶盖可用于将热量更均匀地传递到振荡器。 印刷电路板底部的空腔限定了绝缘气囊。

公开(公告)号：US20090212878A1

公开(公告)日：2009-08-27

申请号：US12378741

申请日：2009-02-19

Applicant: Junichi Arai ,  Kenji Kasahara

Inventor： Junichi Arai ,  Kenji Kasahara

IPC: H03B5/30

CPC classification number: H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/167 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2201/10166

Abstract: An oven-controlled crystal oscillator includes a circuit board, a crystal unit surface-mounted on the circuit board, and a temperature control circuit that maintains operating temperature of the crystal unit constant. The temperature control circuit includes a heating resistor, a power transistor that supplies power to a heating resistor, and a temperature sensitive resistor that detects temperature of the crystal unit. The heating resistor is formed, as a film resistor, on a surface of the circuit board in an area thereof in which the crystal unit is located. The temperature sensitive resistor is provided on the circuit board as a film resistor.

Abstract translation: 炉控晶体振荡器包括电路板，表面安装在电路板上的晶体单元和保持晶体单元的工作温度恒定的温度控制电路。 温度控制电路包括加热电阻器，向加热电阻器供电的功率晶体管和检测晶体单元的温度的温度敏感电阻器。 加热电阻器作为薄膜电阻器形成在其中晶体单元所在的区域中的电路板的表面上。 温度敏感电阻器作为薄膜电阻器设置在电路板上。

公开(公告)号：US07479835B2

公开(公告)日：2009-01-20

申请号：US11518768

申请日：2006-09-11

Applicant: Hiroyuki Mitome ,  Manabu Ito ,  Takeshi Uchida

Inventor： Hiroyuki Mitome ,  Manabu Ito ,  Takeshi Uchida

IPC: H03B1/00

CPC classification number: H03B5/04 ,  H05K1/0201 ,  H05K1/0212 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10166 ,  H05K2203/165

Abstract: A constant temperature oscillator includes a crystal oscillator that is provided upright on a circuit board, an oscillation element arranged on the circuit board and configuring an oscillation circuit in conjunction with the crystal oscillator, and a temperature control element including a heating chip resistance and a thermistor, arranged on the circuit board, and configuring a temperature control circuit that keeps an operating temperature of the crystal oscillator constant, and which is provided with a heat transfer plate between the heating chip resistance and the bottom face of the oscillator container, wherein, the heat transfer plate has a notch into which the heating chip resistance is fitted, and a heat sink lies between the heat transfer plate and the heating chip resistance and closely contacts with them.

Abstract translation: 恒温振荡器包括直立设置在电路板上的晶体振荡器，布置在电路板上的振荡元件和与晶体振荡器配合的振荡电路，以及包括加热芯片电阻和热敏电阻的温度控制元件 布置在电路板上，并且配置保持晶体振荡器的工作温度恒定的温度控制电路，并且在加热芯片电阻和振荡器容器的底面之间设置有传热板，其中， 传热板具有嵌合加热芯片电阻的凹口，散热片位于传热板和加热芯片电阻之间并与它们紧密接触。

公开(公告)号：US20070151757A1

公开(公告)日：2007-07-05

申请号：US11687319

申请日：2007-03-16

Applicant: Katsuhiko FUJIKAWA ,  Koji TANAKA

Inventor： Katsuhiko FUJIKAWA ,  Koji TANAKA

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K1/111 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/611

Abstract: A wiring board module includes a multilayer wiring board. A crystal oscillator and an IC component, for example, are mounted on the mounting surface of the multilayer wiring board. Mounting lands for the IC component, mounting lands for the crystal oscillator, and mounting lands for other surface mount components are provided on the mounting surface. Each mounting land for the crystal oscillator is not a conventional single large-area land but is defined by four adjacent land pieces. The four land pieces are electrically connected via an external terminal of the crystal oscillator, thereby functioning as a mounting land for the external terminal. In other words, each of the plurality of mounting lands provided at locations corresponding to external terminals of the crystal oscillator is divided into four land pieces.

Abstract translation: 布线板模块包括多层布线板。 例如，在多层布线基板的安装面上安装有晶体振荡器和IC部件。 在安装面上设有用于IC部件的安装平台，晶体振荡器的安装平台和其他表面安装部件的安装台面。 用于晶体振荡器的每个安装平台不是常规的单个大面积的土地，而是由四个相邻的陆块限定。 四块焊盘通过晶体振荡器的外部端子电连接，从而用作外部端子的安装焊盘。 换句话说，设置在与晶体振荡器的外部端子对应的位置处的多个安装焊盘中的每一个被分成四个焊盘。

公开(公告)号：US20050052198A1

公开(公告)日：2005-03-10

申请号：US10932953

申请日：2004-09-02

Applicant: Masaaki Endo ,  Toshiro Furuta ,  Wataru Saitoh ,  Tadaomi Yamano

Inventor： Masaaki Endo ,  Toshiro Furuta ,  Wataru Saitoh ,  Tadaomi Yamano

IPC: H05K7/04 ,  G01R31/02 ,  H03B5/32 ,  H04B1/08 ,  H05K1/02 ,  H05K1/18 ,  H05K5/00 ,  H05K5/02 ,  H05K5/06 ,  H05K7/14 ,  H05K9/00

CPC classification number: H05K9/002 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/10075 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/2018

Abstract: An electronic circuit unit includes a circuit board mounted within a frame member, an electronic component with a cover mounted on the circuit boards, and linear terminals passing through and being mounted in the circuit board. The terminals include first and second terminal groups arranged at an interval between the respective terminals in a line. The terminal groups are arranged in a line in the vicinity of one side of the circuit board. An opening portion is provided between the first and second terminal groups, and the electronic component with the cover is mounted on the circuit board while being disposed in the opening portion. As a result, a space factor for the arrangement of the electronic component with the cover is very good, and thus it is possible to reduce a widthwise dimension of the circuit board.

Abstract translation: 电子电路单元包括安装在框架构件内的电路板，安装在电路板上的盖子的电子部件和通过并安装在电路板中的线性端子。 这些端子包括以一行的各个端子间隔布置的第一和第二端子组。 端子组在电路板的一侧附近排成一行。 开口部分设置在第一和第二端子组之间，并且具有盖的电子部件安装在电路板上同时设置在开口部分中。 结果，电子部件与盖的布置的空间因子非常好，因此可以减小电路板的宽度尺寸。

公开(公告)号：US06501341B2

公开(公告)日：2002-12-31

申请号：US09747657

申请日：2001-12-26

Applicant: Yoshiyuki Mashimo

Inventor： Yoshiyuki Mashimo

IPC: H03B518

CPC classification number: H05K1/0239 ,  H03B5/1203 ,  H03B5/1231 ,  H03B5/1243 ,  H03B5/1841 ,  H03B5/1847 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/10075

Abstract: A voltage control oscillation circuit is provided on the respective layers of a ceramic multilayer substrate, and an unbalanced transmission line and a balanced transmission line are provided to sandwich a predetermined ceramic layer, whereby an unbalance-balance conversion circuit is defined due to the mutual induction coupling between the transmission lines.

Abstract translation: 在陶瓷多层基板的各层上设置有电压控制振荡电路，并且设置不平衡传输线和平衡传输线以夹持预定的陶瓷层，从而由于相互感应而定义不平衡平衡转换电路 传输线之间的耦合。

公开(公告)号：US20010033203A1

公开(公告)日：2001-10-25

申请号：US09817482

申请日：2001-03-26

Inventor： Shinji Goma ,  Masao Uno

IPC: H03B005/18

CPC classification number: H05K1/0237 ,  H03B5/1847 ,  H05K1/0231 ,  H05K1/0295 ,  H05K1/181 ,  H05K2201/09954 ,  H05K2201/10075 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A miniaturized oscillator that is manufactured with greatly reduced production time and cost includes transmission lines defining resonance circuits provided on a circuit assembly board. In this state, the impedance of each transmission line is measured. Then, according to the transmission line impedance, chip components having impedances necessary to obtain a predetermined frequency are selected and mounted on the circuit substrate. With this arrangement and method of formation, the resulting oscillator oscillates at the desired oscillation frequency and it is not necessary to trim the transmission lines in order to achieve this result. Since the oscillator does not require time to make frequency adjustments and does require use of a trimming apparatus, no deterioration in the electric characteristics due to laser trimming occurs. In addition, it is unnecessary to provide an electrode land for making frequency adjustments. As a result, the entire oscillator is miniaturized.

Abstract translation: 以大大减少的生产时间和成本制造的小型化振荡器包括限定设置在电路组装板上的谐振电路的传输线。 在这种状态下，测量每条传输线的阻抗。 然后，根据传输线阻抗，选择具有获得预定频率所需的阻抗的芯片组件并安装在电路基板上。 利用这种形成方法和方法，所得到的振荡器以期望的振荡频率振荡，为了实现该结果，不需要修整传输线。 由于振荡器不需要时间来进行频率调整，并且需要使用修整装置，所以不会发生由于激光微调造成的电特性的劣化。 此外，不需要设置用于进行频率调节的电极焊盘。 结果，整个振荡器被小型化。

公开(公告)号：US5590029A

公开(公告)日：1996-12-31

申请号：US371720

申请日：1995-01-12

Applicant: H. Scott Estes

Inventor： H. Scott Estes

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42 ,  H05K7/02

CPC classification number: H05K1/184 ,  H05K1/141 ,  H05K3/301 ,  H05K1/023 ,  H05K1/183 ,  H05K2201/049 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/429 ,  Y02P70/611

Abstract: A space-saving circuit board mounting of a Surface Mounted Technology (SMT) device, such as a resistor, capacitor, ferrite or clock oscillator, is achieved using (1) a single through hole extending transversely through the board substrate, and (2) a cylindrical adapter having a first longitudinal portion coaxially received in the through hole and a second longitudinal portion projecting outwardly therefrom. The second longitudinal adapter portion has a radially inwardly extending notch that receives the SMT device and positions it with its electrically conductive opposite end sections spaced apart in a direction parallel to the axis of the through hole. Spaced apart external metal plating sections on the adapter connect the SMT device end portions to circumferentially separated metal plating segments on the surface of the through hole which, in turn, are representatively connected to ground and signal plane structures within the interior of the board substrate.

Abstract translation: 使用（1）横向延伸穿过基板的单个通孔实现诸如电阻器，电容器，铁氧体或时钟振荡器的表面贴装技术（SMT）器件的节省空间的电路板安装，以及（2） 圆柱形适配器具有同轴地容纳在通孔中的第一纵向部分和从其向外突出的第二纵向部分。 第二纵向适配器部分具有径向向内延伸的凹口，其接收SMT装置并且使其具有在平行于通孔的轴线的方向间隔开的导电相对端部分。 适配器上的间隔开的外部金属镀层部分将SMT器件端部连接到通孔表面上的周向分离的金属电镀部分，其又代表性地连接到板基板内部的接地和信号平面结构。

公开(公告)号：US09408307B2

公开(公告)日：2016-08-02

申请号：US14382801

申请日：2013-03-05

Applicant: KYOCERA Corporation

Inventor： Mahiro Tsujino ,  Eiichi Katayama ,  Emi Mukai ,  Atsushi Ogasawara

IPC: H05K5/00 ,  H05K1/18 ,  H01L23/057 ,  H05K1/16

CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0344 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10143 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10196 ,  H01L2924/00

Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

Abstract translation: 一种器件外壳封装，包括矩形形式的衬底，在其上表面具有器件的安装区域; 框架体，其设置在所述基板上，以沿着所述安装区域的外周延伸，所述框体具有在其一部分处形成的切口; 以及设置在所述切口中的输入输出端子。 输入输出端子包括第一绝缘层，覆盖在第一绝缘层上的第二绝缘层和覆盖在第二绝缘层上的第三绝缘层。 设置在预定电位的第一端子设置在第一绝缘层的上表面上。 设置在预定电位的第二端子设置在第一绝缘层的下表面上。 AC信号流过的第三端子设置在第二绝缘层的上表面上。

公开(公告)号：US09370106B2

公开(公告)日：2016-06-14

申请号：US13962201

申请日：2013-08-08

Applicant: Seiko Epson Corporation

Inventor： Tomoyuki Kamakura

IPC: H05K5/06 ,  H05K1/18 ,  C04B37/04 ,  H03H9/10 ,  C04B37/00 ,  H05K1/02

CPC classification number: H05K1/183 ,  C04B37/005 ,  C04B37/045 ,  C04B2237/10 ,  H01L2224/16225 ,  H03H9/1021 ,  H05K1/0284 ,  H05K2201/10075

Abstract: A method for producing a package includes preparing a base substrate provided with a low-melting glass and a lid, defoaming the low-melting glass by heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere, and joining the base substrate and the lid to each other by superimposing the base substrate and the lid on each other through the low-melting glass, and then heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere.

Abstract translation: 制造包装的方法包括制备具有低熔点玻璃和盖子的基底基材，通过将低熔点玻璃加热至等于或高于倾点的温度在减压下将低熔点玻璃消泡 气氛，并且通过使基底基板和盖子彼此叠加通过低熔点玻璃而将基底和盖子彼此接合，然后将低熔点玻璃加热至等于或高于倾点的温度 在减压气氛中。