公开(公告)号：US10017375B2

公开(公告)日：2018-07-10

申请号：US15291142

申请日：2016-10-12

Applicant: Robert Bosch GmbH

Inventor： Frank Reichenbach ,  Till Schade ,  Jochen Reinmuth ,  Philip Kappe ,  Alexander Ilin ,  Mawuli Ametowobla ,  Julia Amthor

IPC: H01L21/76 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0035 ,  B81B2201/0235 ,  B81C1/00182 ,  B81C1/00277 ,  B81C1/00293 ,  B81C1/00325 ,  B81C1/00666 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2203/0109 ,  B81C2203/0145

Abstract: A method is provided for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity. An access opening, connecting the first cavity to surroundings of the micromechanical component, is formed in the substrate or in the cap. The first pressure and/or the first chemical composition are adjusted in the first cavity. The access opening is sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser. A recess is formed in a surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for reducing local stresses occurring at a sealed access opening.

公开(公告)号：US09975761B2

公开(公告)日：2018-05-22

申请号：US15444086

申请日：2017-02-27

Applicant: SMARTTIP BV

Inventor： Edin Sarajlic

IPC: B81C1/00 ,  A61B5/15

CPC classification number: B81C1/0015 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150396 ,  A61B5/150511 ,  A61B5/150519 ,  A61B5/150984 ,  A61B5/15142 ,  A61M37/0015 ,  B81B2201/057 ,  B81B2201/12 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00111 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0198 ,  C01B21/0687

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process, a layer of first material is deposited on a wafer comprising a plurality of pits a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits; using the second layer as a shadow mask when depositing a third layer at an angle, covering a part of the first material with said third material at the central locations, and etching the exposed parts of the first layer using the third layer as a protective layer.

公开(公告)号：US20180130728A1

公开(公告)日：2018-05-10

申请号：US15791152

申请日：2017-10-23

Applicant: SEIKO EPSON CORPORATION

Inventor： Kazuhiro GOMI

IPC: H01L23/498 ,  H01L21/768 ,  B41J2/16 ,  B81C1/00 ,  H01L21/268 ,  H01L21/306

CPC classification number: H01L23/49827 ,  B41J2/161 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1634 ,  B41J2/1645 ,  B81C1/00087 ,  B81C2201/0143 ,  H01L21/268 ,  H01L21/306 ,  H01L21/30604 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A silicon substrate processing method includes forming an etching mask which has an opening portion, on a surface of a silicon substrate, forming an etching guide hole in the opening portion on the silicon substrate, and forming a through-hole which passes through the silicon substrate, by applying an etching treatment onto the silicon substrate in which the etching guide hole is formed. In the forming of the guide hole, the etching guide hole passing through the silicon substrate is formed by irradiating the opening portion with a laser beam a plurality of times, with a cooling period between each instance of irradiation with the laser beam.

公开(公告)号：US09963340B2

公开(公告)日：2018-05-08

申请号：US14958372

申请日：2015-12-03

Applicant: Honeywell International Inc.

Inventor： Gregory C. Brown

IPC: B81B3/00 ,  G01L9/00 ,  B81C1/00

CPC classification number: B81B3/0051 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00158 ,  B81C2201/013 ,  B81C2201/0143 ,  B81C2203/0118 ,  G01L9/0047 ,  G01L9/0054 ,  G01L9/0055 ,  G01L19/0618

Abstract: A pressure sensor die assembly comprises a base substrate having a first surface, a stop structure on the first surface, and a diaphragm structure coupled to the first surface. The diaphragm structure comprises a first side with a cavity section including a first cavity and a second cavity surrounding the first cavity; a pressure sensing diaphragm portion having a first thickness and defined by the first cavity; and an over pressure diaphragm portion having a second thickness and defined by the second cavity, the second thickness greater than the first thickness. When an over pressure is applied, at least some area of the pressure sensing diaphragm portion is deflected and supported by the stop structure. As over pressure is increased, the over pressure diaphragm portion deflects and engages with the first surface such that additional area of the pressure sensing diaphragm portion is deflected and supported by the stop structure.

公开(公告)号：US20180038890A1

公开(公告)日：2018-02-08

申请号：US15670281

申请日：2017-08-07

Applicant: Khalifa University of Science and Technology

Inventor： Marcus S. Dahlem ,  Evgenii Demidov ,  Anatol Khilo

IPC: G01P15/13 ,  G01C19/56 ,  G01P15/097

CPC classification number: G01P15/131 ,  B81B2201/0235 ,  B81B2201/047 ,  B81C1/00246 ,  B81C2201/0143 ,  B81C2201/0188 ,  B81C2203/0714 ,  G01C19/56 ,  G01C19/66 ,  G01P15/093 ,  G01P15/097

Abstract: A method of forming a photonic inertial sensor includes providing a substrate having an insulation layer and a silicon layer on the insulation layer opposite the substrate; etching the silicon layer to form a silicon proof mass for the photonic inertial sensor; etching at least a portion of the insulation layer underneath the silicon proof mass to suspend the silicon proof mass; and depositing a high-density mass-increasing layer on the silicon proof mass to thereby increase the mass of the silicon proof mass.

公开(公告)号：US20170371324A1

公开(公告)日：2017-12-28

申请号：US15686327

申请日：2017-08-25

Applicant: PowerPhotonic Ltd.

Inventor： Matthew Oren Currie ,  Simon Clovis Younger ,  Roy McBride

IPC: G05B19/418

CPC classification number: G05B19/41865 ,  B81C2201/0143 ,  Y02P90/20 ,  Y02P90/26 ,  Y10S977/889

Abstract: A process for the manufacture of custom freeform optical elements utilising parameterised modelling. A system for the automatic manufacture of a custom optical element is also described with the manufacturing being by laser micro-machining. The process and system allow customers to specify and order via a web interface and so reduce engineering time, overhead and cost.

公开(公告)号：US09755612B2

公开(公告)日：2017-09-05

申请号：US14367803

申请日：2012-12-20

Applicant: The Swatch Group Research and Development Ltd

Inventor： Thierry Hessler ,  Silvio Dalla Piazza

IPC: B44C1/22 ,  H03H9/19 ,  B81C1/00 ,  G04C3/12 ,  G04F5/06 ,  G04G17/02 ,  G04B17/06 ,  G04B17/34 ,  B23K26/00 ,  F21V17/02 ,  H01L41/047 ,  H01L41/332 ,  H03H9/215

CPC classification number: H03H9/19 ,  B23K26/53 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81C1/00595 ,  B81C2201/0143 ,  F21V17/02 ,  G04B17/066 ,  G04B17/345 ,  G04C3/12 ,  G04F5/063 ,  G04G17/02 ,  H01L41/0475 ,  H01L41/332 ,  H03H9/215

Abstract: A method for manufacturing a resonator in a substrate, including: a) modifying a structure of at least one region of the substrate to make the at least one region more selective; b) etching the at least one region to selectively manufacture the resonator.

公开(公告)号：US09673114B1

公开(公告)日：2017-06-06

申请号：US14695767

申请日：2015-04-24

Applicant: Multibeam Corporation

Inventor： David K. Lam ,  Kevin M. Monahan ,  Michael C. Smayling ,  Theodore A. Prescop

IPC: H01L21/66 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/26 ,  H01J37/305 ,  H01J37/30

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be removed from a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beams. Reducing the number of process steps, and eliminating lithography steps, in localized material removal has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material removal allows for controlled variation of removal rate and enables creation of 3D structures or profiles. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted substrate processing.

公开(公告)号：US09433115B2

公开(公告)日：2016-08-30

申请号：US13910340

申请日：2013-06-05

Applicant: THE AEROSPACE CORPORATION

Inventor： Henry Helvajian

IPC: H05K1/11 ,  H05K7/02 ,  B01J19/00 ,  B01L3/00 ,  B81B7/00 ,  B81C99/00 ,  H01P3/12 ,  H05K1/16 ,  H05K3/10 ,  G02B6/12 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K7/02 ,  B01J19/0093 ,  B01J2219/00824 ,  B01J2219/00835 ,  B01J2219/00853 ,  B01J2219/00941 ,  B01J2219/00948 ,  B01L3/502707 ,  B01L2300/0654 ,  B01L2300/0681 ,  B01L2300/0867 ,  B01L2300/0874 ,  B81B7/0077 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/095 ,  B81B2207/096 ,  B81C99/0095 ,  B81C2201/0143 ,  B81C2201/0159 ,  G02B2006/12035 ,  G02B2006/12171 ,  H01P3/121 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0023 ,  H05K3/101 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908

Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

Abstract translation: 使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷，该器件可以包括化学，机械，电子，电磁，光学和声学设备中的一种或多种，​​所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料，使用内部连接和表面接口互连这些器件。

公开(公告)号：US09134250B2

公开(公告)日：2015-09-15

申请号：US14385750

申请日：2012-03-23

Applicant: Valery K. Smirnov ,  Dmitry S. Kibalov

Inventor： Valery K. Smirnov ,  Dmitry S. Kibalov

IPC: G01N21/65 ,  B81C1/00 ,  C23C14/34 ,  B82Y15/00 ,  B82Y40/00

CPC classification number: G01N21/658 ,  B81C1/00031 ,  B81C2201/0143 ,  B82Y15/00 ,  B82Y40/00 ,  C23C14/3442 ,  G01N2201/06113 ,  Y10S977/81

Abstract: A nanostructured arrangement includes a substrate having a surface and comprising a metal and a nanostructured layer formed on the substrate surface by an ion beam. The nanostructured layer includes a plurality of hollow metal nanospheres. Each of the plurality of nanospheres includes a chemical compound formed from the metal of the substrate by the ion beam. An example of a nanostructured arrangement is a surface enhanced Raman scattering (SERS) sensor.

Abstract translation: 纳米结构布置包括具有表面并且包括通过离子束在衬底表面上形成的金属和纳米结构层的衬底。 纳米结构层包括多个中空金属纳米球。 多个纳米球中的每一个包括通过离子束从衬底的金属形成的化合物。 纳米结构布置的示例是表面增强拉曼散射（SERS）传感器。