公开(公告)号：US20240147621A1

公开(公告)日：2024-05-02

申请号：US18547107

申请日：2021-12-01

Applicant: HITACHI ASTEMO, LTD.

Inventor： Narutoshi YAMADA ,  Yuuichi YANAGISAWA ,  Takahiro MAKIKO

IPC: H05K1/11 ,  B23K1/005 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/116 ,  B23K1/005 ,  H05K3/3447 ,  H05K3/4007 ,  B23K2101/42 ,  H05K2201/0939

Abstract: A manufacturing method of a circuit board including an annular land portion around a through hole through which a terminal that is an object of a soldering penetrates, and that is soldered on the land portion by a soldering process with a solder supply, the manufacturing method includes: previously forming a preliminary solder at a position opposite to a supply position of the solder in the land portion with respect to the through hole before the soldering process.

公开(公告)号：US20240049387A1

公开(公告)日：2024-02-08

申请号：US18381942

申请日：2023-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hansu CHEON ,  Youngjae KO

IPC: H05K1/11 ,  G04G17/04

CPC classification number: H05K1/111 ,  G04G17/04 ,  H05K2201/10128 ,  H05K2201/0939

Abstract: An electronic device includes a housing; a printed circuit board provided in the housing and including a fastening hole; a pad structure provided on the printed circuit board, the pad structure including: a first pad surrounding at least a portion of the fastening hole; a second pad spaced apart from the first pad in a first direction; and a third pad spaced apart from the first pad in a second direction that is different from the first direction with respect to the fastening hole; a first electronic component provided on the printed circuit board and electrically connected to the second pad; and a metal plate including: a first plate area provided on the first pad; and a second plate area extending from the first plate area and provided on one of the second pad and the third pad.

公开(公告)号：US10074919B1

公开(公告)日：2018-09-11

申请号：US15625149

申请日：2017-06-16

Applicant: INTEL CORPORATION

Inventor： Zhen Zhou ,  Daqiao Du ,  Anne M. Sepic ,  Kai Xiao

IPC: H01R12/00 ,  H01R12/71 ,  H01R12/75 ,  H01R43/20 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/00

CPC classification number: H01R12/714 ,  H01R12/75 ,  H01R43/205 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/4644 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09545 ,  H05K2201/10265 ,  H05K2201/10909 ,  H05K2203/06 ,  H05K2203/162

Abstract: Embodiments of the present disclosure may relate to a printed circuit board (PCB) that includes a first outer layer and a second outer layer opposite the first outer layer. The PCB may further include a routing layer between the first outer layer and the second outer layer, and an interconnect positioned within the first outer layer and coupled with the routing layer. The interconnect may include a contact within an opening in the first outer layer, wherein the contact is within a plane defined by an outer surface of the first outer layer. The interconnect may further include a plated via directly coupled with the contact and the routing layer. Other embodiments may be described or claimed.

公开(公告)号：US20180151312A9

公开(公告)日：2018-05-31

申请号：US15592480

申请日：2017-05-11

Applicant: CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN WATCH CO., LTD.

Inventor： Ryo WAKUDA

IPC: H01H13/14 ,  H05K1/11 ,  H01H13/52 ,  H05K1/18 ,  H01H13/04

CPC classification number: H01H13/14 ,  H01H13/04 ,  H01H13/52 ,  H01H2013/525 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/10053

Abstract: A switch component includes a spring plate and a cover of rubber. The cover of rubber covers at least one part of an upper surface of the spring plate. The cover of rubber includes at least one pair of supporting portions that support the spring plate.

公开(公告)号：US09825014B2

公开(公告)日：2017-11-21

申请号：US15226209

申请日：2016-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Goo Cha ,  Yong Ii Kim ,  Wan tae Lim

IPC: H01L33/60 ,  H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H05K1/00 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/505 ,  H01L33/62 ,  H05K1/00 ,  H05K1/181 ,  H05K1/183 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2201/209 ,  H05K2203/104 ,  H05K2203/168 ,  Y02P70/611

Abstract: A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

公开(公告)号：US20170330708A1

公开(公告)日：2017-11-16

申请号：US15592480

申请日：2017-05-11

Applicant: CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN WATCH CO., LTD.

Inventor： Ryo WAKUDA

IPC: H01H13/14 ,  H05K1/18 ,  H01H13/04 ,  H05K1/11 ,  H01H13/52

CPC classification number: H01H13/14 ,  H01H13/04 ,  H01H13/52 ,  H01H2013/525 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/10053

Abstract: A switch component includes a spring plate and a cover of rubber. The cover of rubber covers at least one part of an upper surface of the spring plate. The cover of rubber includes at least one pair of supporting portions that support the spring plate.

公开(公告)号：US09622352B2

公开(公告)日：2017-04-11

申请号：US14429741

申请日：2012-09-26

Applicant: MEIKO ELECTRONICS CO., LTD.

Inventor： Ryoichi Shimizu ,  Mitsuo Iwamoto ,  Mitsuaki Toda

IPC: H05K3/30 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

Abstract: In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.

公开(公告)号：US09524931B2

公开(公告)日：2016-12-20

申请号：US14592105

申请日：2015-01-08

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Satoshi Shiraki

IPC: H01L23/12 ,  H01L23/053 ,  H01L21/20 ,  H01L21/36 ,  H01L23/498 ,  H05K1/11 ,  H01L25/10 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H05K1/14 ,  H05K3/00 ,  H01L23/29

CPC classification number: H01L23/49838 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1533 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: A wiring substrate includes a block with substrates laid out in an array. The block includes corners and a plan view center. Each substrate includes a substrate body. Pads are formed on the substrate body. Each pad includes a pad surface. The pads of the substrates include first pads, which are the pads of one of the substrates located in at least one of the corners of the block. The pad surface of each of the first pads includes a first axis extending from the first pad toward the plan view center of the block. The pad surface of each of the first pads has a first length along the corresponding first axis and a second length along a second axis, which is orthogonal to the first axis. The first length is longer than the second length.

Abstract translation: 布线基板包括具有布置在阵列中的基板的块。 该块包括角落和平面图中心。 每个基板包括基板主体。 垫片形成在基板主体上。 每个垫包括垫表面。 衬底的焊盘包括第一焊盘，其是位于块的至少一个角落中的一个衬底的焊盘。 每个第一焊盘的焊盘表面包括从第一焊盘朝向块的平面图中心延伸的第一轴。 每个第一焊盘的焊盘表面具有沿着对应的第一轴线的第一长度和沿着与第一轴线正交的第二轴线的第二长度。 第一长度比第二长度长。

公开(公告)号：US20160163610A1

公开(公告)日：2016-06-09

申请号：US14428376

申请日：2013-08-28

Applicant: Shimon PODVAL ,  QUBEICON LTD.

Inventor： Shimon Podval

IPC: H01L23/13 ,  H05K1/11 ,  H05K1/02 ,  H01L25/065 ,  H01L23/498 ,  H05K1/14

CPC classification number: H01L23/13 ,  H01L23/49838 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/49113 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81385 ,  H01L2924/00014 ,  H01L2924/15162 ,  H01L2924/15192 ,  H05K1/0204 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3442 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/0939 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

Abstract translation: 一种用于将半导体器件连接到外部电路的基座，所述基座包括：平面基板，由绝缘材料形成并且具有相对窄的边缘表面和第一和第二相对大的表面; 沿着边缘表面形成的至少一个凹部; 形成在所述至少一个凹部中的每一个的表面上的导电材料层; 所述第一表面上的第一多个焊盘被配置为与半导体器件电接触; 以及导电连接，每个导电连接将所述第一多个焊盘中的焊盘电连接到所述至少一个凹部的凹部的导电材料层。

公开(公告)号：US09192044B2

公开(公告)日：2015-11-17

申请号：US13862038

申请日：2013-04-12

Applicant: CANON KABUSHIKI KAISHA

Inventor： Seiji Hayashi ,  Takuya Kondo ,  Shoji Matsumoto

IPC: H05K1/16 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01L23/498

CPC classification number: H05K1/0216 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/48227 ,  H05K1/0228 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/114 ,  H05K1/116 ,  H05K1/14 ,  H05K1/141 ,  H05K1/162 ,  H05K1/18 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09454 ,  H05K2201/09463 ,  H05K2201/09636 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.

Abstract translation: 第一和第二信号布线图案形成在第一导体层中。 通过第一通孔电连接到第一信号布线图案的第一电极焊盘和通过第二通孔电连接到第二信号布线图案的第二电极焊盘形成在作为表面层的第二导体层中。 第三导体层设置在第一导体层和第二导体层之间，绝缘体插在这些导体层之间。 电连接到第一通孔的第一焊盘形成在第三导体层中。 第一焊盘包括与垂直于印刷电路板的表面的方向观察的与第二电极焊盘重叠并且通过绝缘体与第二电极焊盘相对的相对部分。 这使得能够减少在信号布线之间引起的串扰噪声。