公开(公告)号：US20150263250A1

公开(公告)日：2015-09-17

申请号：US14657474

申请日：2015-03-13

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA

IPC: H01L33/56 ,  H01L33/38 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/16225 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2203/048 ,  Y02P70/611

Abstract: Provided is an illumination device that includes a light emitting device having a first electrode and a second electrode and a mounting substrate including a first wiring pattern and a second wiring pattern. The first wiring pattern and the second wiring pattern face and are bonded to the first electrode and the second electrode, respectively, through a bonding material. The second electrode and the second wiring pattern are configured to be at least partially overlapped with each other in a plan view irrespective of an orientation of the light emitting device, under condition that the first electrode and the first wiring pattern are at least partially overlapped with each other in the plan view.

Abstract translation: 提供一种照明装置，其包括具有第一电极和第二电极的发光装置和包括第一布线图案和第二布线图案的安装基板。 第一布线图案和第二布线图案分别通过接合材料接合到第一电极和第二电极。 在第一电极和第一布线图案至少部分地与第一电极和第二布线图案重叠的条件下，第二电极和第二布线图案被配置为在平面图中至少部分地彼此重叠，而与发光器件的取向无关 在平面图中彼此相处。

公开(公告)号：US08610001B2

公开(公告)日：2013-12-17

申请号：US13106991

申请日：2011-05-13

Applicant: Hisashi Kato

Inventor： Hisashi Kato

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/3489 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/0939 ,  H05K2201/0969 ,  H05K2203/041 ,  H05K2203/0557

Abstract: A printed wiring board including an insulation layer, a conductive circuit on the insulation layer, an outermost interlayer resin insulation layer formed on the insulation layer and the conductive circuit and having a via-conductor opening connected to the conductive circuit, a land structure including a first land formed on the outermost interlayer resin insulation layer around the via-conductor opening and a second land formed on the outermost interlayer resin insulation layer around the first land, and a via conductor formed in the via-conductor opening through the outermost interlayer resin insulation layer such that the first land of the land structure on the outermost interlayer resin insulation layer is connected to the conductive circuit on the insulation layer. The land structure has a space between the first land and second land of the land structure, and the first land of the land structure is directly connected to the via conductor.

Abstract translation: 一种印刷线路板，包括绝缘层，绝缘层上的导电电路，形成在绝缘层上的最外层间树脂绝缘层和导电电路，并具有连接到导电电路的通路导体开口， 在通孔导体开口周围的最外层间树脂绝缘层上形成的第一焊盘和形成在第一焊盘周围的最外层间树脂绝缘层上的第二焊盘，以及通过最外层间树脂绝缘体形成在通孔导体开口中的通孔导体 使得最外层间树脂绝缘层上的焊盘结构的第一焊盘与绝缘层上的导电电路连接。 土地结构在土地结构的第一个土地和第二个土地之间有一个空间，土地结构的第一个土地直接连接到通道。

公开(公告)号：US20130048363A1

公开(公告)日：2013-02-28

申请号：US13304374

申请日：2011-11-24

Applicant: CHENG-FEI WENG ,  ZHENG-HENG SUN

Inventor： CHENG-FEI WENG ,  ZHENG-HENG SUN

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0293 ,  H05K2201/0305 ,  H05K2201/0939 ,  H05K2201/09909 ,  H05K2203/1105 ,  H05K2203/173 ,  Y10T29/49124

Abstract: A circuit board includes a board, a first signal trace and a second signal trace on the board, a first solder pad formed on the board and connected to a terminal of the first signal trace near to one end of the second signal trace, and a second pad formed on the board and connected to a terminal of the second signal trace near to the first solder pad. The second pad is apart from the first pad. The first pad or the second pad is coated with solder. After heated, the solder melts and spread to the second pad or the first pad, thereby connecting the first signal trace to the second signal trace.

Abstract translation: 电路板包括板上的第一信号迹线和板上的第二信号迹线，形成在板上并连接到靠近第二信号迹线的一端的第一信号迹线的端子的第一焊盘，以及 第二焊盘形成在板上并连接到靠近第一焊盘的第二信号迹线的端子。 第二垫与第一垫不同。 第一焊盘或第二焊盘涂覆有焊料。 加热后，焊料熔化并扩散到第二焊盘或第一焊盘，从而将第一信号迹线连接到第二信号迹线。

公开(公告)号：US08179690B2

公开(公告)日：2012-05-15

申请号：US12841336

申请日：2010-07-22

Applicant: Hsiang-Chih Ni ,  Ching-Feng Hsieh

Inventor： Hsiang-Chih Ni ,  Ching-Feng Hsieh

IPC: H05K7/06 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/78 ,  H01L2224/85399 ,  H01L2924/00014 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2203/048 ,  Y02P70/611 ,  Y10T29/49133 ,  Y10T29/49169 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least two cut edges, and the solder pads are installed in an alignment direction on the printed circuit board, such that the cut-edge positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract translation: 尖端定位型焊接结构和防止引脚偏移的方法可以防止当引脚​​通过焊料焊接到印刷电路板上时电子部件的多个引脚偏离，并且至少两个焊料 焊盘包括至少两个切割边缘，并且焊盘沿着印刷电路板上的排列方向安装，使得切边定位型焊接结构和防止引脚偏移的方法可以提高制造工艺的效率， 降低制造成本。

公开(公告)号：US20110308850A1

公开(公告)日：2011-12-22

申请号：US12841518

申请日：2010-07-22

Applicant: Hsiang-Chih Ni ,  Ching-Feng Hsieh

Inventor： Hsiang-Chih Ni ,  Ching-Feng Hsieh

IPC: H05K1/11 ,  B23K31/02

CPC classification number: H05K1/111 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/0939 ,  Y02P70/611

Abstract: A notch positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least one notch, and the solder pads are installed in an alignment direction on the printed circuit board, such that the notch positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract translation: 凹口定位型焊接结构和防止引脚偏移的方法可以防止当引脚​​通过焊料焊接到印刷电路板上时电子部件的多个引脚偏离，并且至少两个焊盘中的每一个包括 至少一个切口，并且焊盘沿着印刷电路板上的排列方向安装，使得凹口定位型焊接结构和防止引脚偏离的方法可以提高制造工艺的效率并降低制造成本。

公开(公告)号：US20110284277A1

公开(公告)日：2011-11-24

申请号：US13106991

申请日：2011-05-13

Applicant: Hisashi KATO

Inventor： Hisashi KATO

IPC: H05K1/00

CPC classification number: H05K1/113 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/3489 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/0939 ,  H05K2201/0969 ,  H05K2203/041 ,  H05K2203/0557

Abstract: A printed wiring board including an insulation layer, a conductive circuit on the insulation layer, an outermost interlayer resin insulation layer formed on the insulation layer and the conductive circuit and having a via-conductor opening connected to the conductive circuit, a land structure including a first land formed on the outermost interlayer resin insulation layer around the via-conductor opening and a second land formed on the outermost interlayer resin insulation layer around the first land, and a via conductor formed in the via-conductor opening through the outermost interlayer resin insulation layer such that the first land of the land structure on the outermost interlayer resin insulation layer is connected to the conductive circuit on the insulation layer. The land structure has a space between the first land and second land of the land structure, and the first land of the land structure is directly connected to the via conductor.

Abstract translation: 一种印刷线路板，包括绝缘层，绝缘层上的导电电路，形成在绝缘层上的最外层间树脂绝缘层和导电电路，并具有连接到导电电路的通路导体开口， 在通孔导体开口周围的最外层间树脂绝缘层上形成的第一焊盘和形成在第一焊盘周围的最外层间树脂绝缘层上的第二焊盘，以及通过最外层间树脂绝缘体形成在通孔导体开口中的通孔导体 使得最外层间树脂绝缘层上的焊盘结构的第一焊盘与绝缘层上的导电电路连接。 土地结构在土地结构的第一个土地和第二个土地之间有一个空间，土地结构的第一个土地直接连接到通道。

公开(公告)号：US07416106B1

公开(公告)日：2008-08-26

申请号：US10674080

申请日：2003-09-29

Applicant: Stuart D. Downes ,  Jin Liang ,  Larry Norris

Inventor： Stuart D. Downes ,  Jin Liang ,  Larry Norris

IPC: B23K31/02

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  B23K2101/42 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming, for each pad profile, a soldering pad having a set of radii corresponding to the set of rounded corners of that pad profile to create a set of soldering pads for the component mounting location. Each soldering pad is configured for a high bond strength solder joint. The technique further involves removing the mask layer from the circuit board and soldering a component to the component mounting location. This technique is well-suited for robustly mounting the component to the circuit board at solder joints with relatively high solder joint bond strengths.

Abstract translation: 一种用于处理电路板的技术包括将掩模层放置在电路板上，其中掩模层限定用于部件安装位置的一组焊盘轮廓。 每个垫子轮廓都有一组圆角。 该技术还涉及为每个焊盘型材形成具有与该焊盘型材的一组圆角对应的一组半径的焊盘，以形成用于部件安装位置的一组焊盘。 每个焊盘都配置为高粘结强度的焊点。 该技术还包括从电路板去除掩模层并将部件焊接到部件安装位置。 这种技术非常适合在具有相对高的焊点接合强度的焊点处牢固地将部件安装到电路板上。

公开(公告)号：US06405920B1

公开(公告)日：2002-06-18

申请号：US09614830

申请日：2000-07-12

Applicant: Bjoern Erik Brunner ,  Vivek Amir Jairazbhoy ,  Richard Keith McMillan

Inventor： Bjoern Erik Brunner ,  Vivek Amir Jairazbhoy ,  Richard Keith McMillan

IPC: B23K3102

CPC classification number: H05K3/3442 ,  H05K1/111 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/10636 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

Abstract translation: 这里公开了一种印刷电路板（PCB），其具有用于套印锡膏和修补焊点的增强安装垫。 PCB包括：电介质基板10，其上具有至少一个安装垫20，其中每个安装垫以与电子部件30的相应端子32相配的关系布置。每个安装垫20包括主体部分24和一个或 更多的手指状的延伸部分26从主体部分向外延伸并且远离电子部件的投影足迹34。

公开(公告)号：US6111204A

公开(公告)日：2000-08-29

申请号：US246864

申请日：1999-02-08

Applicant: Lakhi Nandlal Goenka

Inventor： Lakhi Nandlal Goenka

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K2201/0361 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09736 ,  H05K2201/09772 ,  H05K2201/098 ,  H05K3/062 ,  H05K3/4685 ,  Y02P70/611

Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising: an electrically insulative substrate surface, a plurality of tri-metal-layer bond pads arranged in a generally straight row on the substrate surface wherein the row defines a width direction therealong, and a circuit trace arranged on the substrate surface, wherein the circuit trace runs between two adjacent ones of the plurality of tri-metal-layer bond pads. Each bond pad comprises: (1) a bottom layer attached to the substrate surface, the bottom layer being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer disposed above and generally concentric with the bottom layer, the top layer being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer made of a second metal connecting the bottom layer and the top layer. The bond pads are specially shaped such that W2>W1 for at least the two adjacent bond pads, thus enabling the circuit trace to be spaced closely to the bottom layers of the two adjacent bond pads, while allowing the top layers of the pads to be made much larger so as to avoid delamination thereof from their associated middle layers.

Abstract translation: 专为细间距应用设计的蚀刻三金属层空气桥接电路板，包括：电绝缘基板表面，多个三基金属层接合焊盘，其布置在基板表面上的大致直线上，其中该行 限定其宽度方向和布置在基板表面上的电路迹线，其中电路迹线在多个三金属层接合焊盘中的两个相邻的三个金属层接合焊盘之间延伸。 每个接合焊盘包括：（1）附着到基板表面的底层，底层由第一金属制成，具有沿宽度方向测量的总宽度W1; （2）顶层，其设置在所述底层的上方并且与所述底层大致同心，所述顶层由所述第一金属制成，并且具有沿宽度方向测量的总宽度W2; 和（3）由连接底层和顶层的第二金属制成的中间层。 接合焊盘是特别成形的，使得W2> W1用于至少两个相邻的接合焊盘，从而使得电路迹线能够与两个相邻接合焊盘的底层紧密地间隔开，同时允许焊盘的顶层为 做得更大，以避免与其相关联的中间层分层。

公开(公告)号：US5982626A

公开(公告)日：1999-11-09

申请号：US868256

申请日：1997-06-03

Applicant: Masahiro Kodama

Inventor： Masahiro Kodama

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01R12/61 ,  H05K1/118 ,  H05K3/363 ,  H05K1/0393 ,  H05K1/14 ,  H05K2201/048 ,  H05K2201/091 ,  H05K2201/09181 ,  H05K2201/0939 ,  H05K2203/167

Abstract: A flexible printed circuit board assembly comprising a first flexible printed circuit board and a second flexible printed circuit board, wherein each of the first and second flexible printed circuit boards is provided with a position fixing coupling to determine the position of the second flexible printed circuit board relative to the first flexible printed circuit board.

Abstract translation: 一种柔性印刷电路板组件，包括第一柔性印刷电路板和第二柔性印刷电路板，其中第一和第二柔性印刷电路板中的每一个设置有位置固定联接器，以确定第二柔性印刷电路板的位置 相对于第一柔性印刷电路板。