Abstract:
A depth pixel of a three-dimensional image sensor includes a light detection region, first and second photo gates, and first and second floating diffusion regions. The light detection region collects electric charges based on light reflected by an object. An internal electric field is formed for moving the collected charges in first and second directions. The first photo gate is formed on the upper part of the light detection region, and is activated in response to a first photo control signal. The first floating diffusion region accumulates first electric charges drifted in the first direction if the first photo gate is activated. The second photo gate is formed on the upper part of the photo detection region apart from the first photo gate, and is activated in response to the first photo control signal. The second floating diffusion region accumulates second electric charges drifted in the second direction if the second photo gate is activated.
Abstract:
광감지기와 플로팅 디퓨젼 영역 사이에 전송 게이트가 형성된 픽셀들을 포함하는 이미지 센서를 구동하기 위하여, 광집적 모드의 제 1 구간 동안 상기 전송 게이트에 음의 전압을 인가하고, 상기 광집적 모드의 제 2 구간 동안 상기 전송 게이트에 양의 서브문턱(sub-threshold) 전압을 인가한다. 상기 광집적 모드 후의 독출 모드 동안 상기 전송 게이트에 상기 서브문턱 전압보다 큰 독출 전압을 인가한다. 광집적 모드의 대부분의 시간 동안 전송 게이트에 음의 전압을 인가함으로써 이미지 센서의 노이즈를 감소시키고, 선형 응답과 로그 응답이 병합하여 이미지 센서의 넓은 동적 범위를 구현할 수 있다. 이미지 센서, 선형 응답(linear response), 로그 응답(logarithmic response), 동적 범위(dynamic range), 불루밍 전류(blooming current)
Abstract:
입사광의 이용 효율을 높일 수 있는 이미지 센서가 제공된다. 이미지 센서는 기판, 상기 기판 상의 반사체, 반사체 상의 광전 변환 소자, 및 광전 변환 소자의 하부 영역에 위치하는 정공 유인 영역을 포함한다. 이미지 센서, 광전 변환 소자, 유효 거리, 크로스토크
Abstract:
PURPOSE: An image sensor for stabilizing a black level is provided to prevent leakage light and diffusion carriers from an active region from arriving at pixels which are configured to measure black levels, thereby providing stabilized black levels. CONSTITUTION: First pixels(102) are formed in an active region on a semiconductor substrate(100) to measure photo-charges corresponding to incident light. Second pixels(104) are formed in an optical-black region on the semiconductor substrate to measure black levels. A deep trench(150) is formed vertically, the depth of which is greater than the depth of the photoelectric conversion unit, in a boundary region which is adjacent to the active region of the optical-black region, in order to block leakage light and diffusion carriers from the active region.
Abstract:
PURPOSE: A CMOS image sensor is provided to improve sensitivity by increasing a transducer gain. CONSTITUTION: A photodiode outputs an optical charge by converting a received optical signal. A sensing node(17) senses the optical charge. A driving circuit converts the optical charge into an electric signal. The driving circuit includes one or more conductive contacts adjacent to the sensing node. An output line(18) is connected with the driving circuit to output the electric signal.
Abstract:
PURPOSE: A unit image sensor for compensating for leaked light, an image sensor array made of the unit image sensor, and a method for compensating for leaked light of the image sensor array are provided to compensate for leaked light currents remaining a storage diode configuring a normal image sensor array. CONSTITUTION: A unit image sensor receives light(LIGHT) from a backside area(DEEP PD1,DEEP PD2). Charges generated in the backside area are transferred to the storage diode through several processes. A global shutter step transfers signals which are optically converted from all photo diodes into a floating diffusion area. An electrical signal corresponding to charges transferred to the floating diffusion area is outputted by a line unit.
Abstract:
PURPOSE: An image sensor and a manufacturing method thereof are provided to obtain high performance and reduce the height of a structure by using a copper wire with low resistance. CONSTITUTION: A driving device is arranged on a first substrate. A first silicon oxide layer is formed on the first substrate and covers the driving device. A photoelectric conversion device is arranged on a second substrate(200a). A second silicon oxide layer covers the photoelectric conversion device and the surface of the second silicon oxide layer is bonded with the upper side of the first silicon oxide layer. A connection unit passes through the second substrate, the second silicon oxide layer, and the silicon oxide layer. An anti-reflection layer(238) is formed on the second surface of the second substrate.
Abstract:
PURPOSE: A unit pixel and CMOS image sensor having the same is provided to suppress optical crosstalk by assembling unit pixels, color filters, and micro lenses together to improve a plain light property. CONSTITUTION: A photo diode changes an incident light into electric charge. If the electric charge is accumulated, a plurality of transistors generates an electric signal corresponding to the accumulated electric charge. The photo diode is inclined in a semiconductor substrate(120a) based on the incident angle of an incident light. The photo diode comprises a plurality of doped regions(131a, 132a, 133a) Doped regions are laminated in inclination direction based on the incident angle.
Abstract:
PURPOSE: A back-side illumination image sensor is provided to offer clear images by controlling a dark current generated in the silicon surface of the upper part of a photo diode. CONSTITUTION: A plurality of P-type wells(15) are formed between a plurality of photo diodes(16). A first P-type layer(14) is formed on a plurality of photo diodes and a plurality of P-type wells. An N-type layer(13) is formed on the first P-type layer. A second P-type layer(17) is formed under a plurality of photo diodes and a plurality of P-type wells. The second P-type layer has higher concentration than the concentration of the first P-type layer.