公开(公告)号：EP0855090B1

公开(公告)日：2003-01-02

申请号：EP97922877.2

申请日：1997-04-26

Applicant: ROBERT BOSCH GMBH

Inventor： NAPIERALA, Dieter

IPC: H01L25/16 ,  H01L23/538

CPC classification number: H05K1/141 ,  H01L23/5385 ,  H01L24/73 ,  H01L25/162 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/045 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A multichip module with a substrate which is equipped on its component side with an IC component and other electronic components interconnected by electroconducting lines. Electric leadthroughs extend from the component side to the bottom side of the substrate and are connected to solder contacts arranged on the bottom side of the substrate to electrically connect the multichip module to a subassembly support. In order to reduce the density of printed circuits on the top side of the multichip module and to reduce the number of required substrate layers, a support is arranged between each IC component and the substrate and comprises printed circuits and components connected by means of first connecting surfaces to the corresponding IC component and by means of second connecting surfaces to connections on the substrate.

公开(公告)号：EP1043920A2

公开(公告)日：2000-10-11

申请号：EP00302525.1

申请日：2000-03-28

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Heinrich, Randy Thomas ,  Rozman, Allen Frank ,  Truong, Thang D. ,  Woods, William Lonzo, Jr.

IPC: H05K3/34 ,  H05K1/16

CPC classification number: H05K1/165 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10234 ,  H05K2201/10257 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49126

Abstract: A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.

Abstract translation: 一种可表面安装的电源及其制造方法。 在一个实施例中，电源包括：（1）具有相对的上和下导电层（2）的衬底，下电气部件具有安装在下导电层上的第一焊盘上的第一引线，并受到能够分离 当电源通过回流焊接工艺时，从基板上降低电气部件，（3）上部电气部件，其具有安装在上部导电层上的第二焊盘上的第二引线，（4）位于第一引线附近的焊料， 所述较低的电气部件具有足够低的重量，使得当电源通过回流焊接工艺时，焊料的液态的表面张力足以保持较低的电气部件与下导电层接触;（5） 安装在基板上的平面磁性装置，所述平面磁性装置具有由上和下导电层上的一部分导电迹线形成的绕组 以及通过所述衬底的孔并且靠近所述绕组设置的芯体，以及（6）衬底间导电安装件，其耦合到所述下导电层，所述衬底的导电层由熔点高于焊料回流温度的材料组成，并且适于安装所述功率 供应到相邻基板并在其间提供导电路径，导电安装座分别包括在基板和相邻基板的界面处的第一和第二柔性焊接点。

公开(公告)号：EP0642166A3

公开(公告)日：1995-04-05

申请号：EP94113641.8

申请日：1994-08-31

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Kalivas, Vassilios ,  Nitsch, Alois ,  Peters, Heinz

IPC: H01L25/16 ,  H05K1/18

CPC classification number: H01L25/165 ,  H01L23/24 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/0317 ,  H05K2201/045 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Das Keramik-Substrat (13) ist auf einer ersten Seite einer zum Modul gehörenden, Schaltungsstrukturen aufweisenden Leiterplatte (12) mittels eines flexiblen Klebers (2) befestigt und mittels Bondverbindungen (11) an die Schaltungsstrukturen kontaktiert, und die Anschlußelemente sind durch auf der Rückseite der Leiterplatte (12) angebrachte, annähernd kugelförmige Lotballungen (10) gebildet, die über Durchkontaktierungen mit den Schaltungsstrukturen auf der ersten Seite der Leiterplatte (12) verbunden sind.

Abstract translation: 陶瓷基板（13）安装在所述模块的通过柔性粘合剂（2）的装置属于，电路结构包括电路板（12）第一侧和接触通过在所述电路图案接合连接（11）的装置，并且所述连接元件被携带于背部 安装的电路板（12）近似球形形成，其通过过孔与印刷电路板（12）的第一侧上的电路结构连接。

公开(公告)号：EP0446367A4

公开(公告)日：1992-06-17

申请号：EP90913886

申请日：1990-09-21

Applicant: FANUC LTD.

Inventor： IMAZEKI, RYOJI ,  KURAKAKE, MITSUO ,  YONEKURA, MIKIO, C/O FANUC MANSION HARIMOMI 7-303

IPC: G05B11/01 ,  G05B15/02 ,  G05B19/048 ,  G05B19/05 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/14

CPC classification number: H05K7/1467 ,  G05B15/02 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10189

Abstract: A control device such as a numerical controller constituted of a plurality of printed boards on which are mounted various circuit components. Input/output interface connectors (9) are mounted on the printed board (1) in a manner that the lengthwise directions thereof are oriented in the vertical direction relative to the mounting surface of the printed board. Module boards (10) are mounted in the vertical direction relative to the mounting surface of the printed board (1). The module boards (10) have a height nearly equal to the height of the interface connectors (9). This makes it possible to increase the number of circuit components that can be mounted in a unit space, and to decrease the outer size of the whole control device.

公开(公告)号：EP0337686A2

公开(公告)日：1989-10-18

申请号：EP89303483.5

申请日：1989-04-10

Applicant: HITACHI, LTD.

Inventor： Ogihara, Satoru ,  Numata, Shunichi ,  Miyazaki, Kunio ,  Yokoyama, Takashi ,  Takahashi, Ken ,  Soga, Tasao ,  Yamada, Kazuji ,  Shinohara, Hiroichi ,  Suzuki, Hideo

IPC: H01L23/52 ,  H01L23/50 ,  H01L23/64

CPC classification number: H01L23/642 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10318 ,  H05K2201/10704

Abstract: A semiconductor chip module has semiconductor chips (12) each having contacts on its entire front face, and a multi-layered organic circuit board (15) having a small dielectric constant intermediate ceramic substrates (11) having the same thermal expansion coefficient as that of the semiconductor chip (12), each having contacts on its front and back faces corresponding to those of the semiconductor chip (12) and being electrically connected directly in a one to one relationship. The contacts on the semiconductor chip (12) and the corresponding contacts on the substrates (11) are connected by a solder, the contacts on the other of the substrate (11) and the corresponding contacts on the multi-layered ceramic circuit board (15) are connected by respective conductive pins (14) having a predetermined flexibility and rigidity through a predetermined gap therebetween. In this way there is the possibility of the relative displacement due to theremal expansion difference between the intermediate ceramic substrate (11) and the multi-layered organic circuit board (15).

Abstract translation: 半导体芯片模块具有在其整个正面上都具有接触的半导体芯片（12）和具有小介电常数的陶瓷衬底（11）的具有相同热膨胀系数的多层有机电路板（15）具有与 所述半导体芯片（12）在其与所述半导体芯片（12）的前表面和后表面相对应的接触部分以一对一的关系直接电连接。 半导体芯片（12）上的触点和基板（11）上的相应触点通过焊料连接，基板（11）中的另一个上的触点和多层陶瓷电路板（15）上的相应触点 ）通过具有预定的柔性和刚性的相应的导电销（14）通过它们之间的预定间隙连接。 以这种方式，由于中间陶瓷基板（11）和多层有机电路板（15）之间的膨胀差异，存在相对位移的可能性。

公开(公告)号：EP0031240B1

公开(公告)日：1986-04-30

申请号：EP80304552.5

申请日：1980-12-17

Applicant: FUJITSU LIMITED

Inventor： Honda, Norio

IPC: H01L23/52 ,  H01L25/10

CPC classification number: H05K1/141 ,  H01L23/49805 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2225/1005 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0306 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45099

公开(公告)号：EP0031240A3

公开(公告)日：1983-07-06

申请号：EP80304552

申请日：1980-12-17

Applicant: FUJITSU LIMITED

Inventor： Honda, Norio

IPC: H01L23/14 ,  H01L23/54 ,  H01L25/10

CPC classification number: H05K1/141 ,  H01L23/49805 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2225/1005 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0306 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electrical component substantially consists of an assembly of ceramic chip carriers 12 and a mother board 11 wherein the mother board 11 is in effect partitioned into a plurality of portions or sub-sections, and the chip carriers 12 are mounted on the mother board 11 either directly or through unit boards 14, 15 on predetermined portions or sub-sections of the mother board 11. In this assembly, each unit board 14, 15 is fabricated in the same conventional manner as the mother board 11, and several chip carriers 12 may be mounted on one kind of unit board 14, which in turn may be mounted on another unit board 15 of larger size together with other chip carriers 12. One or more than one chip carrier 12 may be mounted directly on the mother board 11, on a unit board 14 of smaller size, or on a unit board 15 of larger size. External conductors may be fabricated on surfaces of these unit boards 14,15 and the mother board 11, and these conductors may be plated using conventional technique.

公开(公告)号：JP5579919B2

公开(公告)日：2014-08-27

申请号：JP2013504052

申请日：2011-04-11

Applicant: アーテー・ウント・エス・オーストリア・テヒノロギー・ウント・ジュステームテッヒニク・アクチェンゲゼルシャフトAt & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： シユタール，ヨハンネス ,  ライトゲープ，マルクス

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.

公开(公告)号：JP4416373B2

公开(公告)日：2010-02-17

申请号：JP2002064250

申请日：2002-03-08

Applicant: 株式会社日立製作所

Inventor： 英恵 下川 ,  哲也 中塚 ,  浩一 中嶋 ,  太佐男 曽我 ,  幹夫 根岸 ,  恒雄 遠藤

IPC: B23K1/00 ,  H05K3/34 ,  B23K3/06 ,  B23K35/02 ,  B23K35/26 ,  B23K101/42 ,  C22C5/02 ,  C22C13/00 ,  H01L23/14 ,  H05K1/14

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/262 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/045 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05669

Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

公开(公告)号：JP2009064248A

公开(公告)日：2009-03-26

申请号：JP2007231631

申请日：2007-09-06

Applicant: Toshiba Corp ,  株式会社東芝

Inventor： TAKAKUSAKI MASAHIKO ,  ENOMOTO MINORU

IPC: G06F1/18 ,  G06F1/16 ,  G06F1/20 ,  H05K7/20

CPC classification number: H05K1/141 ,  G06F1/1616 ,  G06F1/1658 ,  G06F1/185 ,  G06F1/203 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/09954 ,  H05K2201/10189

Abstract: PROBLEM TO BE SOLVED: To provide electronic equipment capable of easily changing design. SOLUTION: The electronic equipment 1 includes: a casing 4; a mother board 21 stored in the casing 4; the first daughter board 22; the second daughter board 23; a host controller 26 mounted on the mother board 21; a bridge controller 41 mounted on the first daughter board 22, and connected electrically to the host controller 26; the first chip 42 mounted on the first daughter board 22, and connected electrically to the bridge controller 41; and the second chip 48 mounted on the second daughter board 23, and connected electrically to the bridge controller 41. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供能够容易地改变设计的电子设备。 电解设备1包括：壳体4; 存储在壳体4中的母板21; 第一个女儿板22; 第二个子板23; 安装在母板21上的主机控制器26; 安装在第一子板22上并与主机控制器26电连接的桥式控制器41; 安装在第一子板22上并与电桥控制器41电连接的第一芯片42; 和安装在第二子板23上的第二芯片48，并且电连接到桥接控制器41.版权所有（C）2009，JPO＆INPIT