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    METHOD FOR MAKING ELECTRONIC MODULES WITH BALL CONNECTOR OR WITH INTEGRATED PREFORMS CAPABLE OF BEING SOLDERED ON A PRINTED CIRCUIT AND IMPLEMENTING DEVICE
    174.
    发明申请
    METHOD FOR MAKING ELECTRONIC MODULES WITH BALL CONNECTOR OR WITH INTEGRATED PREFORMS CAPABLE OF BEING SOLDERED ON A PRINTED CIRCUIT AND IMPLEMENTING DEVICE 审中-公开
    用于制造具有球形连接器的电子模块的方法或者可以在印刷电路上焊接的集成预制件和实现装置的方法

    公开(公告)号：WO00047027A1

    公开(公告)日：2000-08-10

    申请号：PCT/FR2000/000018

    申请日：2000-01-06

    IPC: G06K19/077 ,  H05K1/00 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K3/34 ,  H05K1/0284 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/09045 ,  H05K2201/10477 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

    Abstract: The invention concerns a method for producing electronic modules with ball connector (7) or integrated preforms capable of being soldered on a printed circuit (3) and a device for implementing said method. The invention concerns a method for producing electronic modules in the form of ball housings combining a ball grid array (7) or geometrically identical preforms for interconnecting or shielding and surface-mounted components (2) on the same surface of a substrate (1), thereby enabling said module to be directly connectable by soldering on a printed circuit (3). The balls (7) and the components (2) are transferred in one single step onto the substrate (1) by means of a gripping device adapted to the topography of the module to be produced.

    Abstract translation: 本发明涉及一种用于制造具有球形连接器（7）或能够焊接在印刷电路（3）上的集成预制件的电子模块的方法和用于实现所述方法的装置。 本发明涉及一种用于制造球形壳体形式的电子模块的方法，其组合球栅阵列（7）或几何相同的预成型件，用于在基板（1）的相同表面上互连或屏蔽和表面安装的部件（2） 从而使得所述模块能够通过在印刷电路（3）上的焊接来直接连接。 球（7）和部件（2）通过适于要生产的模块的形状的夹持装置在一个单一步骤中转移到基板（1）上。

    ELECTRIC COMPONENTS FOR PRINTED BOARDS AND METHOD FOR AUTOMATICALLY INSERTING SAID COMPONENTS IN PRINTED BOARDS
    175.
    发明申请
    ELECTRIC COMPONENTS FOR PRINTED BOARDS AND METHOD FOR AUTOMATICALLY INSERTING SAID COMPONENTS IN PRINTED BOARDS 审中-公开
    机电路板这样的组件自动化装配印制电路板组件及其方法

    公开(公告)号：WO00028627A1

    公开(公告)日：2000-05-18

    申请号：PCT/DE1999/003493

    申请日：1999-11-02

    IPC: H01R9/05 ,  H01R13/646 ,  H05K3/34 ,  H01R12/16

    CPC classification number: H01R24/50 ,  H01R9/0515 ,  H01R12/707 ,  H01R24/38 ,  H01R2103/00 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598

    Abstract: The invention relates to an electric component for printed boards, especially an HF coaxial connector. According to the invention, the housing (1) of the component is fixed on the printed board (7) by way of solder joints between the SMD soldered connections provided on the bottom part (6) of said housing and respective soldered connections on the printed circuit. Said housing (1) has several solderable bolts (11) on its bottom part (6) for additionally fixing the housing to the printed circuit board (7). Said bolts engage with the continuous contacting bolt holes (12) assigned to them on the circuit board (7) and are soldered in said bolts.

    Abstract translation: 电印刷电路板组件，特别是HF同轴插头连接器部分，其特征在于，在所述电路板（7）（6）提供了一种用于SMD焊接端子（1）由在其底部的之间的焊接连接的构件的壳体和该电路基板侧相关联的焊接端子是固定的并且 其中，用于其额外在其下侧（6）多个在其中可焊接螺柱状销（11）在电路板上的电路板（7）安装在壳体（1）（7）与连续接触螺栓孔相关联（12）啮合并在此 焊接。

    INTERMEDIARY ADAPTER-CONNECTOR
    176.
    发明申请
    INTERMEDIARY ADAPTER-CONNECTOR 审中-公开
    中间适配器连接器

    公开(公告)号：WO1991016740A1

    公开(公告)日：1991-10-31

    申请号：PCT/US1991002132

    申请日：1991-04-03

    Applicant: MCKENZIE SOCKET TECHNOLOGY, INC.

    Inventor： MCKENZIE SOCKET TECHNOLOGY, INC. ,  LITWIN, Stanley, M. ,  DAVIS, Jeffrey, L. ,  SCOTT, Michael, S.

    IPC: H01R09/09

    CPC classification number: H05K1/141 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/368 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K2203/082

    Abstract: An adapter is interposed between a device (12) having a pattern of pins projecting therefrom and a PCB (13) having contacts connected to various components. The body (11) of the adapter is made of platable dielectric material and is formed with holes (23) corresponding to the pattern of pins of the device (12) and also along one or more edges with pads (26) corresponding in number to the holes (23). The holes (23) are plated with conductive material which may be used to establish electrical contact with the pins (46); however, preferably clips (37) are installed in each hole and in electrical contact therewith, the clips (37) having converging fingers (39) which frictionally engage the pins (46) and also electrically contact the same. Electrically conductive traces (41) are located on the body (11), each having a first end connected to the plating of a hole (23) and a second end leading to one of the pads (26). The traces (41) may be formed by a plate and etch process similar to that used in PCB fabrication. The pads (26) of the body are plated with a material such as solder and are electrically connected to the second ends of the traces (41) opposite the holes. The pins (46) of the device fit into the holes (23) of the body (11) and the plated pads (26) on the body (11) are soldered to contacts on the PCB (13).

    Abstract translation: 适配器插入在具有从其突出的销的图案的装置（12）和具有连接到各种部件的触点的PCB（13）之间。 适配器的主体（11）由可镀介电材料制成，并且形成有与装置（12）的销的图案对应的孔（23），并且还沿着具有衬垫（26）的一个或多个边缘，数量对应于 孔（23）。 孔（23）镀有可用于与销（46）电接触的导电材料; 然而，优选地，夹子（37）安装在每个孔中并与其电接触，夹子（37）具有会聚指状物（39），其摩擦地接合销（46）并且还与其电接触。 导电迹线（41）位于主体（11）上，每个具有连接到孔（23）的电镀的第一端和通向其中一个焊盘（26）的第二端。 迹线（41）可以通过类似于PCB制造中使用的板和蚀刻工艺来形成。 主体的焊盘（26）镀有诸如焊料的材料，并且电连接到与孔相对的迹线（41）的第二端。 该装置的销（46）装配到主体（11）的孔（23）中，并且主体（11）上的电镀垫（26）被焊接到PCB（13）上的触点。

    INJECTION MOLDED MULTI-LAYER CIRCUIT BOARD AND METHOD OF MAKING SAME
    177.
    发明申请
    INJECTION MOLDED MULTI-LAYER CIRCUIT BOARD AND METHOD OF MAKING SAME 审中-公开
    注射成型多层电路板及其制造方法

    公开(公告)号：WO1986002518A1

    公开(公告)日：1986-04-24

    申请号：PCT/US1985002036

    申请日：1985-10-11

    Applicant: METTLER, Rollin, W., Jr. ,  METTLER, John, H. ,  IMPEY, John

    Inventor： METTLER, Rollin, W., Jr. ,  METTLER, John, H.

    IPC: H05K01/14

    CPC classification number: H05K3/462 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K3/42 ,  H05K3/4623 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49158

    Abstract: A multi-layer circuit board comprised of two or more circuit board substrates (10, 12) shaped by injection molding with mating interconnecting pins (22) and holes (24) and banded together with an electrically insulated adhesive material (28). Circuit leads (14, 16, 18, 20) are provided on both sides of each substrate recessed into channels (85) formed in the surface of the substrate during the molding process. Electrical interconnection of the layers of circuitry occurs where the conductive materials of the circuit leads (14, 16) passes down through component lead holes (26) axially located in the interconnecting pins (22) and around the exterior of the interconnecting pins where contact is made with the conductive material coating on the interior of the interconnecting holes (24). A method of making the multi-layer board includes injection molding the substrates (10, 12) in a suitable shaped mold (74, 76) plating substantially all of the surface of the substrates with the conductive material (82) masking with a plating resist (84), plating again with conductive material (88), removing the plating resist and flash-etching to remove the conductive material (82) initially plated and masked by the plating resist (84) so as to define the circuit leads (14, 16, 18, 20). The preferred method uses a roller to apply the plating resist to some surfaces of the substrates.

    PREPARATION OF ELECTRICAL CIRCUITS BY ADHESIVE TRANSFER
    178.
    发明申请
    PREPARATION OF ELECTRICAL CIRCUITS BY ADHESIVE TRANSFER 审中-公开
    通过粘合剂转移制备电路

    公开(公告)号：WO2017180502A1

    公开(公告)日：2017-10-19

    申请号：PCT/US2017/026776

    申请日：2017-04-10

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： LE, John D. ,  DAVID, Moses M. ,  MCCUTCHEON, Jeffrey W. ,  TRAN, Hung T.

    IPC: H05K3/12 ,  H05K3/14 ,  H05K3/00 ,  H05K3/32

    CPC classification number: H05K3/1275 ,  H05K3/0014 ,  H05K3/146 ,  H05K3/321 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/0528 ,  H05K2203/095

    Abstract: Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.

    Abstract translation: 包括电路的多层制品通过将电路元件粘合剂转移到粘合剂表面来制备。 使用许多不同的方法，所有方法包括在释放衬底上使用简单的电路形成材料层和构造成产生可转移到粘合剂表面的电路元件。 在一些方法中，使用结构化释放基板来选择性地传送电路形成材料，或者从释放基板上的突起或者释放基板上的凹陷处传送电路形成材料。 在其他方法中，使用非结构化释放基材并且压花以形成结构化释放基材或与结构化粘合剂层接触以选择性地传递电路形成材料。

    導電性フィルム、導電性フィルムの製造方法及びタッチパネル
    179.
    发明申请
    導電性フィルム、導電性フィルムの製造方法及びタッチパネル 审中-公开
    导电膜，导电膜制造方法和触控面板

    公开(公告)号：WO2015145850A1

    公开(公告)日：2015-10-01

    申请号：PCT/JP2014/078883

    申请日：2014-10-30

    Applicant: 富士フイルム株式会社

    Inventor： 佐藤　祐

    IPC: G06F3/041 ,  G06F3/044 ,  H01B5/14 ,  H01B13/00 ,  H05K1/09 ,  H05K3/10

    CPC classification number: G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/092 ,  H05K3/0058 ,  H05K3/04 ,  H05K3/1258 ,  H05K2201/0769 ,  H05K2201/09045 ,  H05K2203/0139 ,  H05K2203/124

    Abstract: 　イオンマイグレーションに起因する誤作動を抑制することができ、例えば投影型静電容量方式のタッチパネルに用いて好適な導電性フィルム、導電性フィルムの製造方法及びこの導電性フィルムを用いたタッチパネルを提供することを目的とする。導電性フィルムは、基板表面に樹脂層が積層され、樹脂層の表面に網状の溝部が形成され、この溝部に金属細線が充填されて電極パターンが形成されており、電極パターンの長手方向のイオンマイグレーション性を示す値をＭＬとし、電極パターンの短手方向のイオンマイグレーション性を示す値をＭＳとしたとき、ＭＬとＭＳのうち小さい方の値によって大きい方の値を除したマイグレーション比が１．０～１．４にされている。

    Abstract translation: 本发明的目的是提供：能够抑制由于离子迁移引起的故障的导电膜，其适用于例如投影式电容式触摸面板; 导电膜制造方法; 以及使用导电膜的触摸面板。 公开了一种导电膜，其中树脂层层压在基板表面上，在树脂层的表面上形成网状槽部，并且通过用细金属丝填充槽部而形成电极图案。 当表示电极图案的纵向方向上的离子迁移特性的值表示为ML时，表示电极图案的横向的离子迁移特性的值由MS表示，通过将更大的值 通过ML和MS的较小值将ML和MS设置为1.0-1.4。

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