公开(公告)号：WO99016292A1

公开(公告)日：1999-04-01

申请号：PCT/US1998/001313

申请日：1998-01-23

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/4084 ,  H05K1/0393 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/4092 ,  H05K2201/0379 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2203/0156 ,  H05K2203/0195 ,  H05K2203/063 ,  H05K2203/167

Abstract: An article and process provides accurate alignment and a temporary bond between flexible circuit layers (12) and stiffening members (16) during the lay-up process prior to subsequent lamination steps. Plated metal features (26) located on the flexible circuitry (12) are extruded through holes (30) in an intermediate adhesive layer (14), then compressed against the wall of a hole (32) in the stiffening member (16). The extruded material (26) is plastically deformed and thereby temporarily secures the assembly (10) of flexible circuit (12), adhesive (14) and stiffening member (16) through a friction fit in the hole (32). This temporary bond allows the assembly to be picked up and placed on a lamination plate while retaining alignment of the components.

Abstract translation: 在随后的层压步骤之前的制备过程中，制品和工艺提供了柔性电路层（12）和加强构件（16）之间的精确对准和临时结合。 位于柔性电路（12）上的镀金属特征（26）通过中间粘合剂层（14）中的孔（30）挤出，然后压靠在加强构件（16）中的孔（32）的壁上。 挤出的材料（26）塑性变形，从而通过摩擦配合临时固定柔性电路（12），粘合剂（14）和加强构件（16）的组件（10）。 这种临时粘合允许组装被拾起并放置在层压板上，同时保持部件的对准。

公开(公告)号：WO1996002068A1

公开(公告)日：1996-01-25

申请号：PCT/US1995008182

申请日：1995-06-29

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  SMITH, John, W.

IPC: H01L21/60

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2224/48

Abstract: A microelectronic connection component includes a dielectric sheet (34) having an area array of elongated, strip-like leads (60). Each lead has a terminal end (66) fastened to the sheet and a tip end (68) detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer (86). The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

Abstract translation: 微电子连接部件包括具有细长带状引线（60）的区域阵列的电介质片（34）。 每个引线具有紧固到片材的末端（66）和可从片材上拆卸的尖端（68）。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片（86）。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：WO1994008366A1

公开(公告)日：1994-04-14

申请号：PCT/DE1993000873

申请日：1993-09-16

Applicant: SIEMENS NIXDORF INFORMATIONSSYTEME ... ,  DUBOIS, Dieter ,  WANDINGER, Franz

Inventor： SIEMENS NIXDORF INFORMATIONSSYTEME ...

IPC: H01R23/66

CPC classification number: H05K3/326 ,  H01R12/714 ,  H01R12/778 ,  H01R12/81 ,  H01R24/64 ,  H05K1/182 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: The invention concerns a conduction film (4) lying on a substrate, the conductor tracks in the film being disposed so that they run parallel to each other on to a tab (5). Located in the substrate is a socket (6) which extends downwards at an angle and on whose inclined floor the tab (5) with the exposed top surfaces of the conductor tracks lies. For contacting, a plug with outwards-biased spring contact elements (8) which face the floor of the socket (6) is inserted into the socket (6) in the direction of the open end of the tab and locked in the end position.

公开(公告)号：WO1993009655A1

公开(公告)日：1993-05-13

申请号：PCT/EP1992002507

申请日：1992-11-01

Applicant: HÜLS TROISDORF AKTIENGESELLSCHAFT ,  PHILIPS ELECTRONICS N.V. ,  BRUCKNER, Helmut ,  KÖPNICK, Siegfried ,  UGGOWITZER, Werner

Inventor： HÜLS TROISDORF AKTIENGESELLSCHAFT ,  PHILIPS ELECTRONICS N.V.

IPC: H05K03/46

CPC classification number: H05K3/4652 ,  H05K3/3447 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/091 ,  H05K2203/033 ,  H05K2203/063 ,  Y10T29/49155 ,  Y10T29/49167 ,  Y10T156/1046 ,  Y10T156/1056 ,  Y10T156/109 ,  Y10T156/1093

Abstract: The description relates to a process for manufacturing an at least two-layer printed circuit with a base plate, a first conductor plane with contact areas (pads) and a second conductor plane with connecting areas (solder eyes) in which a conductive film with an adhesive layer is laminated on the base plate with the first conductor plane and the pads, whereby the adhesive layer and the conductive film has holes corresponding to the pads of the first conductor plane. The perforated conductive film with the adhesive layer is pressed on the base plate with the first conductor plane at a pressure of 50 to 150 bar and a temperature of at least 80 °C and thus laminated, whereby the contact areas of the first conductor plane are caused at least partially to bulge through the holes in the adhesive layer towards the surface of the connecting areas of the second conductor plane so that the surfaces of the connecting areas are at a distance from the surface of the connecting areas of the second conductor plane which is shorter than the thickness of the connecting areas. The second conductor plane with the connecting areas (solder eyes) is then produced from the conductive film, whereby the solder eyes of the second conductor plane border the holes in the adhesive layer, whereupon the pads of the first conductor plane can be electrically connected to the corresponding solder eyes in the second conductor plane by soldering or by the application of a conductive paste.

公开(公告)号：WO8803356A3

公开(公告)日：1988-06-02

申请号：PCT/US8702300

申请日：1987-09-09

Applicant: BLACK & DECKER INC

Inventor： WHEELER DALE K

IPC: B21D39/03 ,  B29C65/56 ,  B29C65/60 ,  B29C65/64 ,  B29C69/00 ,  B32B43/00 ,  H01H11/06 ,  H01R9/16 ,  H01R12/04 ,  H01R43/20 ,  H05K1/00 ,  H05K3/04 ,  H05K3/20 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06 ,  H05K7/20

CPC classification number: B29C65/606 ,  B29C65/56 ,  B29C65/567 ,  B29C65/60 ,  B29C66/1122 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8161 ,  B29C66/8322 ,  H01R43/20 ,  H05K1/0284 ,  H05K3/041 ,  H05K3/202 ,  H05K3/306 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/091 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/063 ,  H05K2203/1572 ,  H05K2203/167

Abstract: Method and apparatus (10) for forming power distribution systems or parts thereof during punching operations. A planar member (16) of conductive material is located proximate to a substrate (14) upon which the power distribution system or part thereof is to be formed. A punch (18) is used to form the conductors (12) from the planar member (16) and deposit the conductors (12) on the substrate (14). The action of the punch (18) causes mechanical interference between the conductor (12) and the substrate (14) thereby securing the conductor to the substrate. The power distribution system or part thereof may comprise a terminal assembly, an electric switch, a heat sink of an electronic module, or an electrical circuit board.

公开(公告)号：WO1985002751A1

公开(公告)日：1985-06-20

申请号：PCT/US1984002043

申请日：1984-12-12

Applicant: LASERPATH CORPORATION

Inventor： LASERPATH CORPORATION ,  JOHNSON, Morgan

IPC: H05K01/14

CPC classification number: H05K3/326 ,  H01L23/5382 ,  H01L2924/0002 ,  H05K1/0287 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/4046 ,  H05K3/4611 ,  H05K2201/091 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/175 ,  H01L2924/00

Abstract: Electrical circuitry (32) is comprised of a plurality of layers (30, 100) each layer (30, 100) including one or more electrical pathways (36, 38) each layer (30, 100) also including insulation (34) for insulating at least part of one layer (30) from another layer (100). The pathways (36, 38) comprise repeating patterns (40, 42). Each pathway (36, 38) of each layer (30, 100) can communicate with the pathways (36, 38) of the next adjacent layers (30, 100). Some portions of the patterns (40, 42) which comprise the pathways (36, 38) of each layer (30, 100) can be at least partially aligned with some portion of the patterns (40, 42) of pathways (36, 38) of the other layers (30, 100). Other portions of the pathways (36, 38) of the layers (30, 100) remain unaligned. A pulse laser (134) can be used to sever unaligned portions of the pathways (36, 38) as appropriate to create the desired electrical circuitry (32). Components can be secured to the electrical circuitry as required. Further, such circuitry can be used in the construction of the final metallization layers of chips such as gate arrays.

Abstract translation: 电路（32）由多个层（30,100）组成，每个层（30,100）包括一个或多个电路径（36,38），每个层（30,100）还包括用于绝缘的绝缘体（34） 来自另一层（100）的一层（30）的至少一部分。 路径（36,38）包括重复图案（40,42）。 每个层（30,100）的每个路径（36,38）可以与下一相邻层（30,100）的路径（36,38）连通。 包括每层（30,100）的路径（36,38）的图案（40,42）的一些部分可以至少部分地与路径（36,38）的图案（40,42）的一部分对准 ）的其它层（30,100）。 层（30,100）的路径（36,38）的其他部分保持不对齐。 可以使用脉冲激光器（134）来适当地切断路径（36,38）的未对准部分以产生所需的电路（32）。 组件可根据需要固定在电路上。 此外，这种电路可用于构建诸如门阵列的芯片的最终金属化层。

公开(公告)号：EP3193568A2

公开(公告)日：2017-07-19

申请号：EP17159040.9

申请日：2003-12-10

Applicant: Marquardt GmbH

Inventor： Neitzel, Roland ,  Stegerwald, Gerhard

IPC: H05K3/32 ,  H05K1/11 ,  H01R12/58

CPC classification number: H01R12/585 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: Die Erfindung betrifft eine elektrische Schaltung mit einem Schaltungsträger (3) in der Art einer wenigstens teilweise flexiblen Leiterplatte. Der Schaltungsträger (3) weist elektrische, elektronische o. dgl. Bauteile (2), wie einen Elektromotor (2a), Schalter (2b), Widerstand, Kondensator, Spule, IC, Steckanschluß o. dgl. auf. Weiter besitzt der Schaltungsträger (3) Leiterbahnen zur elektrischen Verbindung der Bauteile (2) sowie Kontaktflächen (5) zur elektrischen Kontaktierung der Bauteile (2). Die Kontaktfläche (5) ist wenigstens teilweise in der Ebene des Schaltungsträgers (3) freigeschnitten, derart dass die Kontaktfläche (5) eine Flexibilität in eine außerhalb der Ebene (6) des Schaltungsträgers (3) verlaufende Richtung aufweist, insbesondere in der Art einer Kontaktzunge. Ein Kontaktelement (8) zur elektrischen Kontaktierung des Bauteils (2) liegt mit einem Anpressdruck derart an der Kontaktfläche (5) an, dass die Kontaktfläche (5) aus der Ebene (6) des Schaltungsträgers (3) ausgelenkt ist.

Abstract translation: 本发明涉及一种具有至少部分柔性的印刷电路板形式的电路载体（3）的电路。 电路载体（3）具有电气，电子元件等。诸如电动机（2a），开关（2b），电阻器，电容器，线圈，IC，插头连接o等的元件（2）。 接下来，电路载体（3）导体轨道用于元件（2）和接触表面（5）的电连接以用于元件（2）的电接触。 接触表面（5）至少部分地在电路载体（3）的平面内自由切割，使得接触表面（5）在延伸到电路载体（3）的平面（6）外部的方向上具有柔性，特别是以接触舌 ， 用于部件（2）的电接触的接触元件（8）以接触压力抵靠接触表面（5），使得接触表面（5）偏离电路载体（3）的平面（6）。

公开(公告)号：EP3041592A1

公开(公告)日：2016-07-13

申请号：EP14841564.9

申请日：2014-09-03

Applicant: Brixo Smart Toys Ltd.

Inventor： ALMOG, Boaz ,  SARAF, Amir

IPC: A63H33/04 ,  H05K3/00

CPC classification number: A63H33/042 ,  A63H33/086 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0999 ,  H05K2201/209

Abstract: The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.

Abstract translation: 本发明涉及一种选择性导电的玩具构建元件，包括：主体，其适于与至少一个其他玩具构建元件主体或相应的底板可释放地接合，所述主体包括至少一个导电部分，所述至少一个导电部分具有适于 以在相邻的玩具构建元件主体的导电部分或接触区域上产生压力，以便确保所述玩具构建元件之间在期望的位置和方向上的电传导。

公开(公告)号：EP1973158B1

公开(公告)日：2016-03-16

申请号：EP07006090.0

申请日：2007-03-23

Applicant: Delphi International Operations Luxembourg S.à r.l.

Inventor： Wirths, Jochen ,  Kortwig, Carsten ,  Stadler, Peter ,  Stier, Martin

IPC: H01L23/498 ,  H01L23/13

CPC classification number: H01L23/4985 ,  H01L23/13 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/189 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/10674 ,  H01L2924/00

公开(公告)号：EP2147245B1

公开(公告)日：2014-12-10

申请号：EP08758081.7

申请日：2008-05-20

Applicant: OSRAM GmbH

Inventor： BERTRAM, Ralph Peter ,  DUSSAULT, David ,  FIEGLER, Matthias ,  STOYAN, Harald

IPC: F21K99/00 ,  G02F1/1335 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  F21S4/00 ,  F21Y101/02

CPC classification number: G02F1/133608 ,  F21K9/00 ,  F21S4/22 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  G02F1/133603 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/091 ,  H05K2201/10106